LTC1553L
5-Bit Programmable
Synchronous Switching
Regulator Controller for
Pentium® II Processor
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DESCRIPTION
FEATURES
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5-Bit Digitally Programmable 1.8V to 3.5V Fixed
Output Voltage
Provides All Features Required by the Intel
Pentium® II Processor VRM 8.2 DC/DC
Converter Specification
Flags for Power Good, Over-Temperature and
Overvoltage Fault
19A Output Current Capability from a 5V Supply
Dual N-Channel MOSFET Synchronous Driver
Initial Output Accuracy: ±1.5%
Excellent Output Accuracy: ±2% Typ Over Line,
Load and Temperature Variations
High Efficiency: Over 95% Possible
Adjustable Current Limit Without External Sense
Resistors
Fast Transient Response
Available in 2O-Lead SSOP and SW Packages
The LTC®1553L is a high power, high efficiency switching
regulator controller optimized for a 5V input to 1.8V-3.5V
output applications. It features a digitally programmable
output voltage, a precision internal reference and an internal
feedback system that provides output accuracy of ±1.5% at
room temperature and typically ±2% over-temperature, load
current and line voltage shifts. The LTC1553L uses a synchronous switching architecture with two external N-channel
output devices, providing high efficiency and eliminating the
need for a high power, high cost P-channel device. Additionally, it senses the output current across the on-resistance of
the upper N-channel FET, providing an adjustable current
limit without an external low value sense resistor.
The LTC1553L free-runs at 300kHz and can be synchronized
to a faster external clock if desired. It includes all the inputs
and outputs required to implement a power supply conforming to the Intel Pentium® II Processor VRM 8.2 DC/DC
Converter Specification.
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APPLICATIONS
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, LTC and LT are registered trademarks of Linear Technology Corporation.
Pentium is a registered trademark of Intel Corporation.
Power Supply for Pentium II, SPARC, ALPHA and
PA-RISC Microprocessors
High Power 5V to 1.8V-3.5V Regulators
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TYPICAL APPLICATION
PVCC
12V
VIN
5V
+
0.1µF
5.6k
5.6k
10µF
VCC
PWRGD
PENTIUM® II
SYSTEM
+
2.7k
0.1µF
5.6k
IMAX
20Ω
LTC1553L
OUTEN
COMP
C1
150pF
CSS
0.1µF
G2
SS
SGND
GND
LO†
2µH
18A
IFB
VID0 TO VID4
RC
8.2k
CC
0.01µF
Q1*
G1
OT
CIN**
1200µF
×4
PVCC
FAULT
5
+
10µF
SENSE
0.1µF
Q2*
COUT††
330µF
×7
+
*SILICONIX SUD50N03-10
**SANYO 10MV1200GX
† COILTRONICS CTX02-13198 OR
PANASONIC 12TS-2R5SP
†† AVX TPSE337M006R0100
VOUT
1.8V TO
3.5V
14A
1553L F01
Figure 1. 5V to 1.8V-3.5V Supply Application
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LTC1553L
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PACKAGE/ORDER INFORMATION
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(Note 1)
Supply Voltage
VCC ........................................................................ 7V
PVCC ................................................................... 14V
Input Voltage
IFB (Note 2) ............................................ PVCC + 0.3V
IMAX ........................................................ – 0.3V to 9V
All Other Inputs ......................... – 0.3V to VCC + 0.3V
Digital Output Voltage ................................. – 0.3V to 9V
IFB Input Current (Notes 2, 3) .......................... – 100mA
Operating Temperature Range ..................... 0°C to 70°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec.)................. 300°C
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ABSOLUTE MAXIMUM RATINGS
TOP VIEW
G2
1
20 G1
PVCC
2
19 OUTEN
GND
3
18 VID0
SGND
4
17 VID1
VCC
5
16 VID2
SENSE
6
15 VID3
IMAX
7
14 VID4
IFB
8
13 PWRGD
SS
9
12 FAULT
COMP 10
ORDER PART
NUMBER
LTC1553LCG
LTC1553LCSW
11 OT
G PACKAGE
SW PACKAGE
20-LEAD PLASTIC SSOP 20-LEAD PLASTIC SO
TJMAX = 125°C, θJA = 100°C/ W (G)
TJMAX = 125°C, θJA = 100°C/ W (SW)
Consult factory for Industrial and Military grade parts.
ELECTRICAL CHARACTERISTICS
VCC = 5V, PVCC = 12V, TA = 25°C, unless otherwise noted. (Note 3)
SYMBOL
PARAMETER
VCC
Supply Voltage
PVCC
Supply Voltage for G1, G2
VFB
Internal Feedback Voltage
(Note 4)
VOUT
1.8V Initial Output Voltage
2.8V Initial Output Voltage
3.5V Initial Output Voltage
1.8V Initial Output Voltage
2.8V Initial Output Voltage
3.5V Initial Output Voltage
With Respect to Rated Output Voltage (Figure 2)
∆VOUT
Output Load Regulation
Output Line Regulation
IOUT = 0 to 14A (Note 4) (Figure 2)
VIN = 4.75V to 5.25V, IOUT = 0 (Note 4)(Figure 2)
VPWRGD
Positive Power Good Trip Point
Negative Power Good Trip Point
% Above Output Voltage (Figure 2)
% Below Output Voltage (Figure 2)
●
●
5
–5
7
–7
%
%
VFAULT
FAULT Trip Point
% Above Output Voltage (Figure 2)
●
12
15
20
%
ICC
Operating Supply Current
Shutdown Supply Current
OUTEN = VCC = 5V (Note 5)(Figure 3)
OUTEN = 0, VID0 to VID4 Floating (Figure 3)
●
●
800
130
1200
250
µA
µA
IPVCC
Supply Current
PVCC = 12V, OUTEN = VCC (Note 6) (Figure 3)
PVCC = 12V, OUTEN = 0, VID0 to VID4 Floating
fOSC
Internal Oscillator Frequency
(Figure 4)
VSAWL
VCOMP at Minimum Duty Cycle
(Note 4)
1.8
V
VSAWH
VCOMP at Maximum Duty Cycle
(Note 4)
2.8
V
GERR
Error Amplifier Open-Loop DC Gain
(Note 7)
●
40
53
gmERR
Error Amplifier Transconductance
(Note 7)
●
0.9
1.6
BWERR
Error Amplifier –3dB Bandwidth
COMP = Open (Note 4)
2
CONDITIONS
MIN
●
TYP
4.5
MAX
6
13.2
●
1.260
– 27 (– 1.5%)
– 42 (– 1.5%)
– 52 (– 1.5%)
● – 36 (– 2%)
● – 56 (– 2%)
● – 70 (– 2%)
27 (+ 1.5%)
42 (+ 1.5%)
52 (+ 1.5%)
36 (+ 2%)
56 (+ 2%)
70 (+ 2%)
300
400
V
mV
mV
mV
mV
mV
mV
mV
mV
15
1
250
V
V
–5
±1
●
UNITS
mA
µA
350
kHz
dB
2.3
millimho
kHz
LTC1553L
ELECTRICAL CHARACTERISTICS
VCC = 5V, PVCC = 12V, TA = 25°C, unless otherwise noted. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
IIMAX
IMAX Sink Current
VIMAX = VCC
●
150
180
220
µA
ISS
Soft Start Source Current
ISSIL
Maximum Soft Start Sink Current
Under Current Limit
VSS = 0V, VIMAX = 0V, VIFB = VCC
●
– 15
– 11
–8
µA
VSENSE = VOUT, VIMAX = VCC, VIFB = 0V
(Notes 8, 9), VSS = VCC
●
30
60
150
µA
ISSHIL
Soft Start Sink Current Under Hard
Current Limit
VSENSE = 0V, VIMAX = VCC, VIFB = 0V
●
20
45
mA
tSSHIL
Hard Current Limit Hold Time
tPWRGD
Power Good Response Time↑
VSENSE = 0V, VIMAX = 4V, VIFB↓ from 5V (Note 4)
VSENSE↑ from 0V to Rated VOUT
500
µs
●
0.5
1
2
ms
tPWRBAD
Power Good Response Time↓
VSENSE↓ from Rated VOUT to 0V
●
200
500
1000
µs
tFAULT
FAULT Response Time
VSENSE↑ from Rated VOUT to VCC
●
200
500
1000
µs
tOT
OT Response Time
OUTEN↓, VID0 to VID4 = 0 (Note 10) (Figure 3)
●
15
40
60
µs
VOT
Over-Temperature Trip Point
OUTEN↓, VID0 to VID4 = 0 (Note 10) (Figure 3)
●
1.9
2
2.12
V
VOTDD
Over-Temperature Driver Disable
OUTEN↓, VID0 to VID4 = 0 (Note 10) (Figure 3)
●
1.6
1.7
1.8
V
VSHDN
Shutdown
OUTEN↓, VID0 to VID4 = 0 (Note 10) (Figure 3)
●
0.8
V
t r, t f
Driver Rise and Fall Time
(Figure 4)
●
90
150
ns
t NOL
Driver Nonoverlap Time
(Figure 4)
●
30
100
DCMAX
Maximum G1 Duty Cycle
(Figure 4)
●
77
85
VIH
VID0 to VID4 Input High Voltage
●
2
VIL
VID0 to VID4 Input Low Voltage
●
RIN
VID0 to VID4 Internal Pull-Up
Resistance
●
10
ISINK
Digital Output Sink Current
●
10
The ● denotes specifications which apply over the full operating
temperature range.
