LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PHOTO DIODE SILICON PIN LED LAMPS
Pb
Lead-Free Parts
LPD2040/L3-PF
DATA SHEET
DOC. NO : QW0905-LPD2040/L3-PF REV. DATE : : A 14 - Apr. - 2008
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LPD2040/L3-PF
Package Dimension
Page 1/3
Description
The LPD2040/L3-PF series are silicon planar P/N photodiodes incorporated in plastic package that simultaneously serve as filter and are also Transparent for infrared emission their terminals are soldering tabs arranged in 2.54mm center to center spacing due to their design the diodes can vertically be assembled on pc boards arrays can be realized by multiple arrangement versatile photodetectors are suitable for diodes as well as voltaic cell operation the signal noise ratio is particularly favorable even at low illuminance the P/N photodiode are outstanding for low junction capacitance high cut-off frequency and fast switching times. They are particularly suitable for IR sound transmission and remote control the cathode of LPD2040/L3-PF photodiode is marked by a stamping on the package edge
3.0
4.0
4.2
5.2
□0.5 TYP
25.0MIN
1.0MIN 2.54TYP
NOTE:1.All dimension are In millimeters tolerance Is ±0.25 unless otherwise noted 2.Specifications are subject to change without notice
•MAXIMUN RATINGS (TA=25℃) Characteristic
Reversr Break Down Voltage Power Dissipation Operating Temperature Storage Temperature
Symbol
VBR PD Topr Tstg
Rating
30 150
nit
V mW
-30 ﹣ +60 -40 ﹣ +60
℃ ℃
• ELECTRICAL CHARACTERISTICS AT (TA=℃)
Characteristic
Dark Current Short Circuit Current Open Circuit Voltage Reverse Light Current Total Capacitance Peak Wavelength of Max Sensitivity Rise Time,Fall Time
Symbol
ID Isc Voc Ira CT
Test Condition
VR=10V Ee=0mW/c㎡ VR=5V λP=940nm Ee=0.5mW/c ㎡
Min
- 2.0 _ 2.0 - -
Typ
1.0 3.0 350 3.0 20 940 50
Max
30 - -
Unit
nA uA mV uA
λP=940nm
Ee=0.5mW/c ㎡ VR=5V λP=940nm Ee=0.5mW/c ㎡ VR=3V f=1MHZ Ee=0mW/c ㎡
- - -
pF nm ns
λsmax
tr,tf VR=10V R L=1KΩ
-
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PART NO. LPD2040/L3-PF Page 2/3
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp(° C) 260° C3sec Max
260°
5° /sec max
120°
2° /sec max
25° 0°
0
Preheat
60 Seconds Max
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LPD2040/L3-PF Page 3/3
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
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