LDGM3333-TBS-1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LDGM3333/TBS-1 DATA SHEET DOC. NO : REV. DATE : : QW0905- LDGM3333/TBS-1 A 15 - Apr. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 Page 1/6 Package Dimensions P2 ΔH H2 H1 L W0 W1 W3 W2 D P1 F P T LDGM3333 5.0 5.9 7.6 8.6 1.5MAX □0.5 TYP 25.0MIN 1.0MIN 2.54TYP +Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 500 -20 ~ +80 -30 ~ +100 mA mA mW UNIT μA V ℃ ℃ Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Peak Dominant Spectral Forward voltage wave wave halfwidth length length △λ nm @ 20mA(V) λPnm λDnm Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Emitted Lens 525 36 Typ. Max. Min. Typ. 3.5 4.0 7700 21000 12 LDGM3333/TBS-1 InGaN/GaN Green Water Clear 518 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 •Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE ------------------- Page 3/6 Minimum mm inch 0.15 0.09 ------- Maximum mm 4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 inch 0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection D F △H 3.8 2.3 ------- TBS-1 TBS-2 TBS-3 TBS-5 TBS-6 Feed Hole To Bottom Of Component TBS-7 TBS-8 TBS-9 TBS-10 H1 17.5 21.5 25.5 22.5 19.9 24.0 24.5 19.0 18.4 0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width ------------------------------------------------------------- H2 L P P1 P2 T W0 W1 W2 W3 ------- ------- 36 11 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 W0 12.4 4.4 5.1 ------- 0.49 0.17 0.2 ------- 13 5.8 7.7 1.42 9.75 15.5 4.0 19 8.5 14.5 0 17.5 0.33 0.57 0 0.69 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information Specification • Package Dimensions maxmum mm 340 275 60 inch 13.4 10.8 2.4 Description Overall Length Overall Width Overall Thickness Symbol minimum mm inch 13.0 10.4 1.97 L W H 330 265 50 Quantity/Box 2000PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 Page 4/6 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 10 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 80 100 1.1 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 ° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( ° C) 260 ° C3sec Max 260 ° 5° /sec max 120 ° 2° /sec max 25 ° 0° 0 Preheat 60 Seconds Max 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM3333/TBS-1 Page 6/6 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2