LTM2881
Complete Isolated
RS485/RS422 µModule
Transceiver + Power
Description
Features
RS485/RS422 Transceiver: 2500VRMS for 1 Minute
nn UL-CSA Recognized
File #E151738
nn CSA Component Acceptance Notice 5A
nn Isolated DC Power: 5V at Up to 200mA
nn No External Components Required
nn 20Mbps or Low EMI 250kbps Data Rate
nn High ESD: ±15kV HBM on Transceiver Interface
nn High Common Mode Transient Immunity: 30kV/μs
nn Integrated Selectable 120Ω Termination
nn 3.3V (LTM2881-3) or 5.0V (LTM2881-5) Operation
nn 1.62V to 5.5V Logic Supply Pin for Flexible Digital Interface
nn Maximum Continuous Working Voltage: 560V
PEAK
nn High Input Impedance Failsafe RS485 Receiver
nn Current Limited Drivers and Thermal Shutdown
nn Compatible with TIA/EIA-485-A and PROFIBUS
nn High Impedance Output During Internal Fault Condition
nn Low Current Shutdown Mode (< 10µA)
nn General Purpose CMOS Isolated Channel
nn 15mm × 11.25mm BGA and LGA Packages
nn
Applications
The LTM®2881 is a complete galvanically isolated full-duplex RS485/RS422 µModule® (micromodule) transceiver.
No external components are required. A single supply
powers both sides of the interface through an integrated,
isolated, low noise, efficient 5V output DC/DC converter.
Coupled inductors and an isolation power transformer
provide 2500VRMS of isolation between the line transceiver
and the logic interface. This device is ideal for systems
where the ground loop is broken allowing for large common mode voltage variation. Uninterrupted communication is guaranteed for common mode transients greater
than 30kV/μs.
Maximum data rates are 20Mbps or 250kbps in slew
limited mode. Transmit data, DI and receive data, RO, are
implemented with event driven low jitter processing. The
receiver has a one-eighth unit load supporting up to 256
nodes per bus. A logic supply pin allows easy interfacing
with different logic levels from 1.62V to 5.5V, independent
of the main supply.
Enhanced ESD protection allows this part to withstand up
to ±15kV (human body model) on the transceiver interface
pins to isolated supplies and ±10kV through the isolation
barrier to logic supplies without latch-up or damage.
Isolated RS485/RS422 Interface
Industrial Networks
nn Breaking RS485 Ground Loops
nn Isolated PROFIBUS-DP Networks
nn
nn
L, LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
Typical Application
Isolated Half-Duplex RS485 μModule Transceiver
LTM2881 Operating Through 35kV/μs CM Transients
3.3V (LTM2881-3)
5V (LTM2881-5)
VCC
PWR
ISOLATION BARRIER
VL
RO
MULTIPLE SWEEPS
OF COMMON MODE
TRANSIENTS
RE
TE
DE
DI
LTM2881
VCC2
A
5V
AVAILABLE CURRENT:
150mA (LTM2881-5)
100mA (LTM2881-3)
500V/DIV
DI
B
TWISTED-PAIR
CABLE
Y
1V/DIV
1V/DIV
50ns/DIV
Z
GND
RO
2881 TA01a
GND2
2881 TA01
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1
LTM2881
Absolute Maximum Ratings
Pin Configuration
(Note 1)
VCC to GND................................................... –0.3V to 6V
VCC2 to GND2................................................ –0.3V to 6V
VL to GND..................................................... –0.3V to 6V
Interface Voltages
(A, B, Y, Z) to GND2......................... VCC2 –15V to 15V
(A-B) with Terminator Enabled...............................±6V
Signal Voltages ON, RO, DI, DE,
RE, TE, DOUT to GND.......................... –0.3V to VL +0.3V
Signal Voltages SLO,
DIN to GND2.....................................–0.3V to VCC2 +0.3V
Operating Temperature Range
LTM2881C................................................ 0°C to 70°C
LTM2881I..............................................–40°C to 85°C
LTM2881H.......................................... –40°C to 105°C
LTM2881MP....................................... –55°C to 105°C
Maximum Internal Operating Temperature........ 125°C
Storage Temperature Range................... –55°C to 150°C
Peak Package Body Reflow Temperature............... 245°C
2
TOP VIEW
1
A
2
DOUT TE
3
4
5
6
7
8
DI DE RE RO VL ON
B
VCC
GND
C
D
E
F
G
H
J
GND2
K
L
DIN SLO Y
Z
BGA PACKAGE
32-PIN (15mm × 11.25mm × 3.42mm)
TJMAX = 125°C,
θJA = 32.2°C/W,
θJCTOP = 27.2°C/W,
θJCBOTTOM = 20.9°C/W,
θJB = 26.4°C/W,
WEIGHT = 1g
B
A
VCC2
LGA PACKAGE
32-PIN (15mm × 11.25mm × 2.8mm)
TJMAX = 125°C,
θJA = 31.1°C/W,
θJCTOP = 27.3°C/W,
θJCBOTTOM = 19.5°C/W,
θJB = 25.1°C/W,
WEIGHT = 1g
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LTM2881
Order Information
PART NUMBER
LTM2881CY-3#PBF
LTM2881IY-3#PBF
LTM2881HY-3#PBF
LTM2881HY-3
LTM2881MPY-3#PBF
LTM2881MPY-3
LTM2881CY-5#PBF
LTM2881IY-5#PBF
LTM2881HY-5#PBF
LTM2881HY-5
LTM2881MPY-5#PBF
LTM2881MPY-5
LTM2881CV-3#PBF
LTM2881IV-3#PBF
LTM2881HV-3#PBF
LTM2881CV-5#PBF
LTM2881IV-5#PBF
LTM2881HV-5#PBF
INPUT
VOLTAGE
http://www.linear.com/product/LTM2881#orderinfo
PART MARKING
DEVICE
FINISH CODE
PAD OR BALL FINISH
SAC305 (RoHS)
3V to 3.6V
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
3V to 3.6V
LTM2881Y-3
e0
e1
e0
BGA
e1
LTM2881Y-5
3
e0
e1
e0
LTM2881V-3
Au (RoHS)
4.5V to 5.5V
MSL
RATING
e1
SAC305 (RoHS)
4.5V to 5.5V
PACKAGE
TYPE
e4
LTM2881V-5
LGA
TEMPERATURE RANGE
0°C to 70°C
–40°C to 85°C
–40°C to 105°C
–40°C to 105°C
–55°C to 105°C
–55°C to 105°C
0°C to 70°C
–40°C to 85°C
–40°C to 105°C
–40°C to 105°C
–55°C to 105°C
–55°C to 105°C
0°C to 70°C
–40°C to 85°C
–40°C to 105°C
0°C to 70°C
–40°C to 85°C
–40°C to 105°C
• Device temperature grade is indicated by a label on the shipping
container.
