LSBK9S53S-TR1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TAPE AND REEL Pb Lead-Free Parts LSBK9S53S/TR1 DATA SHEET DOC. NO REV. DATE : QW0905-LSBK9S53S/TR1 : A : 26 - Sep. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Page 1/7 Package Dimensions 3.0 1.3 1.4 2.0 2.7 1.3 0.7 0.7 Carrier Type Dimensions 4.0 1.75 2.0 4.0 1.5 0.25 3.5 5.3 Polarity 8.0±0.3 3.44 1.53 Note : The tolerances unless mentioned is ± 0.2mm,Angle ± 0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Page 2/7 Reel Dimensions 2.0±0.5 178±1.5 0 .8 0 .6 0 .4 0 .2 6.0± 1.0 0 .4 ψ13.5±1.0 Part No. LSBK9S53S/TR1 Description 8.0mm tape,7"reel 0 .2 0 .6 0 .8 9.0±1.0 12.0±1.0 Quantity/Reel 2000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Page 3/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol SBKS Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 150 -20 ~ +80 -30 ~ +100 mA mA mW UNIT μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Lens Water Clear Forward Dominant Spectral voltage wave halfwidth @20mA(V) length △λ nm λD nm Luminous intensity @ 20mA(mcd) Viewing angle 2θ 1/2 (deg) Emitted LSBK9S53S/TR1 InGaN/SiC Blue Typ. Max. Min. Typ. 475 26 3.5 4.2 80 125 130 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Page 4/7 Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.1 Forward current vs. Forward Voltage 30 25 20 15 10 5 0 1 2 3 4 5 Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) 1.5 Relative Intensity Normalize @20mA 1.25 1.0 0.75 0.5 0.25 0 0 5 10 15 20 25 30 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Current vs. Temperature Fig.4 Relative Intensity vs. Wavelength Forward Current@20mA 30 20 10 0 0 25 50 75 100 Relative Intensity@20mA 40 1.0 0.5 0 380 430 480 530 580 630 680 Ambient Temperature( ℃) Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. Page5/7 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3. LEAD Reflow Solder Temp. (℃) 240 Rising +5℃/sec Cooling -5℃ /sec 150 120 Preheat 60 ~ 120 sec 5sec Time 4. PB-Free Reflow Solder 1~5 ° C/sec 260 ° C MaX. 10sec.Max 1~5 ° C/sec Preheat 180~200 ° C Above 220 ° C 60 sec.Max. 120 sec.Max. Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBK9S53S/TR1 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH