LG-170DBK-DUV-CT

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-170DBK/DUV-CT DATA SHEET DOC. NO : REV. DATE : QW0905-LG-170DBK/DUV-CT A : 17 - Jul - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 1/11 Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-170DBK/DUV SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO MATERIAL InGaN/GaN InGaN/GaN COLOR Emitted Blue Violet Lens Water Clear LG-170DBK/DUV-CT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 2/11 Package Dimensions 0.8 Cathode Mark 2 1 0.3 Cathode Mark Resin 0.4 2.0 DIE2 DIE1 1.4 Soldering Terminal 0.4 4 3 0.3 1.25 2 1 PCB 0.45 0.45 DUV 4 3 DBK Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 0.7 0.4 0.7 0.8 1.0 0.8 Note Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 3/11 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature Symbol DBK PD IFP IF Ir ESD Topr Tstg Tsol 80 100 20 50 150 -40 ~ +85 -40 ~ +90 Max 260℃ for 5 sec Max DUV 80 100 20 50 150 UNIT mW mA mA μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Symbol DBK Min. Typ. 50 0.5 ------------------------------100 1.0 465 400 470 ---30 20 3.5 3.5 130 130 Max. UNIT ------------------------4.0 4.0 ------V nm nm mcd CONDITION IF=20mA IF=20mA Iv DUV DBK Peak Wavelength λP DUV DBK nm Dominant Wavelength λD DUV DBK DUV DBK IF=20mA Spectral Line Half-Width △λ IF=20mA Forward Voltage VF DUV DBK DUV IF=20mA Viewing Angle 2θ 1/2 deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 4/11 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1 01 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25 ℃ -40 -20 0 20 40 60 80 100 Forward Voltage@20mA Normalize @25 ℃ 1.2 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@20mA 1.0 0.5 0.0 400 450 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 5/11 Typical Electro-Optical Characteristics Curve DUV CHIP Fig.1 Forward current vs. Forward Voltage 3.9 3.8 2.0 3.7 Fig.2 Relative Intensity vsForward Current 2.5 Forward Voltage(V) 3.6 3.5 3.4 3.3 3.2 3.1 20 30 40 50 60 70 80 90 100 Relative Intensity Normalize @20mA 1.5 1.0 0.5 0 20 30 40 50 60 70 80 90 100 Forward Current(mA) Forward Current(mA) Fig.3 Forward Current vs. Wavelength Fig.4 Relative Intensity vs. Wavelength 1.0 420 410 Relative Intensity@20mA 20 40 60 80 100 Wavelength(nm)WLP 400 0.5 390 380 0.0 350 400 450 550 Forward Current(mA) Fig.5 Directive Radiation Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 6/11 Carrier Type Dimensions 4.0±0.2 1.75 1.5 0.25 3.5±0.2 5.3 Polarity 8.0±0.3 2.22 0.87 4.0±0.2 1.36 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. • Packing Specifications Label Aluminum Moist-Proof bag Label Part No. LG-170DBK/DUV-CT Description 8.0mm tape,7"reel Quantity/Reel 4000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 7/11 Label Explanation 立碁電子工業股份有限公司 LIGITEK LED BIN P : Blue Chip Luminous Intensity BIN E : Violet Chip Luminous Intensity HUE 0B : Blue Chip Dominant Wavelength LIGITEK ELECTRONICS CO., LTD. PART NO. : LG-170DBK/DUV-CT LOT NO. : 92000375 Q'TY(PCS) :4000 PCS BIN/HUE : P/0B-E/400 VF:2.8 - 3.6 VF:2.8 - 3.6 HUE 400 : Violet Chip Dominant Wavelength 2.8 - 3.6 : Forward Voltage Reel Dimensions 2.0 ±0.5 0.8 0.6 0.4 0.2 178 ±1.5 60 ±1.0 0.4 ψ13.5 ±1.0 0.2 0.6 0.8 9.0 ±1.0 12.0 ±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Page 8/11 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Recommended Soldering Conditions 1. Page 9/11 Hand Solder Basic spec is ≦ 280 ℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Rising +5℃/sec Cooling -5℃/sec 150 120 Preheat 60 ~ 120 sec 5sec Time 3-2 PB-Free Reflow Solder 1~5° C/sec 260°C MaX. 10sec.Max 1~5° C/sec Preheat 180~200° C Above 220°C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at ＜30℃ and ＜90% relative humidity(RH) (from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Page 10/11 Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40 % of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LG-170DBK/DUV-CT Reliability Test: Page 11/11 Classification Test Item Test Condition 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reference Standard MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test Endurance Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 1.Ta=-40 ℃± 5℃ 2.t=1000 hrs (-24hrs, +72hrs) J IS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65℃± 5℃ 2.RH=90%~95% 3.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃ &-40℃± 5℃ (10min) (10min) 2.total 10 cycles MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧ 95% of the dipped surface Environmental Test Temperature Cycling 1.105 ℃ ~ 25℃ ~ - 55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles IR Reflow 1.T=260° C Max. 10sec.Max. 2. 6 Min MIL-STD-750D:2031.2 J-STD-020