LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
DUAL COLOR LED LAMPS
LSRFVY2092
DATA SHEET
DOC. NO : REV. DATE :
QW0905- LSRFVY2092 B
: 16 - Nov. - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFVY2092 Page 1/5
Package Dimensions
3.0
4.0
4.2
5.2
6.7 ±0.5
VY
SRF
1.5 MAX
□0.5
TYP 18.0MIN
1
2
3
1
2.0MIN
2
3
1.ANODE YELLOW 2.COMMON CATHODE 3.ANODE RED
2.0MIN 2.54TYP 2.54TYP
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0° -30° 30°
-60°
60°
100% 75% 50%
25%
0
25% 50% 75% 100%
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PART NO. LSRFVY2092 Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings Parameter Symbol SRF Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 90 75 10 2000 -40 ~ +85 -40 ~ +100 Max 260 ℃ for 5 sec Max (2mm from body) VY 30 60 75 mA mA mW UNIT
μA V ℃ ℃
Soldering Temperature
Tsol
Electricity or power surge will the Use of anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly glove these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
MATERIAL
COLOR
Dominant wave length λDnm
Spectral halfwidth △λnm
Luminous Forward Viewing intensity voltage angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg)
Emitted AlGaInP
LSRFVY2092
Lens 630
White Diffused
Min. Max. Min. 20 20 1.5 1.7 2.4 2.6 28 28
Typ. 50 50 60 60
Red Yellow
AlGaInP
590
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
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PART NO. LSRFVY2092 Page 3/5
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100 10
Relative Intensity Normalize @20mA
5.0
2.5 2.0 1.5 1.0 0.5 0.0
1.0 0.1 1.0 2.0 3.0 4.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25℃
Relative Intensity@20mA Normalize @25℃
-20 0 20 40 60 80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0
0.9
0.8 -40
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFVY2092 Page 4/5
Typical Electro-Optical Characteristics Curve
VY CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
Forward Current(mA)
3.0
Relative Intensity Normalize @20mA
100
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10 1.0
0.1 1.0 1.5 2.0 2.5 3.0
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25℃
Relative Intensity@20mA Normalize @25℃
-40 -20 0 20 40 60 80 100
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9 0.8
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSRFVY2092 Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
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