LPT2041-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only NPN SILICON PHOTOTRANSISTOR LED LAMPS Pb Lead-Free Parts LPT2041-PF DATA SHEET DOC. NO : REV. DATE : : QW0905- LPT2041-PF A 26 - Mar. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT2041-PF Package Dimension Page 1/3 Features 3.0 4.0 . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter 4.2 5.2 1.5MAX 25.0MIN Description The LPT2041-PF series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and high illumination sensitivity the cases of LPT2041-PF are ncapsulated in dark blue transparent plastic T1 3/4 package individuallt □0.5 TYP 1.0MIN 2.54TYP 1 2 1.EMITTER 2.COLLECTOR Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice •MAXIMUM RATINGS(Ta=25℃) PARAMETER Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Operating Temperature Storage Temperature Lead Soldering Temperature(1.6mm From Body) MAXIMUM RATINGS 100 30 5 -50℃ TO +100℃ -50℃ TO +100℃ 260℃ for 3 seconds UNIT mw V V •ELECTRICAL CHARACTERISTICS(Ta=25℃) PARAMETER Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Saturation Voltage Rise Time Fall Time Collector Dark Current On State Collector Current SYMBOL V(BR)CEO V(BR)ECO VCE(sat) Tr Tf ICEO Ip(on) 1 2 4 8 5 5 100 2 4 8 Min. 30 5 0.4 Typ. Max. UNIT V V V TEST CONDITION Ic=1mA Ee=0mw/c ㎡ IE=100μA Ee=0mw/c ㎡ Ic=0.5mA Ee=20mw/c㎡ VCE =30V IC=800μA,RL=1KΩ VCE =10V Ee=0mw/c ㎡ VCE =5v Ee=1mw/c ㎡ λP=940nm μs μs nA mA mA mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT2041-PF Page 2/3 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 2° /sec max Preheat 25° 0° 0 50 100 150 Time(sec) 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT2041-PF Page 3/3 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2