DATA SHEET
LND820/821/822/823
POWER MOSFET
GENERAL DESCRIPTION
The LND820 series provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
FEATURES
•
VDSS =450V-500V RDS (on) = 3.0 Ω-4.0 Ω ID=2.2A and 2.5A
• • • • •
Dynamic dv/dt Rating Repetitive Avalanche rated Fast Switching Ease of Paralleling Simple Drive Requirement
SYMBOL
PIN DIAGRAM
TO-220
• Linear Dimensions, Inc. • 445 East Ohio Street, Chicago IL 60611 USA • tel 312.321.1810 • fax 312.321.1830 • www.lineardimensions.com •
LND820/821/822/823
ABSOLUTE MAXIMUM RATING
Symbol
ID@Tc=25ºC ID@Tc=100ºC IDM PD @Tc=25ºC ID@Tc=25ºC VGS EAS IAR EAR dv/dt TJ TSTG
Parameter
Continuous Drain Current,VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current(1) Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy(2) Avalanche Current (1) Repetitive Avalanche Energy (1) Peak Diode Recovery dv/dt(3) Operating Junction and Storage temperature Range Soldering Temperature, for 10 seconds
Max
2.5 1.6 8.0 50 0.40 ±20 210 2.5 5.0 3.5 -55 to +150 300 (1.6mm from case)
Units
A W W/ºC V mJ A mJ V/ns
ºC
THERMAL RESISTANCE
Symbol
RoJC RoCS RoJA
Parameter
Junction-to-case Case-to-Sink, Flat, Greased Surface Junction-to-Ambint
Min
-
Typ
0.50 -
Max
2.5 62
Units
ºC/W
• Linear Dimensions, Inc. • 445 East Ohio Street, Chicago IL 60611 USA • tel 312.321.1810 • fax 312.321.1830 • www.lineardimensions.com •
LND820/821/822/823
ELECTRICAL CHARACTERISTICS
(TC=25°C unless otherwise specified)
Symbol V(BR)DSS ∆V(BR)DSS / ∆T J ID(on) RDS(ON) VGS(th) gfs IDSS IGSS
Parameter Drain-to-source Breakdown Voltage Breakdown Voltage Temp. Coefficient On-State Drain Current(Note 2) Static Drain-to-Source OnResistace Gate Threshold Voltage Forward Transconductance Drain-to-source Leakage Current (TC=125ºC) Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-drain(“Miller”) Charge Turn-on Delay Time Rise time Turn-off Delay time Fall time Internal Drain Inductance Input Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance LND820/821 LND821/823 LND820/821 LND822/823 LND-820/822 LND821/823
Conditions VGS=0V, ID = 250µA Reference to 25ºC ID=1mA VGS > ID(on) x RDS(on)Max, VGS=10V VGS =0V,ID =1.5A(4) VDS=VGS, ID=250µA VDS=50V,ID =1.5A(4) VDS=500V,VGS =0V VDS= 400V,VGS = 0V VGS=-20V VGS=-20V ID=2.1A VDS=400V VGS =10V (4) VDD =250V ID=2.1A RG=18Ω RD=100Ω (4) Between lead 6mm (0.25 in.) From package and center of die contact VGS=0V VDS=25V F=1.0 MHz
Min 500 450 2.5 2.2
Typ 0.59 -
Max 3.0 4.0
Units V V/ºC A Ω V S µA µA nA
2.0 1.5 -
-
4.0 25 250
8.0 8.6 33 16 4.5
100 -100 24 3.3 13
Qg Qqs
nC
td(on) tr td(off) tf LD LS Ciss Coss Crss
ns
nH 7.5 360 92 37
pF
• Linear Dimensions, Inc. • 445 East Ohio Street, Chicago IL 60611 USA • tel 312.321.1810 • fax 312.321.1830 • www.lineardimensions.com •
LND820/821/822/823
SOURCE-DRAIN RATING AND CHARACTERISTICS
Symbol IS ISM VSD trr Qrr tON Parameter Continuous Source Current Pulsed Source Current (Body Diode) (1) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Conditions MOSFET symbol showing the integral reverse p-n junction diode TJ=25°C, IS=2.5A, VGS=0V(4) TJ=25°C, IF=2.1A, di/dt=100A/µs (4) Min Typ Max 2.5 A 8.0 1.6 520 V nS Units
0.70 1.4 µC Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes : 1 : Repetitvie rating :pulse width limited by max. junction temperature 2 : VDD=50V, starting TJ =25°C,L=60mH RG=25Ω, IAS =2.5A 3 : ISD ≤ 2.5A, di/dt≤50 A/µs, VDD ≤ V(BR)DSS ,TJ≤150°C 4 : Pulse width≤ 300µs; duty cycle≤ 2%
• Linear Dimensions, Inc. • 445 East Ohio Street, Chicago IL 60611 USA • tel 312.321.1810 • fax 312.321.1830 • www.lineardimensions.com •
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