LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-110-9UG/SRF-A-CT
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LG-110-9UG/SRF-A-CT A 26 - May - 2005
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PART NO. LG-110-9UG/SRF-A-CT Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process.
Descriptions:
1. The LG-110-9UG/SRF-A SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use.
Device Selection Guide:
COLOR PART NO MATERIAL AlGaInP AlGaInP Emitted Green Red Lens Water Clear
LG-110-9UG/SRF-A-CT
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Page 2/11
Package Dimensions
Cathode Mark
1 2
1.5 0.5
1.0
Resin
2
1
0.6
0.6
0.8
2
DIE13.2 DIE2 0.6
4 3
0.6
3 4
PCB
0.2
Soldering Terminal
_
1
_
2
SRF
+ 3,4
9UG
Note : 1.All dimension are in millimeter tolerance is ± 0.1mm unless otherwise noted. 2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.0 0.9
1
1.5
5.0
2
1.0
3,4
1.5
1.0
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Page 3/11
Absolute Maximum Ratings at Ta=25 ℃
Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol 9UG PD IFP IF Ir ESD Topr Tstg Tsol 78 60 30 10 2000 -40 ~ +85 -40 ~ +90 Max 260 ℃ for 5 sec Max SRF 72 90 30 10 UNIT mW mA mA
μA V ℃ ℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items Luminous Intensity Symbol
9UG
Min. Typ. 20 20 ------------------1.7 1.5 ------40 50 575 642 574 630 20 20 ------120 120
Max. UNIT ---mcd ---------------------2.6 V nm nm nm
CONDITION IF=20mA
Iv
SRF 9UG
Peak Wavelength
λP
SRF 9UG
IF=20mA
Dominant Wavelength
λD
SRF 9UG
IF=20mA
Spectral Line Half-Width
△λ
SRF 9UG
IF=20mA
Forward Voltage
VF
SRF 9UG SRF
IF=20mA
2.4 ------deg IF=20mA
Viewing Angle
2θ 1/2
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
LLIGITEK ELECTRONICS CO.,LTD. IGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Page 4/11
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
100
2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
10
1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA Normalize @25 ℃
Forward Voltage@20mA Normaliz @25 ℃
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40
1.1 1.0 0.9
0.8 -40 -20 0 20 40 60 80 100
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity @20mA
1.0
0.5
0 500 550 600 650
Wavelength (nm)
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PART NO. LG-110-9UG/SRF-A-CT Page 5/11
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100 10
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25 ℃
Relative Intensity@20mA Normalize @25 ℃
100
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0
0.9
0.8 -40 -20 0 20 40 60 80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
Fig.6 Directive Radiation
Relative Intensity@20mA
0.5
0.0 550 600 650 700
Wavelength (nm)
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PART NO. LG-110-9UG/SRF-A-CT Page 6/11
Carrier Type Dimensions
0.25 1.75 3.5±0.2 3.4 Polarity
4.0±0.2
2.0
1.5
8.0±0.3 5.3
1.25
4.0±0.2
1.87
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No. LG-110-9UG/SRF-A-CT
Description 8.0mm tape,7"reel
Quantity/Reel 3000 devices
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PART NO. LG-110-9UG/SRF-A-CT Page 7/11
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
BIN N : Green Chip Luminous Intensity BIN N : Red Chip Luminous Intensity HUE 8 : Green Chip Dominant Wavelength
LIGITEK ELECTRONICS CO., LTD.
PART NO. : LG-110-9UG/SRF-A-CT LOT NO. : MC9400364 Q'TY(PCS) : 3000 PCS BIN/HUE : N/8-N/31
VF:1.8 - 2.6 VF:1.6 - 2.4
HUE 31 : Red Chip Dominant Wavelength 1.8 - 2.6 : Forward Voltage
Reel Dimensions
2.0±0.5
0.8
0.6
0.4
0.2
178± 1.5
6.0± 1.0
0.4
ψ13.5±1.0
0.2
0.6
0.8
9.0±1.0 12.0±1.0
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Page 8/11
Box Explanation
1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H W
L
3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Recommended Soldering Conditions
1.
Hand Solder Basic spec is ≦ 280℃ 3 sec one time only.
Page 9/11
2. Wave Solder
Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp. (℃) 240
Rising +5℃ /sec Cooling -5 ℃/sec
150 120
Preheat
60 ~ 120 sec
5sec
Time
3-2 PB-Free Reflow Solder
1~5° C/sec 260° C MaX. 10sec.Max
Preheat 180~200 ° C 1~5° C/sec
Above 220 ° C 60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Precautions For Use: Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Page 10/11
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value.
Circuit model A LED
Circuit model B LED
(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LG-110-9UG/SRF-A-CT Reliability Test: Page 11/11
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Reference Standard
MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test Endurance Test Low Temperature Storage Test
1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008 JIS C 7021: B-10
1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature High Humidity Storage Test
1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs
MIL-STD-202F:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4
Solderability Test
1.T.Sol=235 ℃±5 ℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧ 95% of the dipped surface
Environmental Test
Temperature Cycling
1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles
IR Reflow
1.T=260 ° C Max. 10sec.Max. 2. 6 Min
MIL-STD-750D:2031.2 J-STD-020
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