LSGL3333

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LSGL3333 DATA SHEET DOC. NO REV. DATE : QW0905-LSGL3333 :A : 09 - Oct.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL3333 Page 1/5 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX □0.5 TYP 25.0MIN 1.0MIN 2.54TYP +Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 60° 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL3333 Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol SGL Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 500 -20 ~ +80 -30 ~ +100 mA mA mW UNIT μA V ℃ ℃ Electricity or power surge will the Use of anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly glove these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL COLOR Forward Peak Peak Spectral voltage wave wave halfwidth @20mA(V) length length △λnm λPnm λDnm Viewing angle @20mA(mcd) 2θ 1/2 (deg) Luminous intensity Emitted LSGL3333 InGaN/SiC Lens 502 505 30 Typ. Max. Min. Typ. 3.5 4.2 900 1500 16 Green Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL3333 Page 3/5 Typical Electro-Optical Characteristics Curve SGL CHIP Fig.1 Forward current vs. Forward Voltage 25 Fig.2 Relative Intensity vs. Forward Current 1.5 Forward Current(mA) 20 10 15 5 0 1.5 2.0 2.5 3.0 3.5 4.0 Relative Intensity Normalize @20mA 1.0 0.5 0.0 0 5 10 15 20 25 Forward Voltage(V) Fig.3 Forward Current vs. Ambient Temp 40 Forward Current(mA) Fig.4 Relative Intensity vs. Ambient Temp Relative Luminous Intensity(a.u.) 2.0 Forward Current(mA) 30 1.5 20 1.0 10 0.5 0.0 25 30 35 40 45 50 55 60 65 70 0 0 20 40 60 80 100 Ambient Temperature Ta(℃) Ambient Temperature Ta(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 300 400 500 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL3333 Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 2° /sec max Preheat 60 Seconds Max 25° 0° 0 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL3333 Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2