LSSD205-6DBK-XX

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT SMD DISPLAY(0.28") Pb Lead-Free Parts LSSD205/6DBK-XX DATA SHEET DOC. NO : REV. DATE : : QW0905-LSSD205/6DBK-XX A 16 - Jun. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 1/9 Package Dimensions 7.5(0.295") 1.27X5=6.35 (0.25") 12 A F B G E D DP C 3.75(0.148") 0.6(0.024") 7 0.98(0.039") 1.0 (0.039") 7.0 (0.28") 10.0 10.8 (0.394") (0.425") 1 6 ψ0.9(0.035") R0.4 Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 2.1 8.5 12.7 1.27X6=7.62 Note : The tolerances unless mentioned is ±0.1mm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 2/9 Internal Circuit Diagram LSSD205DBK-XX 3,10 AB C D E F G DP 11 12 2 4 5 9 7 1 LSSD206DBK-XX 3,10 AB C D E F G DP 11 12 2 4 5 9 7 1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 3/9 Electrical Connection PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 LSSD205DBK-XX Anode DP Anode C Common Cathode Anode D Anode E No Pin Anode G Nc Anode F Common Cathode Anode A Anode B PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 LSSD206DBK-XX Cathode DP Cathode C Common Anode Cathode D Cathode E No Pin Cathode G Nc Cathode F Common Anode Cathode A Cathode B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 4/9 Absolute Maximum Ratings at Ta=25 ℃ Parameter Power Dissipation Per Chip Peak Forward Current Per Chip Duty 1/10@10KHz Forward Current Per Chip Reverse Current Per Chip @5V Electrostatic Discharge Operating Temperature Storage Temperature Symbol PD IFP IF Ir ESD Topr Tstg Ratings 80 100 20 50 500 -25 ~ +85 -25 ~ +85 UNIT mW mA mA μA V ℃ ℃ Part Selection And Application Information(Ratings at 25℃) PART NO common cathode or anode Material Emitted CHIP Common Cathode InGaN/SiC Electrical λD (nm) △λ (nm) Vf(v) IV(mcd) Typ. IV-M Typ. Max. Min. LSSD205DBK-XX Blue Common Anode 470 20 3.5 4.0 8.5 15.25 2:1 LSSD206DBK-XX Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 5/9 Test Condition For Each Parameter Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Dominant Wavelegth Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Symbol Vf Iv Unit volt mcd nm nm Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V λD △λ Ir IV-M μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 6/9 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1 01 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25 ℃ Relative Intensity@20mA Normalize @25 ℃ -40 -20 0 20 40 60 80 100 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 400 450 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 7/9 Carrier Type Dimensions 4.0 2.0±0.2 1.5 1.75 0.3 11.5 24.0±0.3 11.1 12.0 7.8 4.15 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. Package Dimensions 1300PCS / REEL 28.6±0.5 24±0.5 13.5±0.5 99.5±1.5 330±2.0 2.5±0.2 立碁電子工業股份有限公司 LIGITEK ELEC TR ON ICS CO., LTD. PART NO. : L SSD2 05DB K-20 LOT NO. : GS 1-96 0022 Q'TY(P CS) : 130 0 PCS BIN/HUE : S LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 8/9 Recommended Soldering Conditions 1.Hand Solder : Soldering Iron:30W Max Temperature 280° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 260 260° C/10 sec Max rise +5° c/sec 220 200 180 Preheat cooling -5° c/sec 25 Time 120 sec Max 10 sec Max Above 220°C 60 sec Max Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DBK-XX Page 9/9 Reliability Test: Classification Test Item Test Condition 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test Endurance Test Low Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=1000hrs ±2hrs Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 300 cycles Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface Environmental Test Temperature Cycling 1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles IR Reflow 1.T=260 ° C Max. 10sec.Max. 2. 6 Min