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: When IFB is taken below GND, it will be clamped by an internal
diode. This pin can handle input currents greater than 100mA below GND
without latchup. In the positive direction, it is not clamped to VCC or PVCC.
Note 3: All currents into device pins are positive; all currents out of the
device pins are negative. All voltages are referenced to ground unless
otherwise specified.
Note 4: This parameter is guaranteed by correlation and is not tested
directly.
Note 5: The LTC1553L goes into the shutdown mode if VID0 to VID4 are
floating. Due to the internal pull-up resistors, there will be an additional
0.25mA/pin if any of the VID0 to VID4 pins are pulled low.
ns
90
%
V
0.8
20
V
kΩ
mA
Note 6: Supply current in normal operation is dominated by the current
needed to charge and discharge the external FET gates. This will vary with
the LTC1553L operating frequency, supply voltage and the external FETs
used.
Note 7: The open-loop DC gain and transconductance from the SENSE pin to
COMP pin will be (GERR)(1.260/3.3) and (gmERR)(1.260/3.3) respectively.
Note 8: The current limiting amplifier can sink but cannot source current.
Under normal (not current limited) operation, the output current will be zero.
Note 9: Under typical soft current limit, the net soft start discharge current
will be 60µA (ISSIL) + [–11µA(ISS)] ≅ 50µA. The soft start sink-to-source
current ratio is designed to be 5.5:1.
Note 10: When VID0 to VID4 are all HIGH, the LTC1553L will be forced to
shut down internally. The OUTEN trip voltages are guaranteed by design for
all other input codes.
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LTC1553L
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TYPICAL PERFORMANCE CHARACTERISTICS
Typical 2.8V VOUT Distribution
TOTAL SAMPLE SIZE = 1500
90
120
A
80
100
80
25°C
100°C
60
60
50
40
40
20
20
10
0
2.785
2.825
2.815
2.795 2.805
OUTPUT VOLTAGE (V)
B
REFER TO TYPICAL APPLICATION
CIRCUIT FIGURE 1
VIN = 5V, PVCC = 12V, VOUT = 2.8V,
COUT = 330µF × 7, LO = 2µH
A: Q1 = 1 × SUD50N03-10
Q2 = 1 × SUD50N03-10
B: Q1 = 2 × SUD50N03-10
Q2 = 1 × SUD50N03-10
NO FAN
Q1 IS MOUNTED ON 1IN2 COPPER AREA
30
0
2.775
REFER TO TYPICAL APPLICATION
2.820 CIRCUIT FIGURE 1
V = 5V, PVCC = 12V, TA = 25°C
2.815 IN
70
EFFICIENCY (%)
NUMBER OF UNITS
Load Regulation
2.825
2.805
2.800
2.795
2.790
2.785
2
4
6
8
10
LOAD CURRENT (A)
12
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
OUTPUT CURRENT (A)
14
1533L G03
Over-Temperature Trip Point
vs Temperature
2.12
2.850
2.10
2.830
2.820
2.810
2.800
2.790
2.780
2.770
2.660
2.750
2.775
4.75
2.740
– 50 – 25
5.05
5.15
4.95
INPUT VOLTAGE (V)
5.25
50
0
75
25
TEMPERATURE (°C)
100
1.78
1.76
1.74
1.72
1.70
1.68
1.66
1.64
1.62
100
125
1553L G07
2.06
2.04
2.02
2.00
1.98
1.96
1.94
1.92
1.90
– 50 – 25
125
50
0
75
25
TEMPERATURE (°C)
2.1
1.9
1.7
1.5
1.3
1.1
0.9
– 50 –25
50
25
75
0
TEMPERATURE (°C)
100
125
1553L G08
125
Error Amplifier Open-Loop
DC Gain vs Temperature
Error Amplifier Transconductance
vs Temperature
2.3
100
1553L G06
ERROR AMPLIFIER OPEN-LOOP DC GAIN (dB)
1.80
ERROR AMPLIFIER TRANSCONDUCTANCE (millimho)
Over-Temperature Driver Disable
vs Temperature
2.08
1553L G05
1553L G04
OVER-TEMPERATURE DRIVER DISABLE (V)
2.780
2.860
2.780
4
2.790
OVER-TEMPERATURE TRIP POINT (V)
2.810
50
25
0
75
TEMPERATURE (°C)
2.795
2.785
2.840
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
REFER TO TYPICAL APPLICATION
CIRCUIT FIGURE 1
OUTPUT = NO LOAD
TA = 25°C
1.60
–50 –25
2.800
Output Temperature Drift
2.825
4.85
2.805
1533L G02
Line Regulation
2.815
2.810
2.775
0
0.3
1553L G01
2.820
OUTPUT VOLTAGE (V)
140
Efficiency vs Load Current
100
60
55
50
45
40
–50
–25
75
0
25
50
TEMPERATURE (°C)
100
125
1553L G09
LTC1553L
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TYPICAL PERFORMANCE CHARACTERISTICS
Oscillator Frequency
vs Temperature
350
220
SOFT START SOURCE CURRENT (µA)
–8
210
330
IMAX SINK CURRENT (µA)
320
310
300
290
280
200
190
180
170
270
160
260
250
–50 –25
50
25
0
75
TEMPERATURE (°C)
100
150
–50
125
75
0
50
25
TEMPERATURE (°C)
–25
1553L G10
VCC OPERATING SUPPLY CURRENT (mA)
90
86
2200pF
3300pF
5500pF
7700pF
84
82
80
78
– 50 – 25
–11
–12
–13
–14
–15
– 50 – 25
125
50
25
75
0
TEMPERATURE (°C)
100
50
25
75
0
TEMPERATURE (°C)
250
1.1
1.0
0.9
0.8
0.7
0.6
50
25
75
0
TEMPERATURE (°C)
1553L G13
100
125
225
200
175
150
125
100
75
50
– 50 – 25
0
50
75
25
TEMPERATURE (°C)
Output Over Current Protection
70
100
125
1553L G15
1553L G14
PVCC Supply Current
vs Gate Capacitance
125
VCC Shutdown Supply Current
vs Temperature
VCC = 5V
fOSC = 300kHz
0.5
– 50 –25
125
100
1553L G12
1.2
OSCILLATOR FREQUENCY = 300kHz
G1, G2 CAPACITANCE = 1100pF
–10
VCC Operating Supply Current
vs Temperature
92
88
–9
1553L G11
Maximum G1 Duty Cycle
vs Temperature
MAXIMUM G1 DUTY CYCLE (%)
100
VCC SHUTDOWN SUPPLY CURRENT (mA)
OSCILLATOR FREQUENCY (kHz)
340
Transient Response
3.0
PVCC = 12V
TA = 25°C
Q1 CASE = 90°C, VOUT = 2.8V
Q1 = 2 × MTD20N03HDL
Q2 = 1 × MTD20N03HDL
RIMAX = 2.7k, RIFB = 20Ω,
SS CAP = 0.01µF
2.5
OUTPUT VOLTAGE (V)
60
PVCC SUPPLY CURRENT (mA)
Soft Start Source Current
vs Temperature
IMAX Sink Current
vs Temperature
50
40
30
20
2.0
50mV/DIV
1.5
5A/DIV
1.0
SHORT-CIRCUIT
CURRENT
0.5
10
0
0
2000
4000
6000
GATE CAPACITANCE (pF)
8000
1553L G16
100µs/DIV
1553L G18
0
0
2
4
6
8 10 12 14
OUTPUT CURRENT (A)
16
18
1553L G17
5
LTC1553L
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PIN FUNCTIONS
G2 (Pin 1): Gate Drive for the Lower N-Channel MOSFET,
Q2. This output will swing from PVCC to GND. It will always
be low when G1 is high or when the output is disabled. To
prevent undershoot during a soft start cycle, G2 is held low
until G1 first goes high.
PVCC (Pin 2): Power Supply for G1 and G2. PVCC must be
connected to a potential of at least VIN + VGS(ON)Q1. If
VIN = 5V, PVCC can be generated using a simple charge
pump connected to the switching node between Q1 and
Q2 (see Figure 7), or it can be connected to an auxiliary 12V
supply if one exists.
GND (Pin 3): Power Ground. GND should be connected to
a low impedance ground plane in close proximity to the
source of Q2.
SGND (Pin 4): Signal Ground. SGND is connected to the
low power internal circuitry and should be connected to
the negative terminal of the output capacitor where it
returns to the ground plane. GND and SGND should be
shorted right at the LTC1553L.
VCC (Pin 5): Power Supply. Power for the internal low
power circuity. VCC should be wired separately from the
drain of Q1 if they share the same supply. A 10µF bypass
capacitor is recommended from this pin to SGND.
SENSE (Pin 6): Output Voltage Pin. Connect to the positive
terminal of the output capacitor. There is an internal 120k
resistor connected from this pin to SGND. SENSE is a very
sensitive pin; for optimum performance, connect an external 0.1µF capacitor from this pin to SGND. By connecting
a small external resistor between the output capacitor and
the SENSE pin, the initial output voltage can be raised
slightly. Since the internal divider has a nominal impedance of 120kΩ, a 1200Ω series resistor will raise the
nominal output voltage by 1%. If an external resistor is
used, the value of the 0.1µF capacitor on the SENSE pin
must be greatly reduced or loop phase margin will suffer.
Set a time constant for the RC combination of approximately 0.1µs. So, for example, with a 1200Ω resistor, set
C = 83pF. Use a standard 100pF capacitor.
6
IMAX (Pin 7): Current Limit Threshold. Current limit is set
by the voltage drop across an external resistor connected
between the drain of Q1 and IMAX. There is a 180µA internal
pull-down at IMAX.
IFB (Pin 8): Current Limit Sense Pin. Connect to the
switching node between the source of Q1 and the drain of
Q2. If IFB drops below IMAX when G1 is on, the LTC1553L
will go into current limit. The current limit circuit can be
disabled by floating IMAX and shorting IFB to VCC through
an external 10k resistor.
SS (Pin 9): Soft Start. Connect to an external capacitor to
implement a soft start function. During moderate overload
conditions, the soft start capacitor will be discharged
slowly in order to reduce the duty cycle. In hard current
limit, the soft start capacitor will be forced low immediately and the LTC1553L will rerun a complete soft start
cycle. CSS must be selected such that during power-up the
current through Q1 will not exceed the current limit value.
COMP (Pin 10): External Compensation. The COMP pin is
connected directly to the output of the error amplifier and
the input of the PWM comparator. An RC + C network is
used at this node to compensate the feedback loop to
provide optimum transient response.
OT (Pin 11): Over-Temperature Fault. OT is an open-drain
output and will be pulled low if OUTEN is less than 2V. If
OUTEN = 0, OT pulls low.
FAULT (Pin 12): Overvoltage Fault. FAULT is an opendrain output. If VOUT reaches 15% above the nominal
output voltage, FAULT will go low and G1 and G2 will be
disabled. Once triggered, the LTC1553L will remain in this
state until the power supply is recycled or the OUTEN pin
is toggled. If OUTEN = 0, FAULT floats or is pulled high by
an external resistor.
PWRGD (Pin 13): Power Good. This is an open-drain
signal to indicate validity of output voltage. A high indicates that the output has settled to within ±5% of the rated
output for more than 1ms. PWRGD will go low if the output
is out of regulation for more than 500µs. If OUTEN = 0,
PWRGD pulls low.
LTC1553L
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PIN FUNCTIONS
OT trips. As OUTEN drops below 1.7V, the drivers are
internally disabled to prevent the MOSFETs from heating
further. If OUTEN is less than 1.2V for longer than 30µs,
the LTC1553L will enter shutdown mode. The internal
oscillator can be synchronized to a faster external clock by
applying the external clocking signal to the OUTEN pin.
VID0, VID1, VID2, VID3, VID4 (Pins 18, 17, 16, 15, 14):
Digital Voltage Select. TTL inputs used to set the regulated
output voltage required by the processor (Table 3). There
is an internal 20kΩ pull-up at each pin. When all five VIDn
pins are high or floating, the chip will shut down.
OUTEN (Pin 19): Output Enable. TTL input which enables
the output voltage. The external MOSFET temperature can
be monitored with an external thermistor as shown in
Figure 11. When the OUTEN input voltage drops below 2V,
G1 (Pin 20): Gate Drive for the Upper N-Channel MOSFET,
Q1. This output will swing from PVCC to GND. It will always
be low when G2 is high or the output is disabled.
W
BLOCK DIAGRAM
+
115% VREF
FC
12 FAULT
11 OT
DELAY
–
13 PWRGD
DISDR
LOGIC
OUTEN 19
SYSTEM
POWER
DOWN
–
2 PVCC
R
PWM
20 G1
S
+
COMP 10
1 G2
ISS
QSS
SS 9
BG
ERR
+
MIN
–
MAX
+
–
–
6 SENSE
+
FB
VREF
VREF – 5%
18 VID0
VREF + 5%
17 VID1
16 VID2
–
8 IFB
+
7 IMAX
15 VID3
CC
IMAX
DAC
+
MHCL
HCL MONO
14 VID4
VREF
0.5VREF /
0.7VREF
LVC
–
1553 BD
7
LTC1553L
TEST CIRCUITS
PVCC
12V
VCC
5V
+
3k
3k
3k
+
+
0.1µF
10µF
100pF
100pF
OUTEN
0.1µF
10µF
VCC
LTC1553L
VID0 TO VID4
COMP
RC
8.2k
CC
0.01µF
C1
150pF
LO†
Q1* 2µH
15A
SS
VOUT
NC
IMAX
OT
VID0 TO VID4
IFB
G1
FAULT
GND
COUT††
330µF
×7
Q2*
G2
SGND
SENSE
0.1µF
CIN**
1200µF
×4
10k
PVCC
PWRGD
100pF
VIN
5V
+
*SILICONIX SUD50N03-10
**SANYO 10MV1200GX
† COILTRONICS CTX02-13198 OR
PANASONIC 12TS-2R5SP
†† AVX TPSE337M006R0100
0.1µF
1553L F02
Figure 2
VCC
VID0 VID1 VID2 VID3 VID4
VCC
+
10k
VCC
VID0 VID1 VID2 VID3 VID4
IFB
OUTEN
NC
FAULT
NC
OT
NC
COMP
PVCC
PVCC
PWRGD
NC
+
G1
NC
IMAX
NC
G2
NC
LTC1553L
SS
10µF
0.1µF
SGND
GND
10µF
0.1µF
SENSE
NC
1553L F03
Figure 3
VCC
5V
PVCC
12V
tr
+
+
10µF
0.1µF
10k
0.1µF
VCC
90%
10µF
50%
PVCC
G1
IFB
tf
10%
G1 RISE/FALL
90%
50%
10%
5000pF
LTC1553L
t NOL
G2
SENSE
SGND
GND
t NOL
G2 RISE/FALL
5000pF
50%
50%
1553L F04
Figure 4
8
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Table 1. OT Logic
Table 3. Rated Output Voltage (cont)
OUTEN (V)
OT*
2
1
0
0
1
0
1
1.80
0
0
1
0
0
1.85
0
0
0
1
1
1.90
0
0
0
1
0
1.95
0
0
0
0
1
2.00
0
0
0
0
0
2.05
1
1
1
1
1
SHDN
1
1
1
1
0
2.1
1
1
1
0
1
2.2
1
1
1
0
0
2.3
1
1
0
1
1
2.4
1
1
0
1
0
2.5
1
1
0
0
1
2.6
1
1
0
0
0
2.7
INPUT PIN
Table 2. PWRGD and FAULT Logic
INPUT
OUTPUT*
OUTEN
VSENSE**
OT
FAULT
PWRGD
0
X
0
1
0
1
< 95%
1
1
0
1
> 95%
< 105%
1
1
1
1
>105%
1
1
0
1
> 115%
1
0
0
Table 3. Rated Output Voltage
INPUT PIN
VID4
VID3
VID2
VID1
VID0
RATED OUTPUT
VOLTAGE (V)
0
1
1
1
1
Disabled † (1.30)
1
0
1
1
1
2.8
0
1
1
1
0
Disabled † (1.35)
1
0
1
1
0
2.9
0
1
0
1
3.0
0
1
1
0
1
Disabled † (1.40)
1
0
1
1
0
0
Disabled † (1.45)
1
0
1
0
0
3.1
0
1
0
1
1
Disabled † (1.50)
1
0
0
1
1
3.2
0
0
1
0
3.3
0
1
0
1
0
Disabled † (1.55)
1
0
1
0
0
1
Disabled † (1.60)
1
0
0
0
1
3.4
0
1
0
0
0
Disabled † (1.65)
1
0
0
0
0
3.5
0
0
1
1
1
Disabled † (1.70)
0
0
1
1
0
Disabled † (1.75)
* With external pull-up resistor
** With respect to the output voltage selected in Table 3 as required by
Intel Specification VRM 8.2
† These code selections are disabled in LTC1553L
X Don’t care
9
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OVERVIEW
The LTC1553L is a voltage feedback, synchronous switching regulator controller (see Block Diagram) designed for
use in high power, low voltage step-down (buck) converters. It is designed to satisfy the requirements of the Intel
Pentium II power supply specification. It includes an
on-chip DAC to control the output voltage, a PWM generator, a precision reference trimmed to ±1%, two high power
MOSFET gate drivers and all the necessary feedback and
control circuitry to form a complete switching regulator
circuit.
Output regulation can be monitored with the PWRGD pin
which in turn monitors the internal MIN and MAX comparators. If the output is ±5% beyond the selected value
for more than 500µs, the PWRGD output will be pulled
low. Once the output has settled within ±5% of the
selected value for more than 1ms, PWRGD will return
high.
THEORY OF OPERATION
Primary Feedback Loop
The LTC1553L includes a current limit sensing circuit that
uses the upper external power MOSFET as a current
sensing element, eliminating the need for an external
sense resistor. Once the current comparator, CC, detects
an overcurrent condition, the duty cycle is reduced by
discharging the soft start capacitor through a voltagecontrolled current source. Under severe overloads or
output short circuit conditions, the chip will be repeatedly
forced into soft start until the short is removed, preventing
the external components from being damaged. Under
output overvoltage conditions, the MOSFET drivers will be
disabled permanently until the chip power supply is
recycled or the OUTEN pin is toggled.
The regulator output voltage at the SENSE pin is divided
down internally by a resistor divider with a total resistance
of approximately 120kΩ. This divided down voltage is
subtracted from a reference voltage supplied by the DAC
output. The resulting error voltage is amplified by the error
amplifier and the output is compared to the oscillator ramp
waveform by the PWM comparator. This PWM signal
controls the external MOSFETs through G1 and G2. The
resulting chopped waveform is filtered by LO and COUT
closing the loop. Loop frequency compensation is achieved
with an external RC + C network at the COMP pin, which is
connected to the output node of the transconductance
amplifier.
OUTEN can optionally be connected to an external negative temperature coefficient (NTC) thermistor placed near
the external MOSFETs or the microprocessor. Three threshold levels are provided internally. When OUTEN drops to
2V, OT will trip, issuing a warning to the external CPU. If
the temperature continues to rise and the OUTEN input
drops to 1.7V, the G1 and G2 pins will be forced low. If
OUTEN is pulled below 1.2V, the LTC1553L will go into
shutdown mode, cutting the supply current to a minimum.
If thermal shutdown is not required, OUTEN can be connected to a conventional TTL enable signal. The freerunning 300kHz PWM frequency can be synchronized to
a faster external clock connected to OUTEN. Adjusting the
oscillator frequency can add flexibility in the external
component selection. See the Clock Synchronization
section.
MIN, MAX Feedback Loops
10
Two additional comparators in the feedback loop provide
high speed fault correction in situations where the ERR
amplifier may not respond quickly enough. MIN compares
the feedback signal FB to a voltage 60mV (5%) below the
internal reference. If FB is lower than the threshold of this
comparator, the MIN comparator overrides the ERR
amplifier and forces the loop to full duty cycle which is set
by the internal oscillator typically to 85%. Similarly, the
MAX comparator forces the output to 0% duty cycle if FB
is more than 5% above the internal reference. To prevent
these two comparators from triggering due to noise, the
MIN and MAX comparators’ response times are deliberately controlled so that they take two to three microseconds to respond. These two comparators help prevent
extreme output perturbations with fast output transients,
while allowing the main feedback loop to be optimally
compensated for stability.
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Soft Start and Current Limit
The LTC1553L includes a soft start circuit which is used
for initial start-up and during current limit operation. The
SS pin requires an external capacitor to GND with the value
determined by the required soft start time. An internal
11µA current source is included to charge the external SS
capacitor. During start-up, the COMP pin is clamped to a
diode drop above the voltage at the SS pin. This prevents
the error amplifier, ERR, from forcing the loop to maximum duty cycle. The LTC1553L will begin to operate at low
duty cycle as the SS pin rises above about 1.2V (VCOMP ≈
1.8V). As SS continues to rise, QSS turns off and the error
amplifier begins to regulate the output. The MIN comparator is disabled when soft start is active to prevent it from
overriding the soft start function.
The LTC1553L includes yet another feedback loop to
control operation in current limit. Just before every falling
edge of G1, the current comparator, CC, samples and
holds the voltage drop measured across the external
MOSFET, Q1, at the IFB pin. CC compares the voltage at IFB
to the voltage at the IMAX pin. As the peak current rises, the
measured voltage across Q1 increases due to the drop
across the RDS(ON) of Q1. When the voltage at IFB drops
below IMAX, indicating that Q1’s drain current has exceeded the maximum level, CC starts to pull current out of
the external soft start capacitor, cutting the duty cycle and
controlling the output current level. The CC comparator
pulls current out of the SS pin in proportion to the voltage
difference between IFB and IMAX. Under minor overload
conditions, the SS pin will fall gradually, creating a time
delay before current limit takes effect. Very short, mild
overloads may not affect the output voltage at all. More
significant overload conditions will allow the SS pin to
reach a steady state, and the output will remain at a
reduced voltage until the overload is removed. Serious
overloads will generate a large overdrive at CC, allowing it
to pull SS down quickly and preventing damage to the
output components.
helps minimize the number of components in the high
current path. Due to switching noise and variation of
RDS(ON), the actual current limit trip point is not highly
accurate. The current limiting circuitry is primarily meant
to prevent damage to the power supply circuitry during
fault conditions. The exact current level where the limiting
circuit begins to take effect will vary from unit to unit as the
RDS(ON) of Q1 varies.
For a given current limit level, the external resistor from
IMAX to VIN can be determined by:
RIMAX =
(ILMAX )(RDS(ON)Q1)
IIMAX
where,
I
ILMAX = ILOAD + RIPPLE
2
ILOAD = Maximum load current
IRIPPLE = Inductor ripple current
=
(VIN − VOUT )(VOUT )
(fOSC )(L O)(VIN)
fOSC = LTC1553L oscillator frequency = 300kHz
LO = Inductor value
RDS(ON)Q1 = Hot on-resistance of Q1 at ILMAX
IIMAX = Internal 180µA sink current at IMAX
VIN
+
LTC1553L
IMAX
+
7
180µA
CC
G1
IFB
–
CIN
RIMAX
Q1
LO
20Ω
8
VOUT
+
G2
Q2
COUT
1553L F05
By using the RDS(ON) of Q1 to measure the output current,
the current limiting circuit eliminates an expensive discrete sense resistor that would otherwise be required. This
Figure 5. Current Limit Setting
11
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Table 4. Recommended Minimum RIMAX Resistor (kΩ) vs Maximum Operating Load Current and External MOSFET Q1
MAXIMUM OPERATING
LOAD CURRENT (A)
SUD50N03-10
SUD50N03-10
(TWO IN PARALLEL)
MTD20N03HDL
MTD20N03HDL
(TWO IN PARALLEL)
12
2.4
1.2
4.3
2.2
14
2.7
1.3
5.1
2.7
16
3.0
1.5
6.2
3.0
18
3.6
1.8
6.8
3.3
20
3.9
2.0
7.5
3.6
OUTEN and Thermistor Input
The LTC1553L includes a low power shutdown mode,
controlled by the logic at the OUTEN pin. A high at OUTEN
allows the part to operate normally. A low level at OUTEN
stops all internal switching, pulls COMP and SS to ground
internally and turns Q1 and Q2 off. OT and PWRGD are
pulled low, and FAULT is left floating. In shutdown, the
LTC1553L quiescent current will drop to about 130µA.
The remaining current is used to keep the thermistor
sensing circuit at OUTEN alive. Note that the leakage
current of the external MOSFETs may add to the total
shutdown current consumed by the circuit, especially at
elevated temperature.
OUTEN is designed with multiple thresholds to allow it to
also be utilized for over-temperature protection. The power
MOSFET operating temperature can be monitored with an
external negative temperature coefficient (NTC) thermistor
mounted next to the external MOSFET which is expected
to run the hottest –– often the high-side device, Q1. Electrically, the thermistor should form a voltage divider with
another resistor, R1, connected to VCC. Their midpoint
should be connected to OUTEN (see Figure 6). As the
temperature increases, the OUTEN pin voltage is reduced.
Under normal operating conditions, the OUTEN pin should
stay above 2V. All circuits will function normally, and the
OT pin will remain in a high state. If the temperature gets
abnormally high, the OUTEN pin voltage will eventually
drop below 2V. OT will switch to a logic low, providing an
over-temperature warning to the system. As OUTEN drops
below 1.7V, the LTC1553L disables both FET drivers. If
OUTEN is less than 1.2V, the LTC1553L will enter shutdown mode. To activate any of these three modes, the
OUTEN voltage must drop below the respective threshold
for longer than 30µs.
12
VIN
VCC
5.6k
PENTIUM II
SYSTEM
OT
G1
Q1
LO
VCC
LTC1553L
VOUT
R1
R2
NTC THERMISTOR
MOUNT IN CLOSE
THERMAL PROXIMITY
TO Q1
+
OUTEN
G2
Q2
COUT
1553L F06
Figure 6. OUTEN Pin as a Thermistor Input
Clock Synchronization
The internal oscillator can be synchronized to an external
clock by applying the external clocking signal to the
OUTEN pin. The synchronizing range extends from the
initial operating frequency up to 500kHz. If the external
frequency is much higher than the natural free-running
frequency, the peak-to-peak sawtooth amplitude within
the LTC1553L will decrease. Since the loop gain is inversely proportional to the amplitude of the sawtooth, the
compensation network may need to be adjusted slightly.
Note that the temperature sensing circuitry does not
operate when external synchronization is used.
MOSFET Gate Drive
Power for the internal MOSFET drivers is supplied by
PVCC. This supply must be above the input supply voltage
by at least one power MOSFET VGS(ON) for efficient
operation. This higher voltage can be supplied with a
separate supply, or it can be generated using a simple
charge pump as shown in Figure 7. The 85% typical
maximum duty cycle ensures sufficient off-time to refresh
the charge pump during each cycle.
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1N5817 VIN
OPTIONAL FOR VIN > 5V
1N5243B
13V
+
2 PVCC
CIN
0.1µF
LTC1553L
G1
20
Q1
LO
VOUT
G2
1
+
Q2
COUT
1553L F07
Figure 7. Doubling Charge Pump
If the OUTEN pin is low, G1 and G2 are both held low to
prevent output voltage undershoot. As VCC and PVCC
power up from a 0V condition, an internal undervoltage
lockup circuit prevents G1 and G2 from going high until
VCC reaches about 3.5V. If VCC powers up while PVCC is at
ground potential, the SS is forced to ground potential
internally. SS clamps the COMP pin low and prevents the
drivers from turning on. On power-up or recovery from
thermal shutdown, the drivers are designed such that G2
is held low until G1 first goes high.
Power MOSFETs
Two N-channel power MOSFETs are required for most
LTC1553L circuits. Logic level MOSFETs should be used
and they should be selected based on on-resistance considerations. RDS(ON) should be chosen based on input and
output voltage, allowable power dissipation and maximum required output current. In a typical LTC1553L buck
converter circuit the average inductor current is equal to
the output load current. This current is always flowing
through either Q1 or Q2 with the power dissipation split up
according to the duty cycle:
( )
V
DC Q1 = OUT
VIN
(
VIN − VOUT
V
DC Q2 = 1 − OUT =
VIN
VIN
( )
VIN)PMAX(Q1)
(
RDS(ON)Q1 =
=
2
2
[DC(Q1)](IMAX) (VOUT)(IMAX)
VIN)PMAX(Q2)
PMAX(Q2)
(
RDS(ON)Q2 =
=
[DC(Q2)](IMAX)2 (VIN − VOUT)(IMAX)2
( )
PMAX Q1
)
The RDS(ON) required for a given conduction loss can now
be calculated by rearranging the relation P = I2R.
PMAX should be calculated based primarily on required
efficiency or allowable thermal dissipation. A typical high
efficiency circuit designed for Pentium II with a 5V input
and a 2.8V, 11.2A output might allow no more than 4%
efficiency loss at full load for each MOSFET. Assuming
roughly 90% efficiency at this current level, this gives a
PMAX value of:
[(2.8)(11.2A/0.9)(0.04)] = 1.39W per FET
and a required RDS(ON) of:
(5V)(1.39W) = 0.019Ω
( )
2
(2.8V)(11.2A)
(5V)(1.39W) = 0.025Ω
RDS(ON)Q2 =
2
(5V − 2.8V)(11.2A)
RDS ON Q1 =
Note also that while the required RDS(ON) values suggest
large MOSFETs, the dissipation numbers are only 1.39W
per device or less––large TO-220 packages and heat sinks
are not necessarily required in high efficiency applications. Siliconix Si4410DY or International Rectifier IRF7413
(both in SO-8) or Siliconix SUD50N03 or Motorola
MTD20N03HDL (both in D PAK) are small footprint surface mount devices with RDS(ON) values below 0.03Ω at 5V
of gate drive that work well in LTC1553L circuits. With
higher output voltages, the RDS(ON) of Q1 may need to be
significantly lower than that for Q2. These conditions can
often be met by paralleling two MOSFETs for Q1 and using
a single device for Q2. Note that using a higher PMAX value
in the RDS(ON) calculations will generally decrease MOSFET
cost and circuit efficiency while increasing MOSFET heat
sink requirements.
13
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Table 5. Recommended MOSFETs for LTC1553L Applications
RDS(ON)
AT 25°C (mΩ)
PARTS
RATED CURRENT (A)
TYPICAL INPUT
CAPACITANCE
CISS (pF)
θJC (°C/W)
TJMAX (°C)
Siliconix SUD50N03-10
TO-252
19
15 at 25°C
10 at 100°C
3200
1.8
175
Siliconix Si4410DY
SO-8
20
10 at 25°C
8 at 75°C
2700
—
150
Motorola MTD20N03HDL
D PAK
35
20 at 25°C
16 at 100°C
880
1.67
150
SGS-Thomson STD20N03L
D PAK
23
20 at 25°C
14 at 100°C
2300
2.5
175
Motorola MTB75N03HDL
DD PAK
7.5
75 at 25°C
59 at 100°C
4025
1.0
150
IRF IRL3103S
DD PAK
14
56 at 25°C
40 at 100°C
1600
1.8
175
IRF IRLZ44
TO-220
28
50 at 25°C
36 at 100°C
3300
1.0
175
Fuji 2SK1388
TO-220
37
35 at 25°C
1750
2.08
150
Note: Please refer to the manufacturer’s data sheet for testing conditions
and detail information.
Inductor Selection
The inductor is often the largest component in the LTC1553L
design and should be chosen carefully. Inductor value and
type should be chosen based on output slew rate requirements, output ripple requirements and expected peak
current. Inductor value is primarily controlled by the
required current slew rate. The maximum rate of rise of
current in the inductor is set by its value, the input-tooutput voltage differential and the maximum duty cycle of
the LTC1553L. In a typical 5V input, 2.8V output application, the maximum current slew rate will be:
DCMAX
(VIN − VOUT) = 1.83
L
L
A
µs
where L is the inductor value in µH. With proper frequency
compensation, the combination of the inductor and output
capacitor will determine the transient recovery time. In
general, a smaller value inductor will improve transient
response at the expense of increased output ripple voltage
and inductor core saturation rating. A 2µH inductor would
have a 0.9A/µs rise time in this application, resulting in a
5.5µs delay in responding to a 5A load current step. During
14
this 5.5µs, the difference between the inductor current and
the output current must be made up by the output capacitor, causing a temporary voltage droop at the output. To
minimize this effect, the inductor value should usually be
in the 1µH to 5µH range for most typical 5V input LTC1553L
circuits. To optimize performance, different combinations
of input and output voltages and expected loads may
require different inductor values.
Once the required value is known, the inductor core type
can be chosen based on peak current and efficiency
requirements. Peak current in the inductor will be equal to
the maximum output load current plus half of the peak-topeak inductor ripple current. Ripple current is set by the
inductor value, the input and output voltage and the
operating frequency. The ripple current is approximately
equal to:
IRIPPLE =
(VIN − VOUT)(VOUT)
(fOSC)(LO)(VIN)
fOSC = LTC1553L oscillator frequency = 300kHz
LO = Inductor value
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Solving this equation with our typical 5V to 2.8V application with a 2µH inductor, we get:
(2.2)(0.56) = 2AP-P
(300kHz)(2µH)
Peak inductor current at 11.2A load:
11.2A +
2A
= 12.2A
2
The ripple current should generally be between 10% and
40% of the output current. The inductor must be able to
withstand this peak current without saturating, and the
copper resistance in the winding should be kept as low as
possible to minimize resistive power loss. Note that in
circuits not employing the current limit function, the
current in the inductor may rise above this maximum
under short circuit or fault conditions; the inductor should
be sized accordingly to withstand this additional current.
Inductors with gradual saturation characteristics are often
the best choice.
Input and Output Capacitors
A typical LTC1553L design puts significant demands on
both the input and the output capacitors. During constant
load operation, a buck converter like the LTC1553L draws
square waves of current from the input supply at the
switching frequency. The peak current value is equal to the
output load current plus 1/2 peak-to-peak ripple current,
and the minimum value is zero. Most of this current is
supplied by the input bypass capacitor. The resulting RMS
current flow in the input capacitor will heat it up, causing
premature capacitor failure in extreme cases. Maximum
RMS current occurs with 50% PWM duty cycle, giving an
RMS current value equal to IOUT /2. A low ESR input
capacitor with an adequate ripple current rating must be
used to ensure reliable operation.
Note that capacitor manufacturers’ ripple current ratings
are often based on only 2000 hours (three months)
lifetime at rated temperature. Further derating of the input
capacitor ripple current beyond the manufacturer’s specification is recommended to extend the useful life of the
circuit. Lower operating temperature will have the largest
effect on capacitor longevity.
The output capacitor in a buck converter sees much less
ripple current under steady-state conditions than the input
capacitor. Peak-to-peak current is equal to that in the
inductor, usually 10% to 40% of the total load current.
Output capacitor duty places a premium not on power
dissipation but on ESR. During an output load transient,
the output capacitor must supply all of the additional load
current demanded by the load until the LTC1553L can
adjust the inductor current to the new value. Output
capacitor ESR results in a step in the output voltage equal
to the ESR value multiplied by the change in load current.
An 11A load step with a 0.05Ω ESR output capacitor will
result in a 550mV output voltage shift; this is 19.6% of the
output voltage for a 2.8V supply! Because of the strong
relationship between output capacitor ESR and output
load transient response, the output capacitor is usually
chosen for ESR, not for capacitance value; a capacitor with
suitable ESR will usually have a larger capacitance value
than is needed for energy storage.
Electrolytic capacitors rated for use in switching power
supplies with specified ripple current ratings and ESR can
be used effectively in LTC1553L applications. OS-CON
electrolytic capacitors from SANYO and other manufacturers give excellent performance and have a very high
performance/size ratio for electrolytic capacitors. Surface
mount applications can use either electrolytic or dry
tantalum capacitors. Tantalum capacitors must be surge
tested and specified for use in switching power supplies.
Low cost, generic tantalums are known to have very short
lives followed by explosive deaths in switching power
supply applications. AVX TPS series surface mount
devices are popular surge tested tantalum capacitors that
work well in LTC1553L applications.
A common way to lower ESR and raise ripple current
capability is to parallel several capacitors. A typical
LTC1553L application might exhibit 5A input ripple current. SANYO OS-CON part number 10SA220M (220µF/
10V) capacitors feature 2.3A allowable ripple current at
85°C; three in parallel at the input (to withstand the input
ripple current) will meet the above requirements. Similarly, AVX TPSE337M006R0100 (330µF/6V) have a rated
maximum ESR of 0.1Ω; seven in parallel will lower the net
output capacitor ESR to 0.014Ω. For low cost application,
SANYO MV-GX series of capacitors can be used with
acceptable performance.
15
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Feedback Loop Compensation
6 SENSE
The LTC1553L voltage feedback loop is compensated at
the COMP pin, attached to the output node of the internal
gm error amplifier. The feedback loop can generally be
compensated properly with an RC + C network from COMP
to GND as shown in Figure 8a.
COMP
10
ERR
+
fLC =
–
Loop stability is affected by the values of the inductor,
output capacitor, output capacitor ESR, error amplifier
transconductance and error amplifier compensation network. The inductor and the output capacitor create a
double pole at the frequency:
LTC1553L
RC
C1
DAC
CC
1553L F08a
1
2π√(LO)(COUT)
Figure 8a. Compensation Pin Hook-Up
The ESR of the output capacitor forms a zero at the
frequency:
1
2π(ESR)(COUT)
fZ
LOOP GAIN
fESR =
The compensation network at the error amplifier output is
to provide enough phase margin at the 0dB crossover
frequency for the overall closed-loop transfer function.
The zero and pole from the compensation network are:
– 20dB/DECADE
fP
1
1
fZ =
and fP =
respectively.
2π(RC)(CC)
2π(RC)(C1)
Figure 8b shows the Bode plot of the overall transfer
function.
The compensation value used in this design is based on
the following criteria: fSW = 12fCO, fZ = fLC and fP = 5fCO. At
the closed-loop frequency fCO, the attenuation due the LC
filter and the input resistor divider is compensated by the
gain of the PWM modulator and the gain of the error
amplifier (gmERR)(RC). Although a mathematical approach
to frequency compensation can be used, the added
complication of input and/or output filters, unknown capacitor ESR, and gross operating point changes with input
voltage, load current variations, all suggest a more practical empirical method. This can be done by injecting a
transient current at the load and using an RC network box
to iterate toward the final compensation values, or by
obtaining the optimum loop response using a network
analyzer to find the actual loop poles and zeros.
16
fSW = LTC1553L SWITCHING
FREQUENCY
fCO = CLOSED-LOOP CROSSOVER
FREQUENCY
fLC
fESR
fCO
FREQUENCY
1553L F08b
Figure 8b. Bode Plot of the LTC1553L Overall Transfer Function
Table 6. Suggested Compensation Network for 5V Input
Application Using Multiple Paralleled 330µF AVX TPS Output
Capacitors
LO (µH)
CO (µF)
RC (kΩ)
CC (µF)
C1 (pF)
1
990
1.8
0.022
680
1
1980
3.6
0.01
330
1
4950
9.1
0.01
120
2.7
990
5.1
0.01
220
2.7
1980
10
0.01
120
2.7
4950
24
0.0047
47
5.6
990
10
0.01
120
5.6
1980
20
0.0047
56
5.6
4950
51
0.0036
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LTC1553L
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APPLICATIONS INFORMATION
Table 6 shows the suggested compensation components
for 5V input applications based on the inductor and output
capacitor values. The values were calculated using multiple paralleled 330µF AVX TPS series surface mount
tantalum capacitors as the output capacitor. The optimum
component values might deviate from the suggested
values slightly because of board layout and operating
condition differences.
An alternate output capacitor is the Sanyo MV-GX series.
Using multiple parallel 1500µF Sanyo MV-GX capacitors
for the output capacitor, Table 7 shows the suggested
compensation component value for a 5V input application
based on the inductor and output capacitor values.
Table 7. Suggested Compensation Network for 5V Input
Application Using Multiple Paralleled 1500µF SANYO MV-GX
Output Capacitors
LO (µH)
CO (µF)
RC (kΩ)
CC (µF)
C1 (pF)
1
4500
4.3
0.022
270
1
6000
5.6
0.0047
220
1
9000
8.2
0.01
150
2.7
4500
11
0.01
100
2.7
6000
15
0.01
82
2.7
9000
22
0.01
56
5.6
4500
24
0.01
56
5.6
6000
30
0.0047
39
5.6
9000
47
0.0047
27
VID0 to VID4, PWRGD and FAULT
The digital inputs (VID0 to VID4) program the internal DAC
which in turn controls the output voltage. These digital
input controls are intended to be static and are not
designed for high speed switching. Forcing VOUT to step
from a high to a low voltage by changing the VIDn pins
quickly can cause FAULT to trip.
Figure 9 shows the relationship between the VOUT voltage,
PWRGD and FAULT. To prevent PWRGD from interrupting
the CPU unnecessarily, the LTC1553L has a built-in tPWRBAD
delay to prevent noise at the SENSE pin from toggling
PWRGD. The internal time delay is designed to take about
500µs for PWRGD to go low and 1ms for it to recover.
Once PWRGD goes low, the internal circuitry watches for
the output voltage to exceed 115% of the rated voltage. If
this happens, FAULT will be triggered. Once FAULT is
triggered, G1 and G2 will be forced low immediately and
the LTC1553L will remain in this state until VCC power
supply is recycled or OUTEN is toggled.
15%
VOUT
5%
RATED VOUT
–5%
t PWRBAD
t PWRGD
t FAULT
PWRGD
FAULT
1553L F09
Figure 9. PWRGD and FAULT
LAYOUT CONSIDERATIONS
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1553L. These items are also illustrated graphically in
the layout diagram of Figure 10. The thicker lines show the
high current paths. Note that at 10A current levels or
above, current density in the PC board itself is a serious
concern. Traces carrying high current should be as wide
as possible. For example, a PCB fabricated with 2oz
copper requires a minimum trace width of 0.15" to
carry 10A.
1. In general, layout should begin with the location of the
power devices. Be sure to orient the power circuitry so
that a clean power flow path is achieved. Conductor
widths should be maximized and lengths minimized.
After you are satisfied with the power path, the control
circuitry should be laid out. It is much easier to find
routes for the relatively small traces in the control
circuits than it is to find circuitous routes for high
current paths.
2. The GND and SGND pins should be shorted right at the
LTC1553L. This helps to minimize internal ground
disturbances in the LTC1553L and prevents differences
in ground potential from disrupting internal circuit
operation. This connection should then tie into the
17
LTC1553L
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APPLICATIONS INFORMATION
ground plane at a single point, preferably at a fairly quiet
point in the circuit such as close to the output capacitors. This is not always practical, however, due to
physical constraints. Another reasonably good point to
make this connection is between the output capacitors
and the source connection of the low side FET Q2. Do
not tie this single point ground in the trace run between
the low side FET source and the input capacitor ground,
as this area of the ground plane will be very noisy.
capacitors shown at VCC and PVCC will help provide
optimum regulation performance.
5. The (+) plate of CIN should be connected as close as
possible to the drain of the upper MOSFET. An additional 1µF ceramic capacitor between VIN and power
ground is recommended.
6. The SENSE pin is very sensitive to pickup from the
switching node. Care should be taken to isolate SENSE
from possible capacitive coupling to the inductor switching signal. A 0.1µF is required between the SENSE pin
and the SGND pin next to the LTC1553L.
3. The small signal resistors and capacitors for frequency
compensation and soft start should be located very
close to their respective pins and the ground ends
connected to the signal ground pin through a separate
trace. Do not connect these parts to the ground plane!
7. OUTEN is a high impedance input and should be
externally pulled up to a logic HIGH for normal
operation.
4. The VCC and PVCC decoupling capacitors should be as
close to the LTC1553L as possible. The 10µF bypass
8. Kelvin sense IMAX and IFB at Q1 drain and source pins.
VIN
+
CIN
Q1
LO
1
VOUT
G2
LTC1553L
G1
PVCC
2
+
0.1µF
10µF
+
COUT
Q2
+
10µF
3
VID0
GND
VID1
4 SGND
0.1µF
VID2
5
6
RIMAX
7
RIFB
8
9
10
CSS
BOLD LINES INDICATE
HIGH CURRENT PATHS
OUTEN
PVCC
C1
RC
VCC
VID3
SENSE
IMAX
IFB
VID4
PWRGD
SS
COMP
OT
19
18
17
16
15
14
VID0
VID1
5.6k
VID2
5.6k
VID3
5.6k
VID4
13
12
11
1153L F10
0.1µF
CC
Figure 10. LTC1553L Layout Diagram
18
FAULT
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LTC1553L
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VIN
5V
+
+
0.1µF
5.6k
5.6k
10µF
5.6k
VCC
PWRGD
IMAX
PVCC
0.1µF
FAULT
PENTIUM II
SYSTEM
20Ω
LTC1553L
OUTEN
G2
COMP
1.8k
C1
150pF
DALE
NTHS-1206N02
MOUNT THERMISTER
IN CLOSE THERMAL
PROXIMITY TO Q1
SS
SGND
LO†
2µH
18A
vOUT
IFB
VID0 TO VID4
5V
Q1*
G1
OT
5
CIN**
1200µF
×4
1N5817
2.7k
GND
COUT††
330µF
×7
Q2*
SENSE
+
RC
8.2k
CC
0.01µF
CSS
0.1µF
0.1µF
*SILICONIX SUD50N03-10
**SANYO 10MV1200GX
† COILTRONICS CTX02-13198 OR
PANASONIC 12TS-2R5SP
†† AVX TPSE337M006R0100
1553L F11
Figure 11. Single Supply LTC1553L 5V to 1.8V-3.5V Application with Thermal Monitor
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PACKAGE DESCRIPTION
Dimension in inches (millimeters) unless otherwise noted.
G Package
20-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
0.278 – 0.289*
(7.07 – 7.33)
20 19 18 17 16 15 14 13 12 11
0.301 – 0.311
(7.65 – 7.90)
1 2 3 4 5 6 7 8 9 10
0.205 – 0.212**
(5.20 – 5.38)
0.068 – 0.078
(1.73 – 1.99)
0° – 8°
0.005 – 0.009
(0.13 – 0.22)
0.022 – 0.037
(0.55 – 0.95)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
0.0256
(0.65)
BSC
0.010 – 0.015
(0.25 – 0.38)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.002 – 0.008
(0.05 – 0.21)
G20 SSOP 0595
19
LTC1553L
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PACKAGE DESCRIPTION
Dimension in inches (millimeters) unless otherwise noted.
SW Package
20-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
0.496 – 0.512*
(12.598 – 13.005)
20
19
18
17
16
15
14
13
12
11
0.394 – 0.419
(10.007 – 10.643)
NOTE 1
0.291 – 0.299**
(7.391 – 7.595)
0.010 – 0.029 × 45°
(0.254 – 0.737)
1
2
3
4
5
6
7
8
9
10
0.037 – 0.045
(0.940 – 1.143)
0.093 – 0.104
(2.362 – 2.642)
0° – 8° TYP
0.009 – 0.013
(0.229 – 0.330)
NOTE 1
0.016 – 0.050
(0.406 – 1.270)
0.050
(1.270)
TYP
0.004 – 0.012
(0.102 – 0.305)
0.014 – 0.019
(0.356 – 0.482)
TYP
S20 (WIDE) 0396
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
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PART NUMBER DESCRIPTION
COMMENTS
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LTC1149
Current Mode Step-Down Switching Regulator Controller
Synchronous, VIN ≤ 48V, for Standard Threshold FETs
LTC1159
Current Mode Step-Down Switching Regulator Controller
Synchronous, VIN ≤ 40V, for Logic Threshold FETs
LTC1266
Current Mode Step-Up/Down Switching Regulator Controller
Synchronous N- or P-Channel FETs, Comparator/Low-Battery Detector
LTC1430
High Power Step-Down Switching Regulator Controller
Synchronous N-Channel FETs, Voltage Mode
LTC1435
High Efficiency Low Noise Synchronous Step-Down
Switching Regulator
Drive Synchronous N-Channel, VIN ≤ 36V
LTC1438
Dual High Efficiency Low Noise Synchronous Step-Down
Switching Regulator
Dual LTC1435 with Power-On Reset
LTC1553
5-Bit Programmable Synchronous Switching Regulator
Controller for Pentium II Processor
High Voltage Version of LTC1553L
20
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417 ● (408) 432-1900
FAX: (408) 434-0507● TELEX: 499-3977 ● www.linear-tech.com
1553lf LT/TP 0198 4K • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1998
工商网监
湘ICP备2023018690号
