LT1766/LT1766-5 5.5V to 60V 1.5A, 200kHz Step-Down Switching Regulator FEATURES
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DESCRIPTION
The LT®1766/LT1766-5 are 200kHz monolithic buck switching regulators that accept input voltages up to 60V. A high efficiency 1.5A, 0.2Ω switch is included on the die along with all the necessary oscillator, control and logic circuitry. A current mode control architecture delivers fast transient response and excellent loop stability. Special design techniques and a new high voltage process achieve high efficiency over a wide input range. Efficiency is maintained over a wide output current range by using the output to bias the circuitry and by utilizing a supply boost capacitor to saturate the power switch. Patented circuitry maintains peak switch current over the full duty cycle range. A shutdown pin reduces supply current to 25μA and the device can be externally synchronized from 228kHz to 700kHz with logic-level inputs. The LT1766/LT1766-5 are available in a 16-pin fused-lead SSOP package or a TSSOP package with exposed backside for improved thermal performance.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 6498466, 6531909.
Wide Input Range: 5.5V to 60V 1.5A Peak Switch Current Constant 200kHz Switching Frequency Saturating Switch Design: 0.2Ω Peak Switch Current Rating Maintained Over Full Duty Cycle Range Low Effective Supply Current: 2.5mA Low Shutdown Current: 25μA 1.2V Feedback Reference Voltage (LT1766) 5V Fixed Output (LT1766-5) Easily Synchronizable Cycle-by-Cycle Current Limiting Small 16-Pin SSOP and Thermally Enhanced TSSOP Packages
APPLICATIONS
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High Voltage, Industrial and Automotive Portable Computers Battery-Powered Systems Battery Chargers Distributed Power Systems
TYPICAL APPLICATION
5V Buck Converter
1N4148W 6 VIN* 5.5V TO 60V 4 2.2μF 100V CERAMIC OFF ON 15 14
†
Efficiency vs Load Current
0.33μF SW 2 47μH 100 VOUT 5V 1A VOUT = 5V L = 47μH VIN = 12V
BOOST VIN LT1766 SHDN SYNC GND BIAS FB VC
10MQ060N 10 12 15.4k 4.99k
+
90 EFFICIENCY (%) VIN = 42V 80
100μF 10V SOLID TANTALUM
70
1, 8, 9, 16 11 2.2k 0.022μF
1766 TA01
60 220pF 50 0 0.25 0.75 1.00 0.50 LOAD CURRENT (A) 1.25
1766 TA02
*FOR INPUT VOLTAGES BELOW 7.5V, SOME RESTRICTIONS MAY APPLY † TDK C4532X7R2A225K
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LT1766/LT1766-5 ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Voltage (VIN) .................................................. 60V BOOST Pin Above SW .............................................. 35V BOOST Pin Voltage ................................................. 68V SYNC, SENSE Voltage (LT1766-5) ............................. 7V SHDN Voltage ............................................................ 6V BIAS Pin Voltage ..................................................... 30V FB Pin Voltage/Current (LT1766) ................... 3.5V/2mA
Operating Junction Temperature Range LT1766EFE/LT1766EFE-5/LT1766EGN/ LT1766EGN-5 (Note 8,10) ....................–40°C to 125°C LT1766IFE/LT1766IFE-5/ LT1766IGN/LT1766IGN-5 (Note 8,10) ..–40°C to 125°C LT1766HFE ..........................................–40°C to 140°C Storage Temperature Range .................. –65°C to 150°C Lead Temperature (Soldering, 10 sec) .................. 300°C
PIN CONFIGURATION
TOP VIEW GND SW NC VIN NC BOOST NC GND 1 2 3 4 5 6 7 8 17 GND 16 GND 15 SHDN 14 SYNC 13 NC 12 FB/SENSE 11 VC 10 BIAS 9 GND GND SW NC VIN NC BOOST NC GND 1 2 3 4 5 6 7 8 TOP VIEW 16 GND 15 SHDN 14 SYNC 13 NC 12 FB/SENSE 11 VC 10 BIAS 9 GND
FE PACKAGE 16-LEAD PLASTIC TSSOP θJA = 45°C, θJC (PIN 17) = 10°C/W EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
GN PACKAGE 16-LEAD PLASTIC SSOP θJA = 85°C, θJC (PIN 8) = 25°C/W FOUR CORNER PINS SOLDERED TO GROUND PIN
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LT1766/LT1766-5 ORDER INFORMATION
LEAD FREE FINISH LT1766EFE#PBF LT1766IFE#PBF LT1766HFE#PBF LT1766EFE-5#PBF LT1766IFE-5#PBF LT1766EGN#PBF LT1766IGN#PBF LT1766EGN-5#PBF LT1766IGN-5#PBF LEAD BASED FINISH LT1766EFE LT1766IFE LT1766HFE LT1766EFE-5 LT1766IFE-5 LT1766EGN LT1766IGN LT1766EGN-5 LT1766IGN-5 TAPE AND REEL LT1766EFE#TRPBF LT1766IFE#TRPBF LT1766HFE#TRPBF LT1766EFE-5#TRPBF LT1766IFE-5#TRPBF LT1766EGN#TRPBF LT1766IGN#TRPBF LT1766EGN-5#TRPBF LT1766IGN-5#TRPBF TAPE AND REEL LT1766EFE#TR LT1766IFE#TR LT1766HFE#TR LT1766EFE-5#TR LT1766IFE-5#TR LT1766EGN#TR LT1766IGN#TR LT1766EGN-5#TR LT1766IGN-5#TR PART MARKING 1766EFE 1766IFE 1766HFE 1766EFE-5 1766IFE-5 1766 1766I 17665 1766I5 PART MARKING 1766EFE 1766IFE 1766HFE 1766EFE-5 1766IFE-5 1766 1766I 17665 1766I5 PACKAGE DESCRIPTION 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP PACKAGE DESCRIPTION 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic TSSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP 16-Lead Plastic SSOP TEMPERATURE RANGE 0°C to 125°C –40°C to 125°C –40°C to 140°C 0°C to 125°C –40°C to 125°C 0°C to 125°C –40°C to 125°C 0°C to 125°C –40°C to 125°C TEMPERATURE RANGE 0°C to 125°C –40°C to 85°C –40°C to 140°C 0°C to 125°C –40°C to 125°C 0°C to 125°C –40°C to 125°C 0°C to 125°C –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
(LT1766E/LT1766I Grade) The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.
PARAMETER Reference Voltage (VREF) (LT1766) SENSE Voltage (LT1766-5) SENSE Pin Resistance (LT1766-5) FB Input Bias Current (LT1766) Error Amp Voltage Gain Error Amp gm VC to Switch gm EA Source Current EA Sink Current VC Switching Threshold VC High Clamp Switch Current Limit FB = 1V or VSENSE = 4.1V FB = 1.4V or VSENSE = 5.7V Duty Cycle = 0 SHDN = 1V VC Open, Boost = VIN + 5V, FB = 1V or VSENSE = 4.1V
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ELECTRICAL CHARACTERISTICS
CONDITIONS 5.5V ≤ VIN ≤ 60V VOL + 0.2 ≤ VC ≤ VOH – 0.2 5.5V ≤ VIN ≤ 60V VOL + 0.2V ≤ VC ≤ VOH – 0.2V
l l
MIN 1.204 1.195 4.94 4.90 9.5
TYP 1.219 5 13.8 –0.5 400 2000 1.7
MAX 1.234 1.243 5.06 5.10 19 –1.5 3000 4200 400 450
UNITS V V V V kΩ μA V/V μMho μMho A/V μA μA V V
(Notes 2, 9) dl (VC) = ±10μA (Note 9)
l
200 1500 1000 125 100
225 225 0.9 2.1
1.5
2
3
A
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LT1766/LT1766-5
(LT1766E/LT1766I Grade) The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.
