LPT3323-TRS-1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LPT3323/TRS-1 DATA SHEET DOC. NO : REV. DATE : : QW0905- LPT3323/TRS-1 A 29 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 Package Dimension Page 1/3 5.0 P2 5.9 ΔH 7.6 8.6 H2 H1 L W0 W2 W1 W3 D -+ 1.EMITTER 2.COLLECTOR 12.5MIN 1.0MIN 2.3TYP 12 P1 P F T Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice Features . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter Description The LPT3323/TRS-1 series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and igh illumination sensitivity the cases of LPT3323/TBS-1 are ncapsulated in water clear plastic T1 3/4 package individuallt •MAXIMUM RATINGS(Ta=25℃) PARAMETER Power Dissipation Collector-Emitter Voltage Emitter-Collector Voltage Operating Temperature Storage Temperature Lead Soldering Temperature(1.6mm From Body) MAXIMUM RATINGS 100 30 5 -50℃ TO +100℃ -50℃ TO +100℃ 260℃ for 5 seconds UNIT mw V V •ELECTRICAL CHARACTERISTICS(Ta=25℃) PARAMETER Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Saturation Voltage Rise Time Fall Time Collector Dark Current On State Collector Current SYMBOL V(BR)CEO V(BR)ECO VCE(sat) Tr Tf ICEO Ip(on) 1 2 4 8 5 5 100 2 4 8 Min. 30 5 0.4 Typ. Max. UNIT V V V TEST CONDITION Ic=1mA Ee=0mw/c㎡ IE=100μA Ee=0mw/c㎡ Ic=0.5mA Ee=20mw/c㎡ VCE =30V IC=800μA,RL=1K Ω VCE =10V Ee=0mw/c㎡ VCE =5v Ee=1mw/c㎡ λP=940nm μs μs nA mA mA mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 •Dimensions Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE ------------------- Page 2/3 Minimum mm inch 0.15 0.09 ------- Maximum mm 4.2 3.0 2.0 18.5 inch 0.17 0.12 0.08 0.73 Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection D F △H 3.8 2.3 ------- TRS-1 17.5 0.69 Feed Hole To Bottom Of Component H1 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width ------------------------------------------------------------- H2 L P P1 P2 T W0 W1 W2 W3 ------- ------- 36 11.0 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 W0 12.4 4.4 5.1 ------- 0.49 0.17 0.2 ------- 13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0 8.5 14.5 0 17.5 0.33 0.57 0 0.69 REMARK:TRS=Tape And Reel Straight Leads • Dimensions Symbol Information Specification Description Symbol minimum mm Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness • Package Dimensions maxmum D3 mm 380 102 88.0 38.1 57.2 inch 14.96 4.02 3.46 1.5 2.25 1.97 T1 T2 D MARKING D2 D1 inch 3.08 1.37 1.13 0.54 D D1 D2 D3 T2 T1 78.2 34.9 28.6 13.8 30.0 1.18 1000PCS 50.0 Quantity/Reel LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TRS-1 Page 3/3 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2