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended BGA and LGA PCB Assembly and Manufacturing
Procedures: www.linear.com/umodule/pcbassembly
• Terminal Finish Part Marking: www.linear.com/leadfree
• This product is moisture sensitive. For more information, go to:
www.linear.com/umodule/pcbassembly
• This product is not recommended for second side reflow. For more
information, go to: www.linear.com/BGA-assy
• LGA and BGA Package and Tray Drawings: www.linear.com/packaging
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3
LTM2881
Electrical Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5.0V, VL = 3.3V, GND = GND2
= 0V, ON = VL unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
l
l
3.0
4.5
3.3
5.0
3.6
5.5
l
1.62
UNITS
Power Supply
VCC
VCC Supply Voltage
VL
VL Supply Voltage
5.5
V
ICCPOFF
VCC Supply Current in Off Mode
ON = 0V
l
0
10
µA
ICCS
VCC Supply Current in On Mode
LTM2881-3 DE = 0V, RE = VL , No Load
LTM2881-5 DE = 0V, RE = VL , No Load
l
l
20
15
30
25
mA
mA
VCC2
Regulated VCC2 Output Voltage,
Loaded
LTM2881-3 DE = 0V, RE = VL , ILOAD = 100mA
LTM2881-5 DE = 0V, RE = VL , ILOAD = 150mA
LTM2881-3, H/MP-Grade, I LOAD = 90mA
l
l
l
VCC2NOLOAD Regulated VCC2 Output Voltage,
No Load
LTM2881-3
LTM2881-5
DE = 0V, RE = VL , No Load
4.75
4.75
4.75
5.0
5.0
4.8
5.0
V
V
V
V
V
5.35
V
Efficiency
ICC2 = 100mA, LTM2881-5 (Note 2)
62
%
VCC2 Short-Circuit Current
DE = 0V, RE = VL , VCC2 = 0V
200
mA
|VOD|
Differential Driver Output Voltage
R = ∞ (Figure 1)
R = 27Ω (RS485) (Figure 1)
R = 50Ω (RS422) (Figure 1)
∆|VOD|
Difference in Magnitude of Driver R = 27Ω or R = 50Ω (Figure 1)
Differential Output Voltage for
Complementary Output States
VOC
Driver Common Mode Output
Voltage
ICC2S
Driver
VCC2
VCC2
VCC2
V
V
V
l
0.2
V
R = 27Ω or R = 50Ω (Figure 1)
l
3
V
∆|VOC|
Difference in Magnitude of Driver R = 27Ω or R = 50Ω (Figure 1)
Common Mode Output Voltage
for Complementary Output States
l
0.2
V
IOZD
Driver Three-State (High
Impedance) Output Current on
Y and Z
DE = 0V, (Y or Z) = –7V, +12V
DE = 0V, (Y or Z) = –7V, +12V, H/MP-Grade
l
l
±10
±50
µA
µA
IOSD
Maximum Driver Short-Circuit
Current
– 7V ≤ (Y or Z) ≤ 12V (Figure 2)
l
– 250
250
mA
RIN
Receiver Input Resistance
RE = 0V or VL , VIN = –7V, –3V, 3V, 7V, 12V (Figure 3)
RE = 0V or VL , VIN = –7V, –3V, 3V, 7V, 12V (Figure 3),
H/MP-Grade
l
l
96
48
125
125
RTE
Receiver Termination Resistance
Enabled
TE = VL , VAB = 2V, VB = – 7V, 0V, 10V (Figure 8)
l
108
120
IIN
Receiver Input Current (A, B)
ON = 0V VCC2 = 0V or 5V, VIN = 12V (Figure 3)
ON = 0V VCC2 = 0V or 5V, VIN = 12V (Figure 3), H/MP-Grade
l
l
ON = 0V VCC2 = 0V or 5V, VIN = –7V (Figure 3)
ON = 0V VCC2 = 0V or 5V, VIN = –7V (Figure 3), H/MP-Grade
l
l
–100
–145
–7V ≤ B ≤ 12V
l
–0.2
l
l
l
2.1
2.1
Receiver
VTH
Receiver Differential Input
Threshold Voltage (A-B)
∆VTH
Receiver Input Failsafe Hysteresis B = 0V
Receiver Input Failsafe Threshold B = 0V
4
kΩ
kΩ
156
Ω
125
250
µA
µA
0.2
25
–0.2
–0.05
V
mV
0
V
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LTM2881
Electrical Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5.0V, VL = 3.3V, GND = GND2
= 0V, ON = VL unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Logic
VIL
Logic Input Low Voltage
1.62V ≤ VL ≤ 5.5V
l
Logic Input High Voltage
DIN
SLO
DI, TE, DE, ON, RE:
VL ≥ 2.35V
1.62V ≤ VL < 2.35V
l
l
0.67•VCC2
2
V
V
l
l
0.67•VL
0.75•VL
V
V
VIH
0.4
V
IINL
Logic Input Current
VHYS
Logic Input Hysteresis
(Note 2)
VOH
Output High Voltage
Output High, ILOAD = –4mA
(Sourcing), 5.5V ≥ VL ≥ 3V
Output High, ILOAD = –1mA
(Sourcing), 1.62V ≤ VL < 3V
l
VL –0.4
V
l
VL –0.4
V
Output Low, ILOAD = 4mA
(Sinking), 5.5V ≥ VL ≥ 3V
Output High, ILOAD = 1mA
(Sinking), 1.62V ≤ VL < 3V
l
0.4
V
l
0.4
V
VOL
Output Low Voltage
0
l
±1
150
µA
mV
IOZR
Three-State (High Impedance)
Output Current on RO
RE = VL , 0V ≤ RO ≤ VL
l
±1
µA
IOSR
Short-Circuit Current
0V ≤ (RO or DOUT) ≤ VL
l
±85
mA
Switching Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5.0V, VL = 3.3V, GND = GND2
= 0V, ON = VL unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Driver SLO = VCC2
fMAX
Maximum Data Rate
(Note 3)
tPLHD
tPHLD
Driver Input to Output
RDIFF = 54Ω, CL = 100pF
(Figure 4)
l
20
60
85
Mbps
ns
∆tPD
Driver Input to Output Difference
|tPLHD – tPHLD|
RDIFF = 54Ω, CL = 100pF
(Figure 4)
l
1
8
ns
tSKEWD
Driver Output Y to Output Z
RDIFF = 54Ω, CL = 100pF
(Figure 4)
l
1
±8
ns
tRD
tFD
Driver Rise or Fall Time
RDIFF = 54Ω, CL = 100pF
(Figure 4)
l
4
12.5
ns
tZLD , tZHD ,
tLZD , tHZD
Driver Output Enable or Disable
Time
RL = 500Ω, CL = 50pF
(Figure 5)
l
170
ns
Driver SLO = GND2
fMAX
Maximum Data Rate
(Note 3)
tPLHD
tPHLD
Driver Input to Output
RDIFF = 54Ω, CL = 100pF
(Figure 4)
250
1
1.55
µs
∆tPD
Driver Input to Output Difference
|tPLHD – tPHLD|
RDIFF = 54Ω, CL = 100pF
(Figure 4)
50
500
ns
tSKEWD
Driver Output Y to Output Z
RDIFF = 54Ω, CL = 100pF
(Figure 4)
±200
±500
ns
tRD
tFD
Driver Rise or Fall Time
RDIFF = 54Ω, CL = 100pF
(Figure 4)
0.9
1.5
µs
l
kbps
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5
LTM2881
switching Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5.0V, VL = 3.3V, GND = GND2
= 0V, ON = VL unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
tZLD , tZHD ,
tLZD , tHZD
Driver Output Enable or Disable
Time
RL = 500Ω, CL = 50pF
(Figure 5)
l
tPLHR
tPHLR
Receiver Input to Output
CL = 15pF, VCM = 2.5V, |VAB| = 1.4V,
tR and tF < 4ns, (Figure 6)
l
tSKEWR
Differential Receiver Skew
|tPLHR - tPHLR|
CL = 15pF
(Figure 6)
tRR
tFR
TYP
MAX
UNITS
400
ns
100
140
ns
l
1
8
ns
Receiver Output Rise or Fall Time CL = 15pF
(Figure 6)
l
3
12.5
ns
tZLR , tZHR ,
tLZR , tHZR
Receiver Output Enable Time
RL =1kΩ, CL = 15pF
(Figure 7)
l
50
ns
tRTEN , tRTZ
Termination Enable or Disable
Time
RE = 0V, DE = 0V, VAB = 2V, VB = 0V (Figure 8)
l
100
µs
CL = 15pF,
tR and tF < 4ns
l
60
100
ns
ON
l
325
800
µs
Receiver
Generic Logic Input
DIN to DOUT Input to Output
tPLHL1
tPHLL1
Power Supply Generator
VCC2 –GND2 Supply Start-Up
Time
(0V to 4.5V)
VL, No Load
Isolation Characteristics
TA = 25°C, LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5.0V, VL = 3.3V unless
otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
VISO
Rated Dielectric Insulation Voltage
1 Minute (Derived from 1 Second Test)
1 Second (Notes 5, 6)
Common Mode Transient Immunity
Maximum Working Insulation Voltage
LTM2881-3 VCC = 3.3V, LTM2881-5 VCC = 5V,
VL = ON = 3.3V, VCM = 1kV, ∆t = 33ns (Note 2)
(Notes 2, 5)
Partial Discharge
Comparative Tracking Index
Depth of Erosion
Distance Through Insulation
Input to Output Resistance
Input to Output Capacitance
Creepage Distance
VPR = 1050 VPEAK (Note 2)
IEC 60112 (Note 2)
IEC 60112 (Note 2)
(Note 2)
(Notes 2, 5)
(Notes 2, 5)
(Notes 2, 5)
VIORM
CTI
DTI
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Guaranteed by design and not subject to production test.
Note 3: Maximum Data rate is guaranteed by other measured parameters
and is not tested directly.
6
MIN
TYP
MAX
UNITS
2500
±4400
VRMS
VDC
±30
kV/µs
560
400
VPEAK
VRMS
pC
VRMS
mm
mm
Ω
pF
mm
5
600
0.017
0.06
109
6
9.48
Note 4: This µModule transceiver includes overtemperature protection that
is intended to protect the device during momentary overload conditions.
Junction temperature will exceed 125°C when overtemperature protection
is active. Continuous operation above specified maximum operating
junction temperature may result in device degradation or failure.
Note 5: Device considered a 2-terminal device. Pin group A1 through B8
shorted together and pin group K1 through L8 shorted together.
Note 6: The rated dielectric insulation voltage should not be interpreted as
a continuous voltage rating.
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LTM2881
Typical Performance Characteristics
TA = 25°C, LTM2881-3 VCC = 3.3V, LTM2881-5
VCC = 5.0V, VL = 3.3V unless otherwise noted.
2.0
80
1.5
1.5
75
1.0
0.5
0
DRIVER PROP DELAY (ns)
2.0
1.0
0.5
0
–0.5
–0.5
–1.0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
–1.0
–50
125
–25
0
25
50
75
TEMPERATURE (°C)
100
4.5
126
4.0
124
3.5
122
120
118
116
1.5
0.5
0
125
OUTPUT LOW
R = 100Ω
3
R = 54Ω
2
0
10
20
30
40
50
OUTPUT CURRENT (mA)
60
0
–50
70
–25
0
25
50
75
TEMPERATURE (°C)
100
125
2881 G06
Receiver Propagation Delay
vs Temperature
4
Supply Current vs Data Rate
200
120
180
3
2
1
115
SUPPLY CURRENT (mA)
RECEIVER PROP DELAY (ns)
SOURCE
110
105
100
160 R = 54Ω (LTM2881-3)
140
120
100
80
60
40
95
20
SINK
2
3
4
OUTPUT CURRENT (mA)
R=∞
4
2881 G05
Receiver Output Voltage vs
Output Current (Source and Sink)
125
2881 G03
1
2881 G04
1
100
5
OUTPUT HIGH
2.0
112
0
0
25
50
75
TEMPERATURE (°C)
6
2.5
1.0
100
–25
Driver Differential Output Voltage
vs Temperature
3.0
114
0
50
–50
125
OUTPUT VOLTAGE (V)
128
OUTPUT VOLTAGE (V)
RESISTANCE (Ω)
5.0
0
25
50
75
TEMPERATURE (°C)
60
Driver Output Low/High Voltage
vs Output Current
130
–25
65
2881 G02
RTERM vs Temperature
110
–50
70
55
2881 G01
OUTPUT VOLTAGE (V)
Driver Propagation Delay
vs Temperature
Driver Skew vs Temperature
DRIVER SKEW (ns)
RECEIVER SKEW (ns)
Receiver Skew vs Temperature
5
2881 G07
90
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
2881 G08
R = 100Ω (LTM2881-3)
R = 54Ω (LTM2881-5)
R = 100Ω (LTM2881-5)
R = ∞ (LTM2881-3)
R = ∞ (LTM2881-5)
0
0.1
1
DATA RATE (Mbps)
10
2881 G09
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7
LTM2881
Typical Performance Characteristics
TA = 25°C, LTM2881-3 VCC = 3.3V, LTM2881-5
VCC = 5.0V, VL = 3.3V unless otherwise noted.
6
LTM2881-3, VCC = 3.3V
250
200
LTM2881-5, VCC = 5V
150
100
50
200
LTM2881-5 (RS485 60mA)
150
LTM2881-5 (RS485 90mA)
100
LTM2881-3 (RS485 60mA)
LTM2881-5
5
VOLTAGE (V)
300
ICC CURRENT (mA)
VCC2 vs Load Current
250
SURPLUS CURRENT (mA)
350
VCC2 Surplus Current
vs Temperature
VCC Supply Current vs Temperature
at ILOAD = 100mA on VCC2
LTM2881-3
4
3
50
LTM2881-3 (RS485 90mA)
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
2881 G10
70
100
125
2
2881 G11
VCC2 Power Efficiency
10
20
40 60 80 100 120 140 160 180
VCC2 LOAD CURRENT (mA)
2881 G12
VCC2 Load Step (100mA)
VCC2 Noise
LTM2881-5
VCC2
100mV/DIV
EFFICIENCY (%)
60
50
LTM2881-3
10mV/DIV
40
ILOAD
50mA/DIV
30
20
10
100µs/DIV
0
150
50
100
ICC2 OUTPUT CURRENT (mA)
2881 G14
200µs/DIV
2881 G15
200
2881 G13
8
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LTM2881
Pin Functions
LOGIC SIDE (VCC , VL, GND)
ISOLATED SIDE (VCC2, GND2)
DOUT (Pin A1): General Purpose Logic Output. Logic
output connected through isolation path to DIN . Under
the condition of an isolation communication failure DOUT
is in a high impedance state.
DIN (Pin L1): General Purpose Isolated Logic Input. Logic
input on the isolated side relative to VCC2 and GND2. A
logic high on DIN will generate a logic high on DOUT. A
logic low on DIN will generate a logic low on DOUT.
TE (Pin A2): Terminator Enable. A logic high enables a
termination resistor (typically 120Ω) between pins A and B.
SLO (Pin L2): Driver Slew Rate Control. A low input, relative to GND2, will force the driver into a reduced slew rate
mode for reduced EMI. A high input, relative to GND2,
puts the driver into full speed mode to support maximum
data rates.
DI (Pin A3): Driver Input. If the driver outputs are enabled
(DE high), then a low on DI forces the driver noninverting
output (Y) low and the inverting output (Z) high. A high
on DI, with the driver outputs enabled, forces the driver
noninverting output (Y) high and inverting output (Z) low.
DE (Pin A4): Driver Enable. A logic low disables the driver
leaving the outputs Y and Z in a high impedance state. A
logic high enables the driver.
RE (Pin A5): Receiver Enable. A logic low enables the
receiver output. A logic high disables RO to a high impedance state.
RO (Pin A6): Receiver Output. If the receiver output is
enabled (RE low) and if A – B is > 200mV, RO is a logic
high, if A – B is < –200mV RO is a logic low. If the receiver
inputs are open, shorted, or terminated without a valid
signal, RO will be high. Under the condition of an isolation
communication failure RO is in a high impedance state.
VL (Pin A7): Logic Supply. Interface supply voltage for
pins RO, RE, TE, DI, DE, DOUT, and ON. Recommended
operating voltage is 1.62V to 5.5V. Internally bypassed
to GND with 2.2µF.
Y (Pin L3): Non Inverting Driver Output. High impedance
when the driver is disabled.
Z (Pin L4): Inverting Driver Output. High impedance when
the driver is disabled.
B (Pin L5): Inverting Receiver Input. Impedance is > 96kΩ
in receive mode with TE low or unpowered.
A (Pin L6): Non Inverting Receiver Input. Impedance is
> 96kΩ in receive mode with TE low or unpowered.
VCC2 (Pins L7-L8): Isolated Supply Voltage. Internally
generated from VCC by an isolated DC/DC converter and
regulated to 5V. Internally bypassed to GND2 with 2.2µF.
GND2 (Pins K1-K8): Isolated Side Circuit Ground. The
pads should be connected to the isolated ground and/or
cable shield.
ON (Pin A8): Enable. Enables power and data communication through the isolation barrier. If ON is high the part is
enabled and power and communications are functional
to the isolated side. If ON is low the logic side is held in
reset and the isolated side is unpowered.
GND (Pins B1-B5): Circuit Ground.
VCC (Pins B6-B8): Supply Voltage. Recommended operating voltage is 3V to 3.6V for LTM2881-3 and 4.5V to 5.5V
for LTM2881-5. Internally bypassed to GND with 2.2µF.
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9
LTM2881
Block Diagram
VCC
2.2µF
VCC2
5V
REG
ISOLATED
DC/DC
CONVERTER
2.2µF
VL
2.2µF
A
RO
RX
B
RE
ISOLATED
COMM
INTERFACE
DE
ISOLATED
COMM
INTERFACE
120Ω
DI
Y
DX
ON
Z
SLO
TE
DIN
DOUT
GND
GND2
2881 BD
= LOGIC SIDE COMMON
= ISOLATED SIDE COMMON
Test Circuits
Y
GND
OR
VL
DI
Y
+
DRIVER
VOD
–
Z
R
R
GND
OR
VL
+
–
DI
IOSD
DRIVER
VOC
Z
2881 F01
–7V TO 12V
2881 F02
Figure 1. Driver DC Characteristics
Figure 2. Driver Output Short-Circuit Current
IIN
VIN
+
–
+
–
A OR B
B OR A
RECEIVER
2881 F03
V
RIN = IN
IIN
Figure 3. Receiver Input Current and Input Resistance
10
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LTM2881
TEST CIRCUITs
DI
Y
DI
VL
tPLHD
0V
tPHLD
tSKEWD
CL
DRIVER
RDIFF
Y, Z VOD
1/2 VOD
CL
Z
90%
2881 F04a
(Y-Z)
10%
0
0
90%
10%
tRD
tFD
2881 F04b
Figure 4. Driver Timing Measurement
RL
Y
VL
OR
GND
DI
CL
GND
OR
VCC2
RL
Z
1/2 VL
0V
tZLD
VCC2
Y OR Z
DRIVER
DE
VL
DE
CL
VCC2
OR
GND
2881 F05a
tLZD
1/2 VCC2
0.5V
0.5V
1/2 VCC2
Z OR Y
0V
tZHD
2881 F05b
tHZD
Figure 5. Driver Enable and Disable Timing Measurements
tR
±VAB/2
VCM
±VAB/2
VAB
A-B
–VAB
A
B
RECEIVER
RO
CL
2881 F06a
RO
VL
0
90%
10%
tF
90%
0
10%
tPLHR
90%
1/2 VL
10%
tRR
tPHLR
1/2 VL
90%
10%
tFR
2881 F06b
Figure 6. Receiver Propagation Delay Measurements
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11
LTM2881
TEST CIRCUITs
VL
RE
0V OR VCC2
B
VCC2 OR 0V
1/2 VL
0V
A
RL
RO
RECEIVER
VL
OR
GND
CL
RE
tZLR
VL
RO
1/2 VL
VOL
RO
VOH
0.5V
0.5V
1/2 VL
0V
2881 F07a
tLZR
2881 F07b
tZHR
tHZR
Figure 7. Receiver Enable/Disable Time Measurements
IA
A
RO
RTE =
+
–
RECEIVER
VAB
IA
TE
VAB
VL
1/2 VL
0V
IA
B
+
–
TE
tRTEN
tRTZ
90%
10%
VB
2881 F08
Figure 8. Termination Resistance and Timing Measurements
Functional Table
LOGIC INPUTS
MODE
A, B
Y, Z
RO
DC/DC
CONVERTER
TERMINATOR
ON
RE
TE
DE
1
0
0
0
Receive
RIN
Hi-Z
Enabled
On
Off
1
0
0
1
Transceiver
RIN
Driven
Enabled
On
Off
1
1
0
1
Transmit
RIN
Driven
Hi-Z
On
Off
1
0
1
0
Receive + Term On
RTE
Hi-Z
Enabled
On
On
0
X
X
X
Off
RIN
Hi-Z
Hi-Z
Off
Off
12
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LTM2881
Applications Information
Overview
The LTM2881 µModule transceiver provides a galvanicallyisolated robust RS485/RS422 interface, powered by an
integrated, regulated DC/DC converter, complete with
decoupling capacitors. A switchable termination resistor
is integrated at the receiver input to provide proper termination to the RS485 bus. The LTM2881 is ideal for use in
networks where grounds can take on different voltages.
Isolation in the LTM2881 blocks high voltage differences
and eliminates ground loops and is extremely tolerant of
common mode transients between ground potentials. Error
free operation is maintained through common mode events
greater than 30kV/μs providing excellent noise isolation.
µModule Technology
The LTM2881 utilizes isolator µModule technology to
translate signals and power across an isolation barrier.
Signals on either side of the barrier are encoded into
pulses and translated across the isolation boundary using
coreless transformers formed in the µModule substrate.
This system, complete with data refresh, error checking,
safe shutdown on fail, and extremely high common mode
immunity, provides a robust solution for bidirectional
signal isolation. The µModule technology provides the
means to combine the isolated signaling with our RS485
transceiver and powerful isolated DC/DC converter in one
small package.
DC/DC Converter
rate, and external pins are supplied for extra decoupling
(optional) and heat dissipation. The logic supplies, VCC and
VL have a 2.2µF decoupling capacitance to GND and the
isolated supply VCC2 has a 2.2µF decoupling capacitance
to GND2 within the µModule package.
VCC2 Output
The on-board DC/DC converter provides isolated 5V power
to output VCC2. VCC2 is capable of suppling up to 1W of
power at 5V in the LTM2881-5 option and up to 600mW
of power in the LTM2881-3 option. This surplus current is
available to external applications. The amount of surplus
current is dependent upon the implementation and current
delivered to the RS485 driver and line load. An example
of available surplus current is shown in the Typical Performance Characteristics graph, VCC2 Surplus Current vs
Temperature. Figure 19 demonstrates a method of using
the VCC2 output directly and with a switched power path
that is controlled with the isolated RS485 data channel.
Driver
The driver provides full RS485 and RS422 compatibility.
When enabled, if DI is high, Y–Z is positive. When the
driver is disabled, both outputs are high impedance with
less than 10µA of leakage current over the entire common
mode range of –7V to 12V, with respect to GND2.
Driver Overvoltage and Overcurrent Protection
The driver outputs are protected from short circuits to
any voltage within the absolute maximum range of (VCC2
–15V) to (GND2 +15V) levels. The maximum VCC2 current in this condition is 250mA. If the pin voltage exceeds
about ±10V, current limit folds back to about half of the
peak value to reduce overall power dissipation and avoid
damaging the part.
The LTM2881 contains a fully integrated isolated DC/DC
converter, including the transformer, so that no external
components are necessary. The logic side contains a fullbridge driver, running about 2MHz, and is AC-coupled
to a single transformer primary. A series DC blocking
capacitor prevents transformer saturation due to driver
duty cycle imbalance. The transformer scales the primary
voltage, and is rectified by a full-wave voltage doubler.
This topology eliminates transformer saturation caused
by secondary imbalances.
The device also features thermal shutdown protection
that disables the driver and receiver output in case of
excessive power dissipation (See Note 4 in the Electrical
Characteristics section).
The DC/DC converter is connected to a low dropout reg
ulator (LDO) to provide a regulated low noise 5V output.
SLO Mode
The internal power solution is sufficient to support the
transceiver interface at its maximum specified load and data
The LTM2881 features a logic-selectable reduced slew rate
mode (SLO mode) that softens the driver output edges to
For more information www.linear.com/LTM2881
2881fi
13
LTM2881
Y-Z 10dB/DIV
Y-Z 10dB/DIV
Applications Information
0
6.25
FREQUENCY (MHz)
12.5
0
6.25
FREQUENCY (MHz)
12.5
2881 F09b
2881 F09a
Figure 9a. Frequency Spectrum SLO Mode 125kHz Input
Figure 9b. Normal Mode Frequency Spectrum 125kHz Input
reduce EMI emissions from equipment and data cables.
The reduced slew rate mode is entered by taking the SLO
pin low to GND2, where the data rate is limited to about
250kbps. Slew limiting also mitigates the adverse effects
of imperfect transmission line termination caused by stubs
or mismatched cables.
of the bus when A-B is above the input failsafe threshold
for longer than about 3µs with a hysteresis of 25mV. This
failsafe feature is guaranteed to work for inputs spanning
the entire common mode range of –7V to 12V.
Figures 9a and 9b show the frequency spectrums of the
LTM2881 driver outputs in normal and SLO mode operating at 250kbps. SLO mode significantly reduces the high
frequency harmonics.
Receiver and Failsafe
With the receiver enabled, when the absolute value of the
differential voltage between the A and B pins is greater than
200mV, the state of RO will reflect the polarity of (A-B).
During data communication the receiver detects the state
of the input with symmetric thresholds around 0V. The
symmetric thresholds preserve duty cycle for attenuated signals with slow transition rates on high capacitive
busses, or long cable lengths. The receiver incorporates
a failsafe feature that guarantees the receiver output to
be a logic-high during an idle bus, when the inputs are
shorted, left open or terminated, but not driven. The failsafe
feature eliminates the need for system level integration of
network pre-biasing by guaranteeing a logic-high on RO
under the conditions of an idle bus. Further network biasing constructed to condition transient noise during an idle
state is unnecessary due to the common mode transient
rejection of the LTM2881. The failsafe detector monitors
A and B in parallel with the receiver and detects the state
14
The receiver output is internally driven high (to VL) or
low (to GND) with no external pull-up needed. When the
receiver is disabled the RO pin becomes Hi-Z with leakage
of less than ±1µA for voltages within the supply range.
Receiver Input Resistance
The receiver input resistance from A or B to GND2 is
greater than 96k permitting up to a total of 256 receivers
per system without exceeding the RS485 receiver loading
specification. High temperature H-/MP-Grade operation
reduces the input resistance to 48k permitting 128 receivers on the bus. The input resistance of the receiver is
unaffected by enabling/disabling the receiver or by powering/unpowering the part. The equivalent input resistance
looking into A and B is shown in Figure 10.
A
>96k
60Ω
TE
60Ω
>96k
2881 F10
B
Figure 10. Equivalent Input Resistance into A and B
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LTM2881
Applications Information
Switchable Termination
Proper cable termination is very important for signal fidelity. If the cable is not terminated with its characteristic
impedance, reflections will distort the signal waveforms.
The integrated switchable termination resistor provides
logic control of the line termination for optimal perfor
mance when configuring transceiver networks.
Supply Current
The static supply current is dominated by power delivered to
the termination resistance. Power supply current increases
with data rate due to capacitive loading. Figure 14 shows
supply current versus data rate for three different loads
for the circuit configuration of Figure 4. Supply current
increases with additional external applications drawing
current from VCC2.
130
128
126
RESISTANCE (Ω)
When the TE pin is high, the termination resistor is enabled
and the differential resistance from A to B is 120Ω. Figure
11 shows the I/V characteristics between pins A and B
with the termination resistor enabled and disabled. The
resistance is maintained over the entire RS485 common
mode range of –7V to 12V as shown in Figure 12. The
integrated termination resistor has a high frequency response which does not limit performance at the maximum
specified data rate. Figure 13 shows the magnitude and
phase of the termination impedance versus frequency.
The termination resistor cannot be enabled by TE if the
device is unpowered, ON is low or the LTM2881 is in
thermal shutdown.
124
122
120
118
116
114
112
110
–10
–5
0
5
10
COMMON MODE VOLTAGE (V)
2881 G11
2881 F11
Figure 11. Curve Trace Between A and B with Termination
Enabled and Disabled
150
250
230
PHASE
210
–10
MAGNITUDE
–20
110
–30
100
0.1
–40
SUPPLY CURRENT (mA)
0
130
120
Figure 12. Termination Resistance vs Common Mode Voltage
10
PHASE (DEGREES)
MAGNITUDE (Ω)
140
15
190
170
LTM2881-3
R=54 CL=1000p
R=54 CL=100p
R=54 CL=0
150
130
110
90
LTM2881-5
R=54 CL=1000p
R=54 CL=100p
R=54 CL=0
70
1
FREQUENCY (MHz)
10
50
2881 F13
Figure 13. Termination Magnitude and Phase vs Frequency
0.1
1
DATA RATE (Mbps)
10
2881 F14
Figure 14. Supply Current vs Data Rate
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15
LTM2881
Applications Information
PROFIBUS Applications
The LTM2881 can be used in PROFIBUS-DP networks
where isolation is required. The standard PROFIBUS
termination differs from RS485 termination and is shown
in Figure 15. If used in this way, the internal termination
should remain disabled (TE low). The 390Ω resistors in
Figure 15 pre-bias the bus so that when the line is not
driven, the receiver delivers a high output. Since the
LTM2881 uses a fail-safe receiver, the pre-biasing resistors are not necessary and standard RS485 termination
can be used with control from TE.
VCC2, provides an isolated source for the external termination resistor as shown in the Figure 15. When using the
LTM2881 in PROFIBUS applications, it is recommended
that no additional loads are connected to VCC2 in order to
maintain the specified driver output swing.
3.3V (LTM2881-3)
5V (LTM2881-5)
VCC
VCC2
PWR
VL
ISOLATION BARRIER
RO
DE
DI
TE
GND
390Ω
A
PROFIBUS CABLE
TYPE A
B
Y
220Ω
SHIELD
Z
GND2
LTM2881
390Ω
2881 F15
Figure 15. PROFIBUS-DP Connections with Termination
PCB Layout Considerations
The high integration of the LTM2881 makes PCB layout
very simple. However, to optimize its electrical isolation
characteristics, EMI, and thermal performance, some
layout considerations are necessary.
•
Under heavily loaded conditions VCC and GND current
can exceed 300mA. Sufficient copper must be used
on the PCB to insure resistive losses do not cause the
supply voltage to drop below the minimum allowed
level. Similarly, the VCC2 and GND2 conductors must
be sized to support any external load current. These
heavy copper traces will also help to reduce thermal
stress and improve the thermal conductivity.
16
• Input and Output decoupling is not required, since
these components are integrated within the package.
An additional bulk capacitor with a value of 6.8µF to
22µF is recommended. The high ESR of this capacitor reduces board resonances and minimizes voltage
spikes caused by hot plugging of the supply voltage.
For EMI sensitive applications, an additional low ESL
ceramic capacitor of 1µF to 4.7µF, placed as close to
the power and ground terminals as possible, is recommended. Alternatively, a number of smaller value
parallel capacitors may be used to reduce ESL and
achieve the same net capacitance.
• Do not place copper on the PCB between the inner
columns of pads. This area must remain open to
withstand the rated isolation voltage.
• The use of solid ground planes for GND and GND2
is recommended for non-EMI critical applications to
optimize signal fidelity, thermal performance, and to
minimize RF emissions due to uncoupled PCB trace
conduction. The drawback of using ground planes,
where EMI is of concern, is the creation of a dipole
antenna structure which can radiate differential voltages formed between GND and GND2. If ground planes
are used it is recommended to minimize their area,
and use contiguous planes as any openings or splits
can exacerbate RF emissions.
•
For large ground planes a small capacitance (≤ 330pF)
from GND to GND2, either discrete or embedded within
the substrate, provides a low impedance current return
path for the module parasitic capacitance, minimizing
any high frequency differential voltages and substantially reducing radiated emissions. Discrete capacitance
will not be as effective due to parasitic ESL. In addition, voltage rating, leakage, and clearance must be
considered for component selection. Embedding the
capacitance within the PCB substrate provides a near
ideal capacitor and eliminates component selection
issues; however, the PCB must be 4 layers. Care must
be exercised in applying either technique to insure the
voltage rating of the barrier is not compromised.
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LTM2881
Applications Information
TECHNOLOGY
Figure 16a. Low EMI Demo Board Layout
Figure 16b. Low EMI Demo Board Layout (DC1746A), Top Layer
Figure 16c. Low EMI Demo Board Layout (DC1746A), Inner Layer 1
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17
LTM2881
Applications Information
Figure 16d. Low EMI Demo Board Layout (DC1746A), Inner Layer 2
Figure 16e. Low EMI Demo Board Layout (DC1746A), Bottom Layer
60
DETECTOR = QuasiPeak
50 RBW = 120kHz, VBW = 300kHz
SWEEP TIME = 17sec
40 # OF POINTS = 501
dBµV/m
30
20
10
0
–10
–20
–30
DC1746A-B
CISPR 22 CLASS 8 LIMIT
0 100 200 300 400 500 600 700 800 900 1000
FREQUENCY (MHz)
2881 F17
Figure 17. Low EMI Demo Board Emissions
18
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LTM2881
Applications Information
The PCB layout in Figures 16a to 16e show the low EMI
demo board for the LTM2881. The demo board uses a
combination of EMI mitigation techniques, including both
embedded PCB bridge capacitance and discrete GND to
GND2 capacitors. Two safety rated type Y2 capacitors
are used in series, manufactured by Murata, part number
GA342QR7GF471KW01L. The embedded capacitor effectively suppresses emissions above 400MHz, whereas
the discrete capacitors are more effective below 400MHz.
EMI performance is shown in Figure 17, measured using
a Gigahertz Transverse Electromagnetic (GTEM) cell and
method detailed in IEC 61000-4-20, “Testing and Measurement Techniques – Emission and Immunity Testing
in Transverse Electromagnetic Waveguides.”
Cable Length versus Data Rate
RF, Magnetic Field Immunity
The LTM2881 has been independently evaluated and has
successfully passed the RF and magnetic field immunity
testing requirements per European Standard EN 55024,
in accordance with the following test standards:
EN 61000-4-3 Radiated, Radio-Frequency,
Electromagnetic Field Immunity
EN 61000-4-8 Power Frequency Magnetic Field
Immunity
EN 61000-4-9 Pulsed Magnetic Field Immunity
Tests were performed using an unshielded test card designed per the data sheet PCB layout recommendations.
Specific limits per test are detailed in Table 1.
Table 1
For a given data rate, the maximum transmission distance
is bounded by the cable properties. A typical curve of
cable length versus data rate compliant with the RS485
standard is shown in Figure 18. Three regions of this
curve reflect different performance limiting factors in data
transmission. In the flat region of the curve, maximum
distance is determined by resistive loss in the cable. The
downward sloping region represents limits in distance and
rate due to the AC losses in the cable. The solid vertical
line represents the specified maximum data rate in the
RS485 standard. The dashed line at 250kbps shows the
maximum data rate when SLO is low. The dashed line at
20Mbps shows the maximum data rate when SLO is high.
TEST
EN 61000-4-3, Annex D
FREQUENCY
FIELD STRENGTH
80MHz to 1GHz
10V/m
1.4MHz to 2GHz
3V/m
2GHz to 2.7GHz
1V/m
EN 61000-4-8, Level 4
50Hz and 60Hz
30A/m
EN 61000-4-8, Level 5
60Hz
100A/m*
EN 61000-4-9, Level 5
Pulse
1000A/m
*Non IEC Method
CABLE LENGTH (FT)
10k
LOW-EMI MODE
MAX DATA RATE
1k
NORMAL
MODE MAX
DATA RATE
100
RS485 MAX
DATA RATE
10
10k
100k
1M
10M
DATA RATE (bps)
100M
2881 F18
Figure 18. Cable Length vs Data Rate
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19
LTM2881
Typical Applications
VCC
VCC
VCC
ISOLATION BARRIER
RE
TE
DE
DI
RE
TE
Y
DE
Z
DI
DIN
GND
FAULT
RO
B
DOUT
LTM2881
PWR
VL
A
RO
330k
VCC
LTM2881
B
Y
Z
GND
GND2
A
ISOLATION BARRIER
VL
GND2
2881 F20
2881 F19
Figure 20. Full-Duplex RS485 Connection
Figure 19. Isolated System Fault Detection
VCC
1.8V
VCC
RE
TE
DE
DI
OFF ON
PWR
ISOLATION BARRIER
VL
RO
A
GND
IRLML6402
B
LTM2881
330k
Z
DIN
DOUT
CMOS OUTPUT
REGULATED 5V
SWITCHED 5V
VCC2
GND2
CMOS INPUT
2881 F21
Figure 21. Switched 5V Power with Isolated CMOS Logic Connection with Low Voltage Interface
VCC
VCCB
ISOLATION BARRIER
RO
RE
DE
DI
LTM2881
LTM2881
PWR
A
B
Y
Y
51Ω
10nF
Z
51Ω
A
51Ω
Z
GND
GND2
VCC
PWR
ISOLATION BARRIER
VCC
VL
VL
DE
DI
RE
RO
B
51Ω
10nF
GND2
BUS INHERITED
GND
2881 F22
B
Figure 22. 4-Wire Full Duplex Self Biasing for Unshielded CAT5 Connection
20
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1.905
3.175
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
aaa Z
0.630 ±0.025 Ø 32x
0.635
PACKAGE TOP VIEW
E
0.635
4
1.905
3.175
4.445
Y
X
D
For more information www.linear.com/LTM2881
6.350
5.080
0.000
5.080
6.350
aaa Z
2.45 – 2.55
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
NOM
3.42
0.60
2.82
0.75
0.63
15.0
11.25
1.27
12.70
8.89
DIMENSIONS
0.15
0.10
0.20
0.30
0.15
MAX
3.62
0.70
2.92
0.90
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 32
MIN
3.22
0.50
2.72
0.60
0.60
b1
0.27 – 0.37
SUBSTRATE
ddd M Z X Y
eee M Z
DETAIL A
Øb (32 PLACES)
DETAIL B
MOLD
CAP
ccc Z
A1
A2
A
Z
(Reference LTC DWG # 05-08-1851 Rev D)
// bbb Z
PIN “A1”
CORNER
4.445
BGA Package
32-Lead (15mm × 11.25mm × 3.42mm)
e
b
7
5
G
4
e
3
PACKAGE BOTTOM VIEW
6
2
1
L
K
J
H
G
F
E
D
C
B
A
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
3
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
7
!
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
BGA 32 1112 REV D
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
7
SEE NOTES
PIN 1
SEE NOTES
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
F
b
8
DETAIL A
LTM2881
Package Description
Please refer to http://www.linear.com/product/LTM2881#packaging for the most recent package drawings.
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21
4
For more information www.linear.com/LTM2881
3.175
1.905
SUGGESTED PCB LAYOUT
TOP VIEW
0.635
PACKAGE TOP VIEW
11.25
BSC
0.635
PAD “A1”
CORNER
1.905
Y
X
6.350
5.080
0.000
5.080
6.350
DETAIL c
15.00
BSC
aaa Z
2.400 – 2.600
eee S X Y
0.290 – 0.350
SUBSTRATE
DETAIL C
0.630 ±0.025 Ø 32x
DETAIL B
eee S X Y
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
7
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.10
bbb
0.10
eee
0.05
!
6. THE TOTAL NUMBER OF PADS: 32
5. PRIMARY DATUM -Z- IS SEATING PLANE
LAND DESIGNATION PER JESD MO-222
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
0.630 ±0.025 Ø 32x
DETAIL B
MOLD
CAP
2.69 – 2.95
(Reference LTC DWG # 05-08-1773 Rev A)
bbb Z
22
Z
LGA Package
32-Lead (15mm × 11.25mm × 2.82mm)
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
12.70
BSC
8
DETAIL A
7
8.89
BSC
5
4
3
1.27
BSC
2
1
L
K
J
H
G
F
E
D
C
B
A
7
LGA 32 0113 REV A
3
PADS
SEE NOTES
PAD 1
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
PACKAGE BOTTOM VIEW
6
SEE NOTES
LTM2881
Package Description
Please refer to http://www.linear.com/product/LTM2881#packaging for the most recent package drawings.
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4.445
3.175
4.445
aaa Z
LTM2881
Revision History
REV
DATE
DESCRIPTION
PAGE NUMBER
A
3/10
Changes to Features, Description and Typical Application
Add BGA Package to Pin Configuration, Order Information and Package Description Sections
1
2, 19
Changes to LGA Package in Pin Configuration Section
2
Changes to Electrical Characteristics Section
3
Changes to Graphs G09, G13, G14
6, 7
Update to Pin Functions
8
Update to Applications Information
12
Change to X-Axis on Figures 9a and 9b
13
Update to Supply Current Section
14
“PCB Layout Isolation Considerations” Section Replaced
15
RF, Magnetic Field Immunity Section Added
16
Changes to Related Parts
22
B
8/10
H-Grade parts added. Reflected throughout the data sheet.
1-22
C
5/11
HV-Grade parts removed. Reflected throughout the data sheet.
1-24
Updated the PCB Layout section.
Updated the Related Parts.
15, 16, 17
24
D
1/12
HV and MPY parts added. Reflected throughout the data sheet.
E
4/12
Added H/MP-Grade condition for IOZD
3
Corrected Figure 15
15
F
2/13
Storage Temperature Range corrected
2
G
4/14
Added lead finish part numbers
3
H
8/14
I
4/16
J
11/16
1-24
Added CTI and DTI parameters
6
ICC2S, VCC2 Short-Circuit Current: Deleted max spec. Added typical spec. Removed temp dot.
4
Added CSA information
1
Changed ICCS limits
4
Corrected LGA Part Marking
3
2881fi
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its information
circuits as described
herein will not infringe on existing patent rights.
For more
www.linear.com/LTM2881
23
LTM2881
Typical Application
VCCC
VCCA
VCC
LTM2881
PWR
VL
ISOLATION BARRIER
CABLE SHIELD
OR GROUND RETURN
Y
Y
Z
Z
GND2
A
VCC2
DE
DI
GND
GND2
A
RE
TE
C
Z
GND
B
VL
RO
PWR
GND2
DI
B
Y
DE
A
B
VCC1
RE
TE
A
PWR
ISOLATION BARRIER
RO
VCC
LTM2881
ISOLATION BARRIER
GND
DI
DE
TE
RE
RO
VCC
VL
VCCB
LTM2881
2881 F23
B
B
Figure 23. Multi-Node Network with End Termination
and Single Ground Connection on Isolation Bus
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LTM2882
Dual Isolated RS232 µModule Transceiver + Power
1Mbps, ±10kV HBM ESD, 2500VRMS
LTC1535
Isolated RS485 Transceiver
2500VRMS Isolation in Surface Mount Package
LT1785
±60V Fault-Protected Transceiver
Half Duplex
LT1791
±60V Fault-Protected Transceiver
Full Duplex
LTC2861
20Mbps RS485 Transceivers with Integrated Switchable Termination
Full Duplex 15kV ESD
LTC2870/LTC2871
RS232/RS485 Multiprotocol Transceivers with Integrated Termination
20Mbps RS485 and 500kbps RS232,
±26kV ESD, 3V to 5V Operation
LTC2862/LTC2863/ ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceivers
LTC2864/LTC2865
20Mbps or 250kbps, ±15kV HBM ESD,
±25V Common Mode Range
LTM2883
SPI/Digital or I2C Isolated µModule with Adjustable 5V and ±12V Rails
2500VRMS Isolation with Power in BGA Package
LTM2892
SPI/Digital or I2C Isolated µModule
3500VRMS Isolation, 6 Channels
24 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTM2881
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTM2881
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LT 1116 REV J • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 2009
工商网监
湘ICP备2023018690号
