LSSD205-69-XX

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT SMD DISPLAY(0.28") Pb Lead-Free Parts LSSD205/69-XX DATA SHEET DOC. NO : REV. DATE : : QW0905-LSSD205/69-XX A 19 - Jun. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 1/9 Package Dimensions 7.5(0.295") 1.27X5=6.35 (0.25") 12 A F B G E D DP C 3.75(0.148") 0.6(0.024") 7 0.98(0.039") 1.0 (0.039") 7.0 (0.28") 10.0 10.8 (0.394") (0.425") 1 6 ψ0.9(0.035") R0.4 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 2.1 8.5 12.7 1.27X6=7.62 Note : The tolerances unless mentioned is ± 0.1mm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 2/9 Internal Circuit Diagram LSSD2059-XX 3,10 AB CD E F G DP 11 12 2 4 5 9 7 1 LSSD2069-XX 3,10 AB CD E F G DP 11 12 2 4 5 9 7 1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 3/9 Electrical Connection PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 LSSD2059-XX Anode DP Anode C Common Cathode Anode D Anode E No Pin Anode G Nc Anode F Common Cathode Anode A Anode B PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 LSSD2069-XX Cathode DP Cathode C Common Anode Cathode D Cathode E No Pin Cathode G Nc Cathode F Common Anode Cathode A Cathode B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 4/9 Absolute Maximum Ratings at Ta=25 ℃ Parameter Power Dissipation Per Chip Peak Forward Current Per Chip Duty 1/10@10KHz Forward Current Per Chip Reverse Current Per Chip @5V Electrostatic Discharge Operating Temperature Storage Temperature Symbol PD IFP IF Ir ESD Topr Tstg Ratings 78 60 30 10 2000 -25 ~ +85 -25 ~ +85 UNIT mW mA mA μA V ℃ ℃ Part Selection And Application Information(Ratings at 25℃) PART NO common cathode or anode Material Emitted CHIP Common Cathode AIGaInP Electrical λD (nm) △λ (nm) Vf(v) IV(mcd) Typ. IV-M Min. Max. Min. LSSD2059-XX Orange Common Anode 605 17 1.7 2.6 4.0 7.2 2:1 LSSD2069-XX Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 5/9 Test Condition For Each Parameter Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Dominant Wavelegth Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Symbol Vf Iv Unit volt mcd nm nm Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V λD △λ Ir IV-M μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page6/9 Typical Electro-Optical Characteristics Curve 9SEF CHIP Fig.1 Forward current vs. Forward Voltage 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 Forward Current(mA) 100 10 1.0 Relative Intensity Normalize @20mA 2.0 3.0 4.0 5.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Voltage@20mA Normalize @25 ℃ Relative Intensity@20mA Normalize @25℃ 80 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 7/9 Carrier Type Dimensions 4.0 2.0±0.2 1.5 1.75 0.3 11.5 24.0±0.3 11.1 12.0 7.8 4.15 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. Package Dimensions 1300PCS / REEL 28.6±0.5 24±0.5 13.5±0.5 99.5±1.5 330±2.0 2.5±0.2 立碁電子工業股份有限公司 LIGITEK ELEC TR ON ICS CO., LTD. PART NO. : L SSD2059-20 LOT NO. : GS 1-96 0028 Q'TY(P CS) : 130 0 PCS BIN/HUE : N LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 8/9 Recommended Soldering Conditions 1.Hand Solder : Soldering Iron:30W Max Temperature 280°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 260 260°C/10 sec Max rise +5° c/sec 220 200 180 Preheat cooling -5° c/sec 25 Time 120 sec Max 10 sec Max Above 220° C 60 sec Max Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/69-XX Page 9/9 Reliability Test: Classification Test Item Test Condition 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test Endurance Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Storage Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs Thermal Shock Test 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 300 cycles Solderability Test 1.T.Sol=235 ℃±5 ℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface Environmental Test Temperature Cycling 1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles IR Reflow 1.T=260 ° C Max. 10sec.Max. 2. 6 Min