LSEFDGL9553-TR1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts LSEFDGL9553/TR1 DATA SHEET DOC. NO REV DATE : : QW0905-L SEFDGL9553/TR1 B : 11 - Jan. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEFDGL9553/TR1 Page 1/8 Package Dimensions 3.5 3.2 1.85 3.0 0.7±0.05 3 2 4 1 0.7±0.05 2.8 2.2 0.7±0.05 0.7±0.05 0.6 1.85 0.95 1.3 0.8 0.8 SEF 3+ 2DGL -4 +1 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Carrier Type Dimensions 4.0 2.0 1.55 0.23 1.75 5.5 12.0±0.3 9.3 Polarity 4.06 4.0 3.12 2.24 Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFDGL9553/TR1 Page 2/8 Reel Dimensions 16.0±1.0 ψ178±2.0 14.2±1.0 74.0± 1.5 Part No. LSEFDGL9553/TR1 Description 12.0mm tape,7"reel Quantity/Reel 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. : LSEFDGL9553/TR1 Page 3/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol SEF DGL 30 100 120 50 UNIT Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V IF IFP PD Ir 50 90 120 10 mA mA mW μA V ℃ ℃ Electrostatic Discharge Operating Temperature Storage Temperature ESD Topr Tstg 2000 -20 ~ +80 -30 ~ +100 150 Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AlGaInP LSEFDGL9553/TR1 Dominant wave length λDnm Spectral halfwidth △λnm Forward voltage @20mA(V) Viewing angle @20mA(mcd) 2θ 1/2 (deg) Typ. 500 280 120 120 Luminous intensity Lens 605 Water Clear 505 17 32 Min. Typ. Max. Min. 1.7 ----2.6 200 125 Orange InGaN/GaN Green 3.5 4.0 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFDGL9553/TR1 Page4/8 Typical Electro-Optical Characteristics Curve SEF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 0 20 40 60 80 100 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@20mA 1.0 0° -30° 30° 0.5 -60° 60° 0.0 500 550 600 650 100% 75% 50% 25% 0 25% 50% 75% 100% Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEFDGL9553/TR1 Page 5/8 Typical Electro-Optical Characteristics Curve DGL CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 Forward Current(mA) 100 Relative Intensity Normalize @20mA 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 10 1.0 0.1 1.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 1.1 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@20mA 1.0 0° -30° 30° 0.5 -60° 60° 0.0 450 500 550 600 100% 75% 50% 25% 0 25% 50% 75% 100% Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFDGL9553/TR1 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. Page 6/8 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec Preheat 120 ~ 150℃ 120 ~ 180 sec 3-1. LEAD Reflow Solder Temp. (℃) 240 Rising +5℃ /sec Cooling -5 ℃/sec 150 120 Preheat 60 ~ 120 sec 5sec Time 3-2 PB-Free Reflow Solder 1~5 ° C/sec 260 ° C MaX. 10sec.Max 1~5 ° C/sec Preheat 180~200 ° C Above 220 ° C 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSEFDGL9553/TR1 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH