LDGM2043-W75

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDGM2043-W75 DATA SHEET DOC. NO : REV. DATE : : QW0905- LDGM2043-W75 C 12 - Jun - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 1/6 Package Dimensions 3.0 4.2 Thermo-shrinking tube 5.2 3.0 4.0 11±1.5 1.5MAX 20±5 □0.5 TYP 4.2 5.2 7.0±0.5 2.54TYP + Thermo-shrinking tube 218+5/-0 12±1.5 30±5 Red wire Black wire 28+3/-0 10±5 + - 75±10 2.5±0.5 Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 60° 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 500 -20 ~ +80 -30 ~ +100 mA mA mW UNIT μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Emitted Lens Dominant wave length λD nm Spectral halfwidth △λ nm Forward voltage @2mA(V) Luminous Viewing intensity angle @2mA(mcd) 2θ 1/2 (deg) Min. Max. 522 534 36 Min. Typ. Max. Min. Max. 2.6 3.2 3.9 900 2200 30 LDGM2043-W75 InGaN/GaN Green Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 3/6 Brightness Code For Standard LED Lamps DGM CHIP Group A21 A22 A23 A24 Luminous Intensity(mcd) at 2 mA Min. 900 1100 1500 1800 Max. 1100 1500 1800 2200 Color Code DGM CHIP Group 1P 1Q 1R 1S Dominant Wavelength(nm) at 2 mA Min. 522 525 528 531 Max. 525 528 531 534 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 4/6 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25 ℃ Relative Intensity@20mA Normalize @25 ℃ 1.1 1.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature(℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350¢XC Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120¢XC Max Preheat time: 60seconds Max Ramp-up 2¢XC/sec(max) Ramp-Down:-5¢XC/sec(max) Solder Bath:260¢XC Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(¢XC) 260¢XC3sec Max 260° 5¢X/sec max 120° 2¢X/sec max 0 Preheat 60 Seconds Max 50 100 150 Time(sec) 25° 0° Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM2043-W75 Page 6/6 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec