LTC3528BEDDB-2#TRPBF 数据手册
LTC3528B-2
1A, 2MHz Synchronous
Step-Up DC/DC Converter
in 2mm × 3mm DFN
FEATURES
DESCRIPTION
Delivers 3.3V at 200mA from a Single Alkaline/
NiMH Cell or 3.3V at 400mA from Two Cells
n V Start-Up Voltage: 700mV
IN
n 0.50V to 5.5V Input Range
n 1.6V to 5.25V V
OUT Range
n Up to 94% Efficiency
n Output Disconnect
n 2MHz Fixed Frequency Operation
n V > V
IN
OUT Operation
n Integrated Soft-Start
n Current Mode Control with Internal Compensation
n Low Noise PWM Operation
n Internal Synchronous Rectifier
n Logic Controlled Shutdown: (VCNTRL/(VIN + 0.4) – 1) MΩ
ZETEX ZC2811E
VCNTRL
1M
Figure 1. Recommended Shutdown Circuits
when Driving SHDN Above VIN
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8
LTC3528B-2
OPERATION
(Refer to Block Diagram)
Error Amplifier
Synchronous Rectifier
The error amplifier is a transconductance type. The noninverting input is internally connected to the 1.20V reference
and the inverting input is connected to FB. Clamps limit
the minimum and maximum error amp output voltage for
improved large-signal transient response. Power converter
control loop compensation is provided internally. A voltage
divider from VOUT to ground programs the output voltage
via FB from 1.6V to 5.25V.
To control inrush current and to prevent the inductor
current from running away when VOUT is close to VIN, the
P-channel MOSFET synchronous rectifier is only enabled
when VOUT > (VIN + 0.24V).
Anti-Ringing Control
R2
VOUT = 1.20V • 1+
R1
The anti-ringing control connects a resistor across the
inductor to prevent high frequency ringing on the SW pin
during discontinuous current mode operation. The ringing
of the resonant circuit formed by L and CSW (capacitance
on SW pin) is low energy, but can cause EMI radiation.
Current Sensing
Output Disconnect
Lossless current sensing converts the peak current signal
of the N-channel MOSFET switch into a voltage which
is summed with the internal slope compensation. The
summed signal is compared to the error amplifier output
to provide a peak current control command for the PWM.
Current Limit
The current limit comparator shuts off the N-channel
MOSFET switch once its threshold is reached. The current limit comparator delay to output is typically 60ns.
Peak switch current is limited to approximately 1.5A,
independent of input or output voltage, unless VOUT falls
below 0.7V, in which case the current limit is cut in half.
Zero Current Comparator
The zero current comparator monitors the inductor current to the output and shuts off the synchronous rectifier
when this current reduces to approximately 20mA. This
prevents the inductor current from reversing in polarity,
improving efficiency at light loads.
The LTC3528B-2 is designed to allow true output disconnect by eliminating body diode conduction of the internal
P-channel MOSFET rectifier. This allows for VOUT to go to
zero volts during shutdown, drawing no current from the
input source. It also enables inrush current limiting at turnon, minimizing surge currents seen by the input supply.
Note that to obtain the advantages of output disconnect,
a Schottky diode cannot be connected between SW and
VOUT. The output disconnect feature also allows VOUT to be
forced above the programmed regulation voltage, without
any reverse current into a battery on VIN.
Thermal Shutdown
If the die temperature exceeds 160°C, the LTC3528B-2
enters thermal shutdown. All switches will be turned off
and the soft-start capacitor will be discharged. The device
will be enabled again when the die temperature drops by
approximately 15°C.
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9
LTC3528B-2
APPLICATIONS INFORMATION
VIN > VOUT OPERATION
soldered will help to lower the chip temperature. A multilayer board with a separate ground plane is ideal, but not
absolutely necessary.
The LTC3528B-2 maintains voltage regulation even when
the input voltage is above the desired output voltage. Note
that the efficiency is much lower in this mode, and the
maximum output current capability will be less. Refer to
the Typical Performance Characteristics.
COMPONENT SELECTION
Inductor Selection
The LTC3528B-2 can utilize small surface mount chip
inductors due to their fast 2MHz switching frequency.
Inductor values between 1.5µH and 3.3µH are suitable for
most applications. Larger values of inductance will allow
slightly greater output current capability by reducing the
inductor ripple current. Increasing the inductance above
10µH will increase size while providing little improvement
in output current capability.
SHORT-CIRCUIT PROTECTION
The LTC3528B-2 output disconnect feature allows an output
short circuit while maintaining a maximum internally set
current limit. To reduce power dissipation under shortcircuit conditions, the peak switch current limit is reduced
to 750mA (typical).
SCHOTTKY DIODE
The minimum inductance value is given by:
Although not required, adding a Schottky diode from
SW to VOUT will improve efficiency by about 2%. Note
that this defeats the output disconnect and short-circuit
protection features.
L>
(
VIN(MIN) • VOUT(MAX) – VIN(MIN)
2 • Ripple • VOUT(MAX)
) µH
where:
PCB LAYOUT GUIDELINES
Ripple = Allowable inductor current ripple (amps peakpeak)
The high speed operation of the LTC3528B-2 demands
careful attention to board layout. A careless layout will
not produce the advertised performance. Figure 2 shows
the recommended component placement. A large ground
copper area with the package backside metal pad properly
VIN(MIN) = Minimum input voltage
VOUT(MAX) = Maximum output voltage
VIN
+
SHDN 1
CIN
8 VIN
7 SGND
FB 2
LTC3528B-2
PGOOD 3
VOUT 4
COUT
6 PGND
5 SW
35282 F02
MULTIPLE VIAS
TO GROUND PLANE
Figure 2. Recommended Component Placement for Single Layer Board
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10
LTC3528B-2
APPLICATIONS INFORMATION
The inductor current ripple is typically set for 20% to
40% of the maximum inductor current. High frequency
ferrite core inductor materials reduce frequency dependent
power losses compared to cheaper powdered iron types,
improving efficiency. The inductor should have low ESR
(series resistance of the windings) to reduce the I2R power
losses, and must be able to handle the peak inductor current
without saturating. Molded chokes and some chip inductors usually do not have enough core area to support the
peak inductor currents of 1.5A seen on the LTC3528B-2.
To minimize radiated noise, use a shielded inductor. See
Table 1 for suggested components and suppliers.
Table 1. Recommended Inductors
VENDOR
PART/STYLE
Coilcraft
(847) 639-6400
www.coilcraft.com
DO1606T, MSS5131, MSS5121
MSS6122, MOS6020
ME3220, DO1608C
1812PS
Coiltronics
SD12, SD14, SD20
SD25, SD52
Sumida
(847) 956-0666
www.sumida.com
CD43
CDC5D23B
CDRH5D18
TDK
VLP, VLF
VLCF, SLF, VLS
Toko
(408) 432-8282
www.tokoam.com
D53, D62, D63
D73, D75
Wurth
(201) 785-8800
www.we-online.com
WE-TPC type M, MH
Output and Input Capacitor Selection
Low ESR (equivalent series resistance) capacitors should
be used to minimize the output voltage ripple. Multilayer
ceramic capacitors are an excellent choice as they have
extremely low ESR and are available in small footprints.
A 10µF to 22µF output capacitor is sufficient for most applications. Values larger than 22µF may be used to obtain
extremely low output voltage ripple and improve transient
response. X5R and X7R dielectric materials are preferred
for their ability to maintain capacitance over wide voltage
and temperature ranges. Y5V types should not be used.
The internal loop compensation of the LTC3528B-2 is
designed to be stable with output capacitor values of 10µF
or greater. Although ceramic capacitors are recommended,
low ESR tantalum capacitors may be used as well.
A small ceramic capacitor in parallel with a larger tantalum
capacitor may be used in demanding applications which
have large load transients. Another method of improving the
transient response is to add a small feed-forward capacitor across the top resistor of the feedback divider (from
VOUT to FB). A typical value of 33pF will generally suffice.
Low ESR input capacitors reduce input switching noise
and reduce the peak current drawn from the battery. It
follows that ceramic capacitors are also a good choice
for input decoupling and should be located as close as
possible to the device. A 10µF input capacitor is sufficient
for most applications. Larger values may be used without
limitations. Table 2 shows a list of several ceramic capacitor manufacturers. Consult the manufacturers directly for
detailed information on their selection of ceramic parts.
