LDGM2043-H295

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDGM2043/H295 DATA SHEET DOC. NO : REV. DATE : : QW0905-LDGM2043/H295-A01 A 02 - Sep. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 1/6 Package Dimensions 3.0 4.0 4.2 5.2 1.5MAX □0.5 TYP 25.0MIN 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 60° 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 500 -20 ~ +80 -30 ~ +100 mA mA mW UNIT μA V ℃ ℃ Electricity or power surge will the Use of conductive wrist band or anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, aequipment and machinery must be properly glove these All grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Emitted Lens Dominant wave length λD nm Spectral halfwidth △λ nm Luminous Viewing Forward intensity voltage angle @20mA(V) @20mA(mcd) 2 θ 1/2 (deg) Min. Max 522 534 36 Typ. Max. Min. Max 3.5 4.0 2700 7700 54 LDGM2043/H295 InGaN/GaN Green Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 3/6 Brightness Code For Standard LED Lamps Group A26 A27 A28 A29 A30 Luminous Intensity(mcd) at 20 mA Min. 2700 3400 4000 5000 6200 Max. 3400 4000 5000 6200 7700 Color Code Group 1P 1Q 1R 1S Dominant Wave length(nm) at 20 mA Min. 522 525 528 531 Max. 525 528 531 534 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 4/6 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1.1 1.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(°C) 260°C 3sec Max 260° 5°/sec max 120° 2°/sec max Preheat 60 Seconds Max 25° 0° 0 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043/H295 Page 6/6 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec