LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LUY3333/H0-PF/TBS-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LUY3333/H0-PF/TBS-X A 22 - May - 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X Page 1/6
Package Dimensions
P2
ΔH
H2 H1 L W0 W1 W3 W2
D
-+ P1 F P
T
LUY3333/H0-PF
5.0 5.9
7.6
8.6
1.5MAX
□0.5 TYP
25.0MIN
1.0MIN 2.54TYP
+Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings Parameter Symbol UY Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 50 90 120 10 2000 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
μA V ℃ ℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR PART NO MATERIAL Emitted
LUY3333/H0-PF/TBS-X
Forward Dominant Spectral voltage wave halfwidth @20mA(V) length △λ nm λDnm
Luminous intensity
@20mA(mcd)
Viewing angle 2θ 1/2 (deg)
Lens
Water Clear
Min. Max. Min. Typ. 595 15 1.7 2.6 1100 1800 38
AlGaInP
Yellow
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X •Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Page 3/6
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 36 11
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.87 0.85 0.75 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
△H
3.8 2.3
-------
TBS-1 TBS-2 TBS-3 TBS-5 TBS-6 Feed Hole To Bottom Of Component TBS-7 TBS-8 TBS-9 TBS-10 TBS-11 TBS-12 TBS-13 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 21.0 20.5 18.0 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1
-------------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.83 0.81 0.71
-------
W0 0.49 0.17 0.2
-------
13 5.8 7.7 1.42 9.75 15.5 4.0 19
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
Specification
• Package Dimensions
maxmum mm 340 275 60 inch 13.4 10.8 2.4
Description
Overall Length Overall Width Overall Thickness
Symbol
minimum mm inch 13.0 10.4 1.97
L W H
330 265 50
Quantity/Box
2000PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X Page 4/6
Typical Electro-Optical Characteristics Curve
UY CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.0 3.0
2.5 2.0 1.5 1.0 0.5 0
10
1.0
0.1 1.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA Normalize @25℃
-40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normaliz @25℃
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9
0.8
Ambient Temperature( ℃)
Ambient Temperature( ℃) Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
0°
Relative Intensity @20mA
1.0
-30 °
30 °
-60°
0.5
60°
0 500 550 600 650
100% 75% 50%
25%
0
25% 50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp(° C) 260° C3sec Max
260°
5° /sec max
120°
2° /sec max Preheat 60 Seconds Max
25 ° 0° 0
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LUY3333/H0-PF/TBS-X Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