Table 2. Capacitor Vendor Information
SUPPLIER
PHONE
WEBSITE
AVX
(803) 448-9411
www.avxcorp.com
Murata
(714) 852-2001
www.murata.com
Taiyo-Yuden
(408) 573-4150
www.t-yuden.com
TDK
(847) 803-6100
www.component.tdk.com
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11
LTC3528B-2
TYPICAL APPLICATIONS
1 Cell to 1.8V
Efficiency
100
90
2.2µH
80
SW
VIN
4.7µF
68pF
499k
LTC3528B-2
PGOOD
OFF ON
VOUT
1.8V
250mA
VOUT
EFFICIENCY (%)
VIN
0.88V TO 1.6V
10µF
FB
SHDN
1M
GND
70
60
50
40
30
VIN = 0.9V
VIN = 1.2V
VIN = 1.5V
20
35282 TA02a
10
0.1
1
10
100
LOAD CURRENT (mA)
1000
35282 TA02b
Dual 1 Cell to 1.8V, 3V Sequenced Supply
2.2µH
SW
VIN
0.88V TO 1.6V
VOUT
VIN
4.7µF
475k
LTC3528B-2
68pF
SHDN
VOUT2
1M
GND
VOUT1
VIN
PGOOD1
0.5V/DIV
2.2µH
SW
VIN
4.7µF
Output Voltage Sequencing
10µF
FB
PGOOD
OFF ON
499k
VOUT1
1.8V
250mA
VOUT
LTC3528B-2
PGOOD
SHDN
GND
499k
68pF
VOUT2
3V
200mA
200µs/DIV
35282 TA03b
10µF
FB
324k
3528 TA03a
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12
LTC3528B-2
TYPICAL APPLICATIONS
1 Cell to 3.3V
Efficiency
90
2.2µH
80
VIN
4.7µF
VOUT
LTC3528B-2
68pF
10µF
FB
PGOOD
OFF ON
499k
SHDN
VOUT
3.3V
200mA
70
EFFICIENCY (%)
SW
VIN
0.88V TO 1.6V
287k
GND
60
50
40
30
VIN = 0.9V
VIN = 1.2V
VIN = 1.5V
20
35282 TA04a
10
1
10
100
LOAD CURRENT (mA)
1000
36282 TA04b
2 Cell to 3.3V
Efficiency
100
2.2µH
90
VIN
4.7µF
VOUT
LTC3528B-2
PGOOD
OFF ON
SHDN
GND
499k
68pF
VOUT
3.3V
400mA
10µF
FB
287k
80
EFFICIENCY (%)
SW
VIN
1.8V TO 3.2V
70
60
50
40
30
35282 TA05a
VIN = 1.8V
VIN = 2.4V
VIN = 3V
20
10
0.1
1
10
100
LOAD CURRENT (mA)
1000
35282 TA05b
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13
LTC3528B-2
TYPICAL APPLICATIONS
2 Cell to 5V
2.2µH
SW
VIN
1.8V TO 3.2V
VIN
4.7µF
VOUT
LTC3528B-2
PGOOD
OFF ON
1M
22µF
FB
SHDN
VOUT
5V
300mA
316k
GND
35282 TA06a
Efficiency
100
90
EFFICIENCY (%)
80
70
60
50
40
30
VIN = 1.8V
VIN = 2.4V
VIN = 3V
20
10
0.1
1
10
100
LOAD CURRENT (mA)
1000
35282 TA06b
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14
LTC3528B-2
TYPICAL APPLICATIONS
Li-Ion to 5V
2.2µH
SW
VIN
2.7V TO 4.2V
VIN
4.7µF
LTC3528B-2
PGOOD
OFF ON
VOUT
5V
400mA
VOUT
1M
22µF
FB
SHDN
316k
GND
35282 TA07a
Efficiency
100
90
EFFICIENCY (%)
80
70
60
50
40
30
VIN = 2.8V
VIN = 3.6V
VIN = 4.2V
20
10
0.1
1
10
100
LOAD CURRENT (mA)
1000
35282 TA07b
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15
LTC3528B-2
PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
0.61 ±0.05
(2 SIDES)
0.70 ±0.05
2.55 ±0.05
1.15 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
2.20 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ±0.10
(2 SIDES)
R = 0.115
TYP
5
R = 0.05
TYP
0.40 ± 0.10
8
2.00 ±0.10
(2 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.56 ± 0.05
(2 SIDES)
0.200 REF
0.75 ±0.05
0 – 0.05
4
0.25 ± 0.05
1
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
0.50 BSC
2.15 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
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16
LTC3528B-2
REVISION HISTORY
REV
DATE
DESCRIPTION
A
01/11
Change to Operating Temperature Range
PAGE NUMBER
Update to Note 2 reflected in Electrical Characteristics
2
2, 3
Replaced graphs G14, G15, G16 and G17
5
Operations section update Pin 9 to read GND
6
Operations section update to Shutdown
8
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
17
LTC3528B-2
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18 Linear Technology Corporation
LT 0111 REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
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