LDUY13733-S6-LTS

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS Pb Lead-Free Parts LDUY13733/S6-LTS DATA SHEET DOC. NO : REV. DATE : : QW0905- LDUY13733/S6-LTS A 31 - Dec. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDUY13733/S6-LTS Page 1/5 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 60° 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDUY13733/S6-LTS Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol DUY Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 90 120 10 150 -40 ~ +85 -40 ~ +100 mA mA mW UNIT μA V ℃ ℃ Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Emitted Lens Forward Dominant Spectral voltage wave halfwidth length △λnm @ 20mA(V) λDnm Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. 590 15 1.7 2.6 5000 9500 24 LDUY13733/S6-LTS AlGaInP Yellow Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDUY13733/S6-LTS Page 3/5 Typical Electro-Optical Characteristics Curve DUY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Light Output Power vs. Forward Current 140 120 100 80 Forward Current(mA) 120 100 80 60 40 20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 LOP(%) 60 40 20 0.0 0.0 20 40 60 80 100 120 140 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 0 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 1.2 Forward Voltage@20mA Normalize @20℃ -0.05 -0.1 -0.15 -2.0 -0.25 -0.3 20 30 40 50 60 70 80 90 Relative Intensity@20mA Normalize @20℃ 1.0 0.8 0.6 0.4 0.2 0.0 20 30 40 50 60 70 80 90 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 500 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDUY13733/S6-LTS Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( ° C) 260 ° C3sec Max 260° 5° /sec max 120 ° 2° /sec max Preheat 60 Seconds Max 25 ° 0° 0 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDUY13733/S6-LTS Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2