LG-110G-HRF-CT

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-110G/HRF-CT DATA SHEET DOC. NO : REV. DATE : : QW0905-LG-110G/HRF-CT A 19 - Apr - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 1/11 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-110G/HRF SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: COLOR PART NO MATERIAL GaP AlGaInP Emitted Green Red Water Clear Lens LG-110G/HRF-CT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 2/11 Package Dimensions Cathode Mark 0.6 1.5 0.5 1 2 1.0 Resin 2 1 0.6 0.8 4 DIE2 0.6 3.2 DIE1 0.6 3 4 0.4 4 3 Soldering Terminal 0.4 PCB 1,2 HRF 4 3 G Note : 1.All dimension are in millimeter tolerance is ± 0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 0.9 1,2 Cathode 1.5 5.0 4 1.0 3 1.0 1.5 Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 3/11 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol G PD IFP IF Ir ESD Topr Tstg Tsol ----40 ~ +85 -40 ~ +90 Max 260 ℃ for 5 sec Max 65 120 25 10 2000 HRF 72 90 30 UNIT mW mA mA μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Symbol G Min. Typ. 3.2 32 ---10 70 565 642 573 630 30 20 ------120 120 Max. UNIT ---mcd ---------------------2.6 V nm nm nm CONDITION IF=20mA Iv HRF G Peak Wavelength λP G IF=20mA HRF ---- Dominant Wavelength λD G ---- IF=20mA HRF ---- Spectral Line Half-Width △λ ---- HRF ---G IF=20mA Forward Voltage 1.7 VF HRF 1.5 IF=20mA 2.4 ------deg IF=20mA Viewing Angle 2θ 1/2 G ---- HRF ---- Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 4/11 Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 1000 Forward Current(mA) 100 Relative Intensity Normalize @20mA 3.0 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Forward Voltage@20mA Normalize @25 ℃ 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Relative Intensity@20mA Normalize @25 ℃ 1.2 Ambient Temperature(℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 5/11 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.5 Forward Current(mA) 100 Relative Intensity Normalize @20mA 1.0 1.5 2.0 2.5 3.0 3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000 10 1.0 0.1 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ -20 -0 20 40 60 80 100 Forward Voltage@20mA Normalize @25 ℃ 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 6/11 Carrier Tape Dimensions 0.25 1.75 3.5±0.2 3.4 Polarity 4.0±0.2 2.0 1.5 8.0±0.3 5.3 1.25 4.0±0.2 1.87 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. • Packing Specifications Label Aluminum Moist-Proof bag Label Part No. LG-110G/HRF-CT Description 8.0mm tape,7"reel Quantity/Reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 7/11 Label Explanation 立碁電子工業股份有限公司 LIGITEK LED LIGITEK ELECTRONICS CO., LTD. Pb BIN PK : Green Chip Luminous Intensity BIN P : Red Chip Luminous Intensity HUE 9 : Green Chip Dominant Wavelength PART NO. : LG-110G/HRF-CT LOT NO. : MC9400418 Q'TY(PCS) : 3000 PCS VF:1.8 - 2.6 HUE 30 : Red Chip Dominant Wavelength 1.8 - 2.6 : Forward Voltage BIN/HUE : K/9-P/30 VF:1.6 - 2.4 Reel Dimensions 2.0±0.5 0.8 0.6 0.4 0.2 178±1.5 60±1.0 0.4 ψ13.5±1.0 0.2 0.6 0.8 9.0±1.0 12.0± 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Page 8/11 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. Page 9/11 2. Wave Solder Soldering heat Max. 260 ℃ 245± 5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Rising +5℃/sec Cooling -5℃ /sec 150 120 Preheat 60 ~ 120 sec 5sec Time 3-2 PB-Free Reflow Solder 1~5° C/sec 260° C MaX. 10sec.Max Preheat 180~200 ° C 1~5° C/sec Above 220 ° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Page 10/11 Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40 % of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-110G/HRF-CT Reliability Test: Page 11/11 Classification Test Item Test Condition 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reference Standard MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test Endurance Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) J IS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface Environmental Test Temperature Cycling 1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles IR Reflow 1.T=260 ° C Max. 10sec.Max. 2. 6 Min MIL-STD-750D:2031.2 J-STD-020