PARAMETER Switch On-Resistance Maximum Switch Duty Cycle Switch Frequency fSW Line Regulation fSW Frequency Shifting Threshold Minimum Input Voltage Minimum Boost Voltage Boost Current (Note 5) Input Supply Current (IVIN) Bias Supply Current (IBIAS) Shutdown Supply Current Lockout Threshold Shutdown Thresholds Minimum SYNC Amplitude SYNC Frequency Range SYNC Input Resistance CONDITIONS ISW = 1.5A, Boost = VIN + 5V (Note 7) FB = 1V or VSENSE = 4.1V VC Set to Give DC = 50% 5.5V ≤ VIN ≤ 60V Df = 10kHz (Note 3) (Note 4) ISW ≤ 1.5A Boost = VIN + 5V, ISW = 0.5A Boost = VIN + 5V, ISW = 1.5A (Note 6) VBIAS = 5V (Note 6) VBIAS = 5V SHDN = 0V, VIN ≤ 60V, SW = 0V, VC Open VC Open VC Open, Shutting Down VC Open, Starting Up
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ELECTRICAL CHARACTERISTICS
MIN
TYP 0.2
MAX 0.3 0.4
UNITS Ω Ω % %
93 90 184 172
96 200 200 0.05 0.8 4.6 1.8 12 45 1.4 2.9 25 5.5 3 25 70 2.2 4.2 75 200 2.53 0.6 0.6 2.2 700 20 216 228 0.15
kHz kHz %/V V V V mA mA mA mA μA μA V V V V kHz kΩ
2.3 0.15 0.25 228
2.42 0.37 0.45 1.5
(LT1766H Grade) The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.
PARAMETER Reference Voltage (VREF) FB Input Bias Current Error Amp Voltage Gain Error Amp gm VC to Switch gm EA Source Current EA Sink Current VC Switching Threshold VC High Clamp Switch Current Limit Switch On Resistance Maximum Switch Duty Cycle Switch Frequency FB = 1V or VSENSE = 4.1V FB = 1.4V or VSENSE = 5.7V Duty Cycle = 0 SHDN = 1V VC Open, Boost = VIN + 5V, FB = 1V or VSENSE = 4.1V ISW = 0.75A, Boost = VIN + 5V (Note 7) FB = 1V or VSENSE = 4.1V VC Set to Give DC = 50%
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CONDITIONS 5.5V ≤ VIN ≤ 60V VOL + 0.2 ≤ VC ≤ VOH – 0.2 (Notes 2, 9) dl (VC) = ±10μA (Note 9)
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MIN 1.204 1.175 200 1500 900 125 100
TYP 1.219 –0.5 400 2000 1.7 225 225 0.9 2.1
MAX 1.234 1.265 –1.5 3000 4200 400 450
UNITS V V μA V/V μMho μMho A/V μA μA V V
0.75
2 0.2
3 0.3 0.8
A Ω Ω % %
93 90 184 135
96 200 200 216 228
kHz kHz
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LT1766/LT1766-5
(LT1766H Grade) The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.
PARAMETER fSW Line Regulation fSW Frequency Shifting Threshold Minimum Input Voltage Minimum Boost Voltage Boost Current (Note 5) Input Supply Current (IVIN) Bias Supply Current (IBIAS) Shutdown Supply Current Lockout Threshold Shutdown Thresholds Minimum SYNC Amplitude SYNC Frequency Range SYNC Input Resistance Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: Gain is measured with a VC swing equal to 200mV above the low clamp level to 200mV below the upper clamp level. Note 3: Minimum input voltage is not measured directly, but is guaranteed by other tests. It is defined as the voltage where internal bias lines are still regulated so that the reference voltage and oscillator remain constant. Actual minimum input voltage to maintain a regulated output will depend upon output voltage and load current. See Applications Information. Note 4: This is the minimum voltage across the boost capacitor needed to guarantee full saturation of the internal power switch. Note 5: Boost current is the current flowing into the BOOST pin with the pin held 5V above input voltage. It flows only during switch on time. Note 6: Input supply current is the quiescent current drawn by the input pin when the BIAS pin is held at 5V with switching disabled. Bias supply current is the current drawn by the BIAS pin when the BIAS pin is held at 5V. Total input referred supply current is calculated by summing input supply current (IVIN) with a fraction of bias supply current (IBIAS): ITOTAL = IVIN + (IBIAS)(VOUT/VIN) with VIN = 15V, VOUT = 5V, IVIN = 1.4mA, IBIAS = 2.9mA, ITOTAL = 2.4mA. CONDITIONS 5.5V ≤ VIN ≤ 60V Df = 10kHz (Note 3) (Note 4) ISW ≤ 0.75A Boost = VIN + 5V, ISW = 0.5A Boost = VIN + 5V, ISW = 0.75A (Note 6) VBIAS = 5V (Note 6) VBIAS = 5V SHDN = 0V, VIN ≤ 60V, SW = 0V, VC Open VC Open VC Open, Shutting Down VC Open, Starting Up
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ELECTRICAL CHARACTERISTICS
MIN
TYP 0.05 0.8 4.6 1.8 12 45 1.4 2.9 25
MAX 0.15 5.5 3 40 100 2.2 4.2 120 500 2.68 0.9 0.9 2.2 700
UNITS %/V V V V mA mA mA mA μA μA V V V V kHz kΩ
2.3 0.15 0.25 228
2.42 0.37 0.45 1.5 20
Note 7: Switch on-resistance is calculated by dividing VIN to SW voltage by the forced current. See Typical Performance Characteristics for the graph of switch voltage at other currents. Note 8: The LT1766EGN, LT1766EGN-5, LT1766EFE and LT1766EFE-5 are guaranteed to meet performance specifications from 0°C to 125°C junction temperature. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LT1766IGN, LT1766IGN-5, LT1766IFE and LT1766IFE-5 are guaranteed over the full –40°C to 125°C operating junction temperature range. The LT1766HGN and LT1766HFE are guaranteed over the full –40°C to 140°C operating junction temperature range. Note 9: Transconductance and voltage gain refer to the internal amplifier exclusive of the voltage divider. To calculate gain and transconductance, refer to the SENSE pin on fixed voltage parts. Divide the values shown by the ratio VOUT/1.219. Note 10: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 140°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. Note 11: High junction temperatures degrade operating lifetimes. Operating lifetime at junction temperatures between 125°C and 140°C is derated to 1000 hours.
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LT1766/LT1766-5 TYPICAL PERFORMANCE CHARACTERISTICS
Switch Peak Current Limit
2.5 TA = 25°C
FB Pin Voltage and Current
1.234 1.229 2.0 250 200 1.5 VOLTAGE 1.219 CURRENT 1.214 0.5 1.209 6 0 25 50 75 100 125 150 0 JUNCTION TEMPERATURE (°C)
1766 G02
SHDN Pin Bias Current
CURRENT REQUIRED TO FORCE SHUTDOWN (FLOWS OUT OF PIN). AFTER SHUTDOWN, CURRENT DROPS TO A FEW μA
SWITCH PEAK CURRENT (A)
CURRENT (μA)
2.0
TYPICAL
FEEDBACK VOLTAGE (V)
1.224 1.0
150 100 12
CURRENT (μA)
1.5
GUARANTEED MINIMUM
AT 2.38V STANDBY THRESHOLD (CURRENT FLOWS OUT OF PIN)
1.0 0 20 40 60 DUTY CYCLE (%) 80 100
1766 G01
1.204 –50 –25
0 –50 –25
25 50 75 100 125 150 0 JUNCTION TEMPERATURE (°C)
1766 G03
Lockout and Shutdown Thresholds
2.4 40 LOCKOUT
Shutdown Supply Current
VSHDN = 0V 35 TA = 25°C 300 250
Shutdown Supply Current
TA = 25°C
INPUT SUPPLY CURRENT (μA)
INPUT SUPPLY CURRENT (μA)
2.0 SHDN PIN VOLTAGE (V) 1.6 1.2 0.8
30 25 20 15 10 5 0 0 10 20 30 40 INPUT VOLTAGE (V) 50 60
1766 G05
VIN = 60V 200 VIN = 15V 150 100 50 0 0 0.1 0.2 0.3 0.4 SHUTDOWN VOLTAGE (V) 0.5
1766 G06
START-UP 0.4 SHUTDOWN 0 25 50 75 100 125 150 –50 –25 0 JUNCTION TEMPERATURE (°C)
1766 G04
Error Amplifier Transconductance
2500
3000
Error Amplifier Transconductance
TA = 25°C PHASE 200
Frequency Foldback
600
SWITICHING FREQUENCY (kHz) OR FB CURRENT (μA)
TA = 25°C
TRANSCONDUCTANCE (μmho)
2000
GAIN (μMho)
2500 GAIN
150
500 400 300 200 100 FB PIN CURRENT 0 0 0.5 VFB (V) 1.0 1.5
1766 G09
PHASE (DEG)
1500
2000
100
ROUT 200k VC COUT 12pF
1000
1500
VFB 2 • 10
(
–3
)
50
SWITCHING FREQUENCY
500
1000
ERROR AMPLIFIER EQUIVALENT CIRCUIT
0
RLOAD = 50Ω
0 –50 –25
0
25
50
75
100 125 150
1766 G07
500 100
1k
JUNCTION TEMPERATURE (°C)
10k 100k FREQUENCY (Hz)
1M
–50 10M
1766 G08
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LT1766/LT1766-5 TYPICAL PERFORMANCE CHARACTERISTICS
Switching Frequency
230 220 210 200 190 180 170 –50 –25 7.5
Minimum Input Voltage with 5V Output
TA = 25°C 45 40
BOOST Pin Current
TA = 25°C
BOOST PIN CURRENT (mA)
1
7.0
35 30 25 20 15 10 5 0 0 0.5 1 SWITCH CURRENT (A) 1.5
1766 G12
INPUT VOLTAGE (V)
FREQUENCY (kHz)
6.5 MINIMUM INPUT VOLTAGE TO START 6.0
5.5
MINIMUM INPUT VOLTAGE TO RUN
0
25
50
75
100 125
150
5.0
0
JUNCTION TEMPERATURE (°C)
1766 G10
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 LOAD CURRENT (A)
1766 G11
VC Pin Shutdown Threshold
2.1 1.9
THRESHOLD VOLTAGE (V)
Switch Voltage Drop
450 TJ = 150°C TJ = 125°C TJ = 25°C
SWITCH MINIMUM ON TIME (ns)
Switch Minimum On-Time vs Temperature
600 500 400 300 200 100 0 –50 –25
400
1.7 1.5 1.3 1.1 0.9 0.7 –50 –25
SWITCH VOLTAGE (mV)
350 300 250 200 150 100 50 TJ = –40°C
25 50 75 100 125 150 0 JUNCTION TEMPERATURE (°C)
1766 G13
0
0
0.5 1 SWITCH CURRENT (A)
1.5
1766 G14
25 50 75 100 125 150 0 JUNCTION TEMPERATURE (°C)
1766 G15
PIN FUNCTIONS
GND (Pins 1, 8, 9, 16, 17): The GND pin connections act as the reference for the regulated output, so load regulation will suffer if the ground end of the load is not at the same voltage as the GND pins of the IC. This condition will occur when load current or other currents flow through metal paths between the GND pins and the load ground. Keep the paths between the GND pins and the load ground short and use a ground plane when possible. The GND pin also acts as a heat sink and should be soldered to a large copper plane to reduce thermal resistance. For the FE package, the exposed pad should be soldered to the copper ground plane underneath the device. (See Applications Information—Layout Considerations.) SW (Pin 2): The switch pin is the emitter of the on-chip power NPN switch. This pin is driven up to the input pin voltage during switch on-time. Inductor current drives the switch pin negative during switch off-time. Negative voltage is clamped with the external catch diode. Maximum negative switch voltage allowed is – 0.8V. NC (Pins 3, 5, 7, 13): No Connection.
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LT1766/LT1766-5 PIN FUNCTIONS
VIN (Pin 4): This is the collector of the on-chip power NPN switch. VIN powers the internal control circuitry when a voltage on the BIAS pin is not present. High dI/dt edges occur on this pin during switch turn on and off. Keep the path short from the VIN pin through the input bypass capacitor, through the catch diode back to SW. All trace inductance on this path will create a voltage spike at switch off, adding to the VCE voltage across the internal NPN. BOOST (Pin 6): The BOOST pin is used to provide a drive voltage, higher than the input voltage, to the internal bipolar NPN power switch. Without this added voltage, the typical switch voltage loss would be about 1.5V. The additional BOOST voltage allows the switch to saturate and voltage loss approximates that of a 0.2Ω FET structure, but with much smaller die area. BIAS (Pin 10): The BIAS pin is used to improve efficiency when operating at higher input voltages and light load current. Connecting this pin to the regulated output voltage forces most of the internal circuitry to draw its operating current from the output voltage rather than the input supply. This architecture increases efficiency especially when the input voltage is much higher than the output. Minimum output voltage setting for this mode of operation is 3V. VC (Pin 11) The VC pin is the output of the error amplifier and the input of the peak switch current comparator. It is normally used for frequency compensation, but can also serve as a current clamp or control loop override. VC sits at about 0.9V for light loads and 2.1V at maximum load. It can be driven to ground to shut off the regulator, but if driven high, current must be limited to 4mA. FB/SENSE (Pin 12): The feedback pin is used to set the output voltage using an external voltage divider that generates 1.22V at the pin for the desired output voltage. The 5V fixed output voltage parts have the divider included on the chip and the FB pin is used as a SENSE pin, connected directly to the 5V output. Three additional functions are performed by the FB pin. When the pin voltage drops below 0.6V, switch current limit is reduced and the external SYNC function is disabled. Below 0.8V, switching frequency is also reduced. See Feedback Pin Functions in Applications Information for details. SYNC (Pin 14): The SYNC pin is used to synchronize the internal oscillator to an external signal. It is directly logic compatible and can be driven with any signal between 10% and 90% duty cycle. The synchronizing range is equal to initial operating frequency up to 700kHz. See Synchronizing in Applications Information for details. SHDN (Pin 15): The SHDN pin is used to turn off the regulator and to reduce input drain current to a few microamperes. This pin has two thresholds: one at 2.38V to disable switching and a second at 0.4V to force complete micropower shutdown. The 2.38V threshold functions as an accurate undervoltage lockout (UVLO); sometimes used to prevent the regulator from delivering power until the input voltage has reached a predetermined level. If the SHDN pin functions are not required, the pin can either be left open (to allow an internal bias current to lift the pin to a default high state) or be forced high to a level not to exceed 6V.
BLOCK DIAGRAM
The LT1766 is a constant frequency, current mode buck converter. This means that there is an internal clock and two feedback loops that control the duty cycle of the power switch. In addition to the normal error amplifier, there is a current sense amplifier that monitors switch current on a cycle-by-cycle basis. A switch cycle starts with an oscillator pulse which sets the RS flip-flop to turn the switch on. When switch current reaches a level set by the inverting input of the comparator, the flip-flop is reset and the switch turns off. Output voltage control is obtained by using the output of the error amplifier to set the switch current trip point. This technique means that the error amplifier commands current to be delivered to the output rather than voltage. A voltage fed system will have low phase shift up to the resonant frequency of the inductor and output capacitor, then an abrupt 180° shift will occur. The current fed system
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LT1766/LT1766-5 BLOCK DIAGRAM
will have 90° phase shift at a much lower frequency, but will not have the additional 90° shift until well beyond the LC resonant frequency. This makes it much easier to frequency compensate the feedback loop and also gives much quicker transient response. Most of the circuitry of the LT1766 operates from an internal 2.9V bias line. The bias regulator normally draws power from the regulator input pin, but if the BIAS pin is connected to an external voltage higher than 3V, bias power will be drawn from the external source (typically the regulated output voltage). This will improve efficiency if the BIAS pin voltage is lower than regulator input voltage. High switch efficiency is attained by using the BOOST pin to provide a voltage to the switch driver which is higher than the input voltage, allowing switch to be saturated. This boosted voltage is generated with an external capacitor and diode. Two comparators are connected to the shutdown pin. One has a 2.38V threshold for undervoltage lockout and the second has a 0.4V threshold for complete shutdown.
VIN
4 RLIMIT RSENSE
BIAS 10
SLOPE COMP SYNC 14 ANTISLOPE COMP SHUTDOWN COMPARATOR 200kHz OSCILLATOR
∑
0.4V 5.5μA SHDN 15
+ –
LOCKOUT COMPARATOR ×1 Q2 FOLDBACK CURRENT LIMIT CLAMP FREQUENCY FOLDBACK
VC(MAX) CLAMP
Q3
2.38V
11 VC
Figure 1. LT1766 Block Diagram
–
+
–
CURRENT COMPARATOR BOOST 6 S R RS FLIP-FLOP DRIVER CIRCUITRY Q1 POWER SWITCH 2 SW ERROR AMPLIFIER gm = 2000μMho 12 FB 1.22V GND 1, 8, 9, 16, 17
1766 F01
+
2.9V BIAS REGULATOR
INTERNAL VCC
–
+
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LT1766/LT1766-5 APPLICATIONS INFORMATION
FEEDBACK PIN FUNCTIONS The feedback (FB) pin on the LT1766 is used to set output voltage and provide several overload protection features. The first part of this section deals with selecting resistors to set output voltage and the remaining part talks about foldback frequency and current limiting created by the FB pin. Please read both parts before committing to a final design. The 5V fixed output voltage part (LT1766-5) has internal divider resistors and the FB pin is renamed SENSE, connected directly to the output. The suggested value for the output divider resistor (see Figure 2) from FB to ground (R2) is 5k or less, and a formula for R1 is shown below. The output voltage error caused by ignoring the input bias current on the FB pin is less than 0.25% with R2 = 5k. A table of standard 1% values is shown in Table 1 for common output voltages. Please read the following if divider resistors are increased above the suggested values. R1 =
Table 1
OUTPUT VOLTAGE (V) 3 3.3 5 6 8 10 12 15 R2 (kΩ) 4.99 4.99 4.99 4.75 4.47 4.32 4.12 4.12 R1 (NEAREST 1%) (kΩ) 7.32 8.45 15.4 18.7 24.9 30.9 36.5 46.4 % ERROR AT OUTPUT DUE TO DISCREET 1% RESISTOR STEPS +0.32 –0.43 –0.30 +0.38 +0.20 –0.54 +0.24 –0.27
regulator to operate at very low duty cycles, and the average current through the diode and inductor is equal to the short-circuit current limit of the switch (typically 2A for the LT1766, folding back to less than 1A). Minimum switch on-time limitations would prevent the switcher from attaining a sufficiently low duty cycle if switching frequency were maintained at 200kHz, so frequency is reduced by about 5:1 when the feedback pin voltage drops below 0.8V (see Frequency Foldback graph). This does not affect operation with normal load conditions; one simply sees a gear shift in switching frequency during start-up as the output voltage rises. In addition to lower switching frequency, the LT1766 also operates at lower switch current limit when the feedback pin voltage drops below 0.6V. Q2 in Figure 2 performs this function by clamping the VC pin to a voltage less than its normal 2.1V upper clamp level. This foldback current limit greatly reduces power dissipation in the IC, diode and inductor during short-circuit conditions. External synchronization is also disabled to prevent interference with foldback operation. Again, it is nearly transparent to the user under normal load conditions. The only loads that may be affected are current source loads which maintain full load current with output voltage less than 50% of final value. In these rare situations the feedback pin can be clamped above 0.6V with an external diode to defeat foldback current limit. Caution: clamping the feedback pin means that frequency shifting will also be defeated, so a combination of high input voltage and dead shorted output may cause the LT1766 to lose control of current limit. The internal circuitry which forces reduced switching frequency also causes current to flow out of the feedback pin when output voltage is low. The equivalent circuitry is shown in Figure 2. Q1 is completely off during normal operation. If the FB pin falls below 0.8V, Q1 begins to conduct current and reduces frequency at the rate of approximately 1.4kHz/μA. To ensure adequate frequency foldback (under worst-case short-circuit conditions), the external divider Thevinin resistance must be low enough to pull 115μA out of the FB pin with 0.44V on the pin (RDIV ≤ 3.8k). The net result is that reductions in frequency and current limit are affected by output voltage divider impedance. Although
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R2( VOUT − 1.22) 1.22
More Than Just Voltage Feedback The feedback pin is used for more than just output voltage sensing. It also reduces switching frequency and current limit when output voltage is very low (see the Frequency Foldback graph in Typical Performance Characteristics). This is done to control power dissipation in both the IC and in the external diode and inductor during short-circuit conditions. A shorted output requires the switching
10
LT1766/LT1766-5 APPLICATIONS INFORMATION
LT1766 TO FREQUENCY SHIFTING 1.4V ERROR AMPLIFIER Q1 VSW L1 OUTPUT 5V
+ –
Q2 TO SYNC CIRCUIT
1.2V R3 1k R4 2k BUFFER FB
R1
+
C1
R2 5k
VC
GND
1766 F02
Figure 2. Frequency and Current Limit Foldback
divider impedance is not critical, caution should be used if resistors are increased beyond the suggested values and short-circuit conditions occur with high input voltage. High frequency pickup will increase and the protection accorded by frequency and current foldback will decrease.
CHOOSING THE INDUCTOR For most applications, the output inductor will fall into the range of 15μH to 100μH. Lower values are chosen to reduce physical size of the inductor. Higher values allow more output current because they reduce peak current seen by the LT1766 switch, which has a 1.5A limit. Higher values also reduce output ripple voltage. When choosing an inductor you will need to consider output ripple voltage, maximum load current, peak inductor current and fault current in the inductor. In addition, other factors such as core and copper losses, allowable component height, EMI, saturation and cost should also be considered. The following procedure is suggested as a way of handling these somewhat complicated and conflicting requirements. Output Ripple Voltage Figure 3 shows a typical output ripple voltage waveform for the LT1766. Ripple voltage is determined by ripple current (ILP-P) through the inductor and the high frequency impedance of the output capacitor. The following equations will help in choosing the required
VOUT AT IOUT = 1A 40mV/DIV
VOUT AT IOUT = 0.1A INDUCTOR CURRENT AT IOUT = 1A INDUCTOR CURRENT AT IOUT = 0.1A 2.5μs/DIV VIN = 40V VOUT = 5V L = 47μH C = 100μF, 10V, 0.1Ω
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0.5A/DIV
Figure 3. LT1766 Ripple Voltage Waveform
inductor value to achieve a desirable output ripple voltage level. If output ripple voltage is of less importance, the subsequent suggestions in Peak Inductor and Fault Current and EMI will additionally help in the selection of the inductor value. Peak-to-peak output ripple voltage is the sum of a triwave (created by peak-to-peak ripple current (ILP-P) times ESR) and a square wave (created by parasitic inductance (ESL) and ripple current slew rate). Capacitive reactance is assumed to be small compared to ESR or ESL. VRIPPLE = (ILP-P )(ESR) + (ESL) dI dt
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LT1766/LT1766-5 APPLICATIONS INFORMATION
where: ESR = equivalent series resistance of the output capacitor ESL = equivalent series inductance of the output capacitor dI/dt = slew rate of inductor ripple current = VIN/L Peak-to-peak ripple current (ILP-P) through the inductor and into the output capacitor is typically chosen to be between 20% and 40% of the maximum load current. It is approximated by: ILP-P = If maximum load current is 0.5A, for instance, a 0.5A inductor may not survive a continuous 2A overload condition. Dead shorts will actually be more gentle on the inductor because the LT1766 has frequency and current limit foldback. Peak switch and inductor current can be significantly higher than output current, especially with smaller inductors and lighter loads, so don’t omit this step. Powdered iron cores are forgiving because they saturate softly, whereas ferrite cores saturate abruptly. Other core materials fall somewhere in between. The following formula assumes continuous mode of operation, but errs only slightly on
Table 2
VENDOR/ PART NO. Coiltronics CTX15-1P CTX15-1 CTX33-2P CTX33-2 UP2-330 UP2-470 UP2-680 UP2-101 Sumida CDRH6D28-150M CDRH6D38-150M CDRH6D28-330M CDRH104R-330M CDRH125-330M CDRH104R-470M CDRH125-470M CDRH6D38-680M CDRH104R-680M CDRH125-680M CDRH104R-101M CDRH125-101M Coilcraft DT3316P-153 DT3316P-333 DT3316P-473 15 33 47 1.8 1.3 1 0.06 0.09 0.11 5 5 5 15 15 33 33 33 47 47 68 68 68 100 100 1.4 1.6 0.97 2.1 2.1 2.1 1.8 0.75 1.5 1.5 1.35 1.3 0.076 0.062 0.122 0.069 0.044 0.095 0.058 0.173 0.158 0.093 0.225 0.120 3 4 3 3.8 6 3.8 6 4 3.8 6 3.8 6 15 15 33 33 33 47 68 100 1.4 1.1 1.3 1.4 2.4 1.9 1.7 1.4 0.087 0.08 0.126 0.106 0.099 0.146 0.19 0.277 4.2 4.2 6 6 5.9 5.9 5.9 5.9 VALUE (μH) IDC (AMPS) DCR (OHMS) HEIGHT (mm)
( VOUT )( VIN – VOUT ) ( VIN )( f)(L)
Example: with VIN = 40V, VOUT = 5V, L = 47μH, ESR = 0.1Ω and ESL = 10nH, output ripple voltage can be approximated as follows: (5)(40 − 5) IP-P = = 0.465A (40) 47 • 10−6 200 • 103
(
)(
)
40 dI = = 10 6 • 0.85 dt 47 • 10 − 6 VRIPPLE = (0.465A )(0.1) + 10 • 10 − 9 10 6 (0.85 ) = 0.0465 + 0.0085 = 55mVP-P To reduce output ripple voltage further requires an increase in the inductor value or a reduction in the capacitor ESR. The latter can effect loop stability since the ESR forms a useful zero in the overall loop response. Typically the inductor value is adjusted with the trade-off being a physically larger inductor with the possibility of increased component height and cost. Choosing a smaller inductor with lighter loads may result in discontinuous operation but the LT1766 is designed to work well in both continuous or discontinuous mode. Peak Inductor Current and Fault Current To ensure that the inductor will not saturate, the peak inductor current should be calculated knowing the maximum load current. An appropriate inductor should then be chosen. In addition, a decision should be made whether or not the inductor must withstand continuous fault conditions.
(
)( )
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LT1766/LT1766-5 APPLICATIONS INFORMATION
the high side for discontinuous mode, so it can be used for all conditions. IPEAK = IOUT + VOUT VIN – VOUT (ILP-P ) = IOUT + 2 2 VIN f L Maximum load current would be equal to maximum switch current for an infinitely large inductor, but with finite inductor size, maximum load current is reduced by onehalf peak-to-peak inductor current (ILP-P). The following formula assumes continuous mode operation, implying that the term on the right is less than one-half of IP . IOUT(MAX) = Continuous Mode ( VOUT + VF )( VIN − VOUT – VF ) I IP – LP-P = IP − 2 2(L)( f)( VIN ) For VOUT = 5V, VIN = 8V, VF(D1) = 0.63V, f = 200kHz and L = 20μH: (5 + 0.63)(8 − 5 – 0.63) IOUT(MAX ) = 1.5 − 2 20 • 10 − 6 200 • 10 3 (8) = 1.5 − 0.21 = 1.29 A
(
)( ) ( )( )( )( )
EMI Decide if the design can tolerate an open core geometry like a rod or barrel, which have high magnetic field radiation, or whether it needs a closed core like a toroid to prevent EMI problems. This is a tough decision because the rods or barrels are temptingly cheap and small and there are no helpful guidelines to calculate when the magnetic field radiation will be a problem. Additional Considerations After making an initial choice, consider additional factors such as core losses and second sourcing, etc. Use the experts in Linear Technology’s Applications department if you feel uncertain about the final choice. They have experience with a wide range of inductor types and can tell you about the latest developments in low profile, surface mounting, etc. Maximum Output Load Current Maximum load current for a buck converter is limited by the maximum switch current rating (IP). The current rating for the LT1766 is 1.5A. Unlike most current mode converters, the LT1766 maximum switch current limit does not fall off at high duty cycles. Most current mode converters suffer a drop off of peak switch current for duty cycles above 50%. This is due to the effects of slope compensation required to prevent subharmonic oscillations in current mode converters. (For detailed analysis, see Application Note 19.) The LT1766 is able to maintain peak switch current limit over the full duty cycle range by using patented circuitry* to cancel the effects of slope compensation on peak switch current without affecting the frequency compensation it provides.
*Patent # 6, 498, 466
(
)(
)
Note that there is less load current available at the higher input voltage because inductor ripple current increases. At VIN = 15V, duty cycle is 33% and for the same set of conditions: IOUT(MAX) = 1.5 −
= 1.5 − 0.44 = 1.06 A To calculate actual peak switch current with a given set of conditions, use: ISW(PEAK) = IOUT + ILP-P 2 (VOUT + VF )(VIN − VOUT – VF ) = IOUT + 2(L)( f)(VIN )
(5 + 0.63)(15 − 5 – 0.63) 2(20 • 10 − 6)(200 • 10 3 )(15)
Reduced Inductor Value and Discontinuous Mode If the smallest inductor value is of most importance to a converter design, in order to reduce inductor size/cost, discontinuous mode may yield the smallest inductor solution. The maximum output load current in discontinuous mode, however, must be calculated and is defined later in this section.
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Discontinuous mode is entered when the output load current is less than one-half of the inductor ripple current (ILP-P). In this mode, inductor current falls to zero before the next switch turn on (see Figure 8). Buck converters will be in discontinuous mode for output load current given by: (V + V )( V – V –V ) IOUT < OUT F IN OUT F (2)( VIN )( f)(L) Discontinuous Mode The inductor value in a buck converter is usually chosen large enough to keep inductor ripple current (ILP-P) low; this is done to minimize output ripple voltage and maximize output load current. In the case of large inductor values, as seen in the equation above, discontinuous mode will be associated with light loads. When choosing small inductor values, however, discontinuous mode will occur at much higher output load currents. The limit to the smallest inductor value that can be chosen is set by the LT1766 peak switch current (IP) and the maximum output load current required, given by: IOUT(MAX) IP2 = Discontinuous Mode (2)(ILP-P ) = 2( VOUT + VF )( VIN – VOUT – VF ) Short-Circuit Considerations The LT1766 is a current mode controller. It uses the VC node voltage as an input to a current comparator which turns off the output switch on a cycle-by-cycle basis as this peak current is reached. The internal clamp on the VC node, nominally 2V, then acts as an output switch peak current limit. This action becomes the switch current limit specification. The maximum available output power is then determined by the switch current limit. A potential controllability problem could occur under short-circuit conditions. If the power supply output is short circuited, the feedback amplifier responds to the low output voltage by raising the control voltage, VC, to its peak current limit value. Ideally, the output switch would be turned on, and then turned off as its current exceeded the value indicated by VC. However, there is finite response time involved in both the current comparator and turn-off of the output switch. These result in a minimum on-time, tON(MIN). When combined with the large ratio of VIN to (VF + I • R), the diode forward voltage plus inductor I • R voltage drop, the potential exists for a loss of control. Expressed mathematically the requirement to maintain control is: V +I•R f • tON ≤ F VIN where: f = Switching frequency tON = Switch minimum on-time VF = Diode forward voltage VIN = Input voltage I • R = Inductor I • R voltage drop If this condition is not observed, the current will not be limited at IPK, but will cycle-by-cycle ratchet up to some higher value. Using the nominal LT1766 clock frequency of 200KHz, a VIN of 40V and a (VF + I • R) of say 0.7V, the maximum tON to maintain control would be approximately 90ns, an unacceptably short time. The solution to this dilemma is to slow down the oscillator when the FB pin voltage is abnormally low thereby indicating some sort of short-circuit condition. Oscillator frequency is unaffected until FB voltage drops to about 2/3 of its normal value. Below this point the oscillator
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(IP )2 ((f)(L)(VIN ))
Example: For VIN = 15V, VOUT = 5V, VF = 0.63V, f = 200kHz and L = 10μH. IOUT(MAX) Discontinuous Mode = (1.5)2 • (200 • 103 )(10–5 )(15) 2(5 + 0.63)(15 – 5 – 0.63)
= 0.639A IOUT(MAX) Discontinuous Mode What has been shown here is that if high inductor ripple current and discontinuous mode operation can be tolerated, small inductor values can be used. If a higher output load current is required, the inductor value must be increased. If IOUT(MAX) no longer meets the discontinuous mode criteria, use the IOUT(MAX) equation for continuous mode; the LT1766 is designed to operate well in both modes of operation, allowing a large range of inductor values to be used.
14
LT1766/LT1766-5 APPLICATIONS INFORMATION
frequency decreases roughly linearly down to a limit of about 40kHz. This lower oscillator frequency during short-circuit conditions can then maintain control with the effective minimum on time. It is recommended that for [VIN/(VOUT + VF)] ratios > 10, a soft-start circuit should be used to control the output capacitor charge rate during start-up or during recovery from an output short circuit, thereby adding additional control over peak inductor current. See Buck Converter with Adjustable Soft-Start later in this data sheet. OUTPUT CAPACITOR The output capacitor is normally chosen by its effective series resistance (ESR), because this is what determines output ripple voltage. To get low ESR takes volume, so physically smaller capacitors have high ESR. The ESR range for typical LT1766 applications is 0.05Ω to 0.2Ω. A typical output capacitor is an AVX type TPS, 100μF at 10V, with a guaranteed ESR less than 0.1Ω. This is a “D” size surface mount solid tantalum capacitor. TPS capacitors are specially constructed and tested for low ESR, so they give the lowest ESR for a given volume. The value in microfarads is not particularly critical, and values from 22μF to greater than 500μF work well, but you cannot cheat mother nature on ESR. If you find a tiny 22μF solid tantalum capacitor, it will have high ESR, and output ripple voltage will be terrible. Table 2 shows some typical solid tantalum surface mount capacitors.
Table 3. Surface Mount Solid Tantalum Capacitor ESR and Ripple Current
E Case Size AVX TPS, Sprague 593D D Case Size AVX TPS, Sprague 593D C Case Size AVX TPS 0.2 (typ) 0.5 (typ) 0.1 to 0.3 0.7 to 1.1 ESR (MAX, Ω ) 0.1 to 0.3 RIPPLE CURRENT (A) 0.7 to 1.1
capacitors fail during very high turn-on surges, which do not occur at the output of regulators. High discharge surges, such as when the regulator output is dead shorted, do not harm the capacitors. Unlike the input capacitor, RMS ripple current in the output capacitor is normally low enough that ripple current rating is not an issue. The current waveform is triangular with a typical value of 125mARMS. The formula to calculate this is: Output capacitor ripple current (RMS): IRIPPLE(RMS) = 0.29(VOUT )( VIN − VOUT ) (L)( f)(VIN)
Ceramic Capacitors Higher value, lower cost ceramic capacitors are now becoming available. They are generally chosen for their good high frequency operation, small size and very low ESR (effective series resistance). Their low ESR reduces output ripple voltage but also removes a useful zero in the loop frequency response, common to tantalum capacitors. To compensate for this, a resistor RC can be placed in series with the VC compensation capacitor, CC. Care must be taken however, since this resistor sets the high frequency gain of the error amplifier, including the gain at the switching frequency. If the gain of the error amplifier is high enough at the switching frequency, output ripple voltage (although smaller for a ceramic output capacitor) may still affect the proper operation of the regulator. A filter capacitor, CF , in parallel with the RC/CC network is suggested to control possible ripple at the VC pin. An All Ceramic solution is possible for the LT1766 by choosing the correct compensation components for the given application. Example: For VIN = 8V to 40V, VOUT = 3.3V at 1A, the LT1766 can be stabilized, provide good transient response and maintain very low output ripple voltage using the following component values: (refer to the first page of this data sheet for component references) C3 = 2.2μF , , . RC = 4.7k, CC = 15nF CF = 220pF and C1 = 47μF See Application Note 19 for further detail on techniques for proper loop compensation.
Many engineers have heard that solid tantalum capacitors are prone to failure if they undergo high surge currents. This is historically true, and type TPS capacitors are specially tested for surge capability, but surge ruggedness is not a critical issue with the output capacitor. Solid tantalum
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LT1766/LT1766-5 APPLICATIONS INFORMATION
INPUT CAPACITOR Step-down regulators draw current from the input supply in pulses. The rise and fall times of these pulses are very fast. The input capacitor is required to reduce the voltage ripple this causes at the input of LT1766 and force the switching current into a tight local loop, thereby minimizing EMI. The RMS ripple current can be calculated from: IRIPPLE(RMS) = IOUT VOUT ( VIN – VOUT ) / VIN2 Ceramic capacitors are ideal for input bypassing. At 200kHz switching frequency, the energy storage requirement of the input capacitor suggests that values in the range of 2.2μF to 20μF are suitable for most applications. If operation is required close to the minimum input required by the output of the LT1766, a larger value may be required. This is to prevent excessive ripple causing dips below the minimum operating voltage resulting in erratic operation. Depending on how the LT1766 circuit is powered up you may need to check for input voltage transients. The input voltage transients may be caused by input voltage steps or by connecting the LT1766 converter to an already powered up source such as a wall adapter. The sudden application of input voltage will cause a large surge of current in the input leads that will store energy in the parasitic inductance of the leads. This energy will cause the input voltage to swing above the DC level of input power source and it may exceed the maximum voltage rating of input capacitor and LT1766. The easiest way to suppress input voltage transients is to add a small aluminum electrolytic capacitor in parallel with the low ESR input capacitor. The selected capacitor needs to have the right amount of ESR in order to critically dampen the resonant circuit formed by the input lead inductance and the input capacitor. The typical values of ESR will fall in the range of 0.5Ω to 2Ω and capacitance will fall in the range of 5μF to 50μF . If tantalum capacitors are used, values in the 22μF to 470μF range are generally needed to minimize ESR and meet ripple current and surge ratings. Care should be taken to ensure the ripple and surge ratings are not exceeded. The AVX TPS and Kemet T495 series are surge rated. AVX recommends derating capacitor operating voltage by 2:1 for high surge applications. CATCH DIODE Highest efficiency operation requires the use of a Schottky type diode. DC switching losses are minimized due to its low forward voltage drop, and AC behavior is benign due to its lack of a significant reverse-recovery time. Schottky diodes are generally available with reverse-voltage ratings of up to 60V and even 100V, and are price competitive with other types. The use of so-called ultrafast recovery diodes is generally not recommended. When operating in continuous mode, the reverse-recovery time exhibited by ultrafast diodes will result in a slingshot type effect. The power internal switch will ramp up VIN current into the diode in an attempt to get it to recover. Then, when the diode has finally turned off, some tens of nanoseconds later, the VSW node voltage ramps up at an extremely high dV/dt, perhaps 5 to even 10V/ns ! With real world lead inductances, the VSW node can easily overshoot the VIN rail. This can result in poor RFI behavior and if the overshoot is severe enough, damage the IC itself. The suggested catch diode (D1) is an International Rectifier 10MQ060N Schottky. It is rated at 1.5A average forward current and 60V reverse voltage. Typical forward voltage is 0.63V at 1A. The diode conducts current only during switch off time. Peak reverse voltage is equal to regulator input voltage. Average forward current in normal operation can be calculated from: ID(AVG) = IOUT ( VIN – VOUT ) VIN
This formula will not yield values higher than 1.5A with maximum load current of 1.5A. The only reason to consider a larger diode is the worst-case condition of a high input voltage and shorted output. With a shorted condition, diode current will increase to a typical value of 2A, determined by peak switch current limit. This is safe for short periods of time, but it would be prudent to check with the diode manufacturer if continuous operation under these conditions must be tolerated.
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LT1766/LT1766-5 APPLICATIONS INFORMATION
BOOST PIN For most applications, the boost components are a 0.33μF capacitor and a 1N4148W diode. The anode is typically connected to the regulated output voltage to generate a voltage approximately VOUT above VIN to drive the output stage. However, the output stage discharges the boost capacitor during the on time of the switch. The output driver requires at least 3V of headroom throughout this period to keep the switch fully saturated. If the output voltage is less than 3.3V, it is recommended that an alternate boost supply is used. The boost diode can be connected to the input, although, care must be taken to prevent the 2× VIN boost voltage from exceeding the BOOST pin absolute maximum rating. The additional voltage across the switch driver also increases power loss, reducing efficiency. If available, and independent supply can be used with a local bypass capacitor. A 0.33μF boost capacitor is recommended for most applications. Almost any type of film or ceramic capacitor is suitable, but the ESR should be 100MHz oscilloscope must be used, and waveforms should be observed on the leads of the package. This switch off spike will also cause the SW node to go below ground. The LT1766 has special circuitry inside which mitigates this problem, but negative voltages over 0.8V lasting longer than 10ns should be avoided. Note that 100MHz oscilloscopes are barely fast enough to see the details of the falling edge overshoot in Figure 7. A second, much lower frequency ringing is seen during switch off-time if load current is low enough to allow the inductor current to fall to zero during part of the switch off-time (see Figure 8). Switch and diode capacitance resonate with the inductor to form damped ringing at 1MHz to 10 MHz. This ringing is not harmful to the regulator and it has not been shown to contribute significantly to EMI. Any attempt to damp it with a resistive snubber will degrade efficiency. THERMAL CALCULATIONS Power dissipation in the LT1766 chip comes from four sources: switch DC loss, switch AC loss, boost circuit current, and input quiescent current. The following formulas show how to calculate each of these losses. These formulas assume continuous mode operation, so they should not be used for calculating efficiency at light load currents. Switch loss:
PSW = RSW IOUT
Boost current loss: VOUT2 (IOUT / 36) PBOOST = VIN Quiescent current loss: PQ = VIN (0.0015) + VOUT (0.003) RSW = Switch resistance (≈ 0.3) hot tEFF = Effective switch current/voltage overlap time = (tr + tf + tIr + tIf) tr = (VIN/1.2)ns tf = (VIN/1.7)ns tIr = tIf = (IOUT/0.05)ns f = Switch frequency Example: with VIN = 40V, VOUT = 5V and IOUT = 1A: PSW
(0.3)(1)2 (5) + =
40 = 0.04 + 0.388 = 0.43W
(97•10−9 )(1/2)(1)(40)(200 •10 3 )
PBOOST
40 PQ = 40(0.0015) + 5(0.003) = 0.08W Total power dissipation in the IC is given by: PTOT = PSW + PBOOST + PQ = 0.43W + 0.02W + 0.08W = 0.53W
(5)2 (1 / 36) = 0.02W =
( ) (VOUT) + tEFF(1/2)(IOUT)(VIN)(f)
2
VIN
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LT1766/LT1766-5 APPLICATIONS INFORMATION
Thermal resistance for the LT1766 packages is influenced by the presence of internal or backside planes. SSOP (GN16) package: With a full plane under the GN16 package, thermal resistance will be about 85°C/W. TSSOP (exposed pad) package: With a full plane under the TSSOP package, thermal resistance will be about 45°C/W. To calculate die temperature, use the proper thermal resistance number for the desired package and add in worst-case ambient temperature: TJ = TA + (θJA • PTOT) When estimating ambient, remember the nearby catch diode and inductor will also be dissipating power: PDIODE = ( VF )( VIN – VOUT )(ILOAD ) VIN Die temperature can peak for certain combinations of VIN, VOUT and load current. While higher VIN gives greater switch AC losses, quiescent and catch diode losses, a lower VIN may generate greater losses due to switch DC losses. In general, the maximum and minimum VIN levels should be checked with maximum typical load current for calculation of the LT1766 die temperature. If a more accurate die temperature is required, a measurement of the SYNC pin resistance (to GND) can be used. The SYNC pin resistance can be measured by forcing a voltage no greater than 0.5V at the pin and monitoring the pin current over temperature in an oven. This should be done with minimal device power (low VIN and no switching (VC = 0V)) in order to calibrate SYNC pin resistance with ambient (oven) temperature. Note: Some of the internal power dissipation in the IC, due to BOOST pin voltage, can be transferred outside of the IC to reduce junction temperature, by increasing the voltage drop in the path of the boost diode D2 (see Figure 9). This reduction of junction temperature inside the IC will allow higher ambient temperature operation for a given set of conditions. BOOST pin circuitry dissipates power given by: PDISS(BOOST) = VOUT • (ISW / 36) • VC 2 VIN
VF = Forward voltage of diode (assume 0.63V at 1A) PDIODE = (0.63)(40 – 5)(1) = 0.55W 40
PINDUCTOR = (ILOAD)2 (RL) RL = Inductor DC resistance (assume 0.1Ω) PINDUCTOR (1)2 (0.1) = 0.1W Only a portion of the temperature rise in the external inductor and diode is coupled to the junction of the LT1766. Based on empirical measurements the thermal effect on LT1766 junction temperature due to power dissipation in the external inductor and catch diode can be calculated as: ΔTJ(LT1766) ≈ (PDIODE + PINDUCTOR)(10°C/W) Using the example calculations for LT1766 dissipation, the LT1766 die temperature will be estimated as: TJ = TA + (θJA • PTOT) + [10 • (PDIODE + PINDUCTOR)] With the GN16 package (θJA = 85°C/W), at an ambient temperature of 60°C: TJ = 60 + (85 • 0.53) + (10 • 0.65) = 112°C With the TSSOP package (θJA = 45°C/W), at an ambient temperature of 60°C: TJ = 60 + (45 • 0.53) + (10 • 0.65) = 90°C
Typically VC2 (the boost voltage across the capacitor C2) equals Vout. This is because diodes D1 and D2 can be considered almost equal, where: VC2 = VOUT – VFD2 – (–VFD1) = VOUT Hence the equation used for boost circuitry power dissipation given in the previous Thermal Calculations section is stated as: PDISS(BOOST) = VOUT • (ISW / 36)• VOUT VIN
Here it can be seen that boost power dissipation increases as the square of VOUT. It is possible, however, to reduce VC2 below VOUT to save power dissipation by increasing the voltage drop in the path of D2. Care should be taken that VC2 does not fall below the minimum 3.3V boost voltage required for full saturation of the internal power switch.
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LT1766/LT1766-5 APPLICATIONS INFORMATION
For output voltages of 5V, VC2 is approximately 5V. During switch turn on, VC2 will fall as the boost capacitor C2 is dicharged by the BOOST pin. In the previous BOOST Pin section, the value of C2 was designed for a 0.7V droop in VC2 = VDROOP . Hence, an output voltage as low as 4V would still allow the minimum 3.3V for the boost function using the C2 capacitor calculated. If a target output voltage of 12V is required, however, an excess of 8V is placed across the boost capacitor which is not required for the boost function but still dissipates additional power. What is required is a voltage drop in the path of D2 to achieve minimal power dissipation while still maintaining minimum boost voltage across C2. A zener, D4, placed in series with D2 (see Figure 9), drops voltage to C2. Example : the BOOST pin power dissipation for a 20V input to 12V output conversion at 1A is given by: PBOOST = 12 • (1 / 36)• 12 = 0.2W 20 For an FE package with thermal resistance of 45°C/W, ambient temperature savings would be, T(ambient) savings = 0.116W • 45°C/W = 5c. For a GN Package with thermal resistance of 85°C/W, ambient temperature savings would be T/(ambient) savings = 0.116 • 85°C/W = 10c. The 7V zener should be sized for excess of 0.116W operation. The tolerances of the zener should be considered to ensure minimum VC2 exceeds 3.3V + VDROOP. Input Voltage vs Operating Frequency Considerations The absolute maximum input supply voltage for the LT1766 is specified at 60V. This is based solely on internal semiconductor junction breakdown effects. Due to internal power dissipation, the actual maximum VIN achievable in a particular application may be less than this. A detailed theoretical basis for estimating internal power loss is given in the section, Thermal Considerations. Note that AC switching loss is proportional to both operating frequency and output current. The majority of AC switching loss is also proportional to the square of input voltage. For example, while the combination of VIN = 40V, VOUT = 5V at 1A and fOSC = 200kHz may be easily achievable, simultaneously raising VIN to 60V and fOSC to 700kHz is not possible. Nevertheless, input voltage transients up to 60V can usually be accommodated, assuming the resulting increase in internal dissipation is of insufficient time duration to raise die temperature significantly. A second consideration is controllability. A potential limitation occurs with a high step-down ratio of VIN to VOUT, as this requires a correspondingly narrow minimum switch on time. An approximate expression for this (assuming continuous mode operation) is given as follows:
Min tON =
R1 SYNC GND FB VC R2
If a 7V zener D4 is placed in series with D2, then power dissipation becomes :
PBOOST = 12 • (1 / 36)• 5 = 0.084 W 20
D2 D4
D2
BOOST VIN C3 LT1766 SHDN BIAS VIN SW
C2 L1 VOUT D1
VOUT + VF VIN ( fOSC )
+
C1
RC CC
CF
where: VIN = Input voltage VOUT = Output voltage VF = Schottky diode forward drop fOSC = Switching frequency A potential controllability problem arises if the LT1766 is called upon to produce an on time shorter than it is able to produce. Feedback loop action will lower then reduce
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Figure 9. Boost Pin, Diode Selection
22
LT1766/LT1766-5 APPLICATIONS INFORMATION
the VC control voltage to the point where some sort of cycle-skipping or odd/even cycle behavior is exhibited. In summary: 1. Be aware that the simultaneous requirements of high VIN, high IOUT and high fOSC may not be achievable in practice due to internal dissipation. The Thermal Considerations section offers a basis to estimate internal power. In questionable cases a prototype supply should be built and exercised to verify acceptable operation. 2. The simultaneous requirements of high VIN, low VOUT and high fOSC can result in an unacceptably short minimum switch on-time. Cycle skipping and/or odd/even cycle behavior will result although correct output voltage is usually maintained. FREQUENCY COMPENSATION Before starting on the theoretical analysis of frequency response, the following should be remembered—the worse the board layout, the more difficult the circuit will be to stabilize. This is true of almost all high frequency analog circuits, read the Layout Considerations section first. Common layout errors that appear as stability problems are distant placement of input decoupling capacitor and/or catch diode, and connecting the VC compensation to a ground track carrying significant switch current. In addition, the theoretical analysis considers only first order non-ideal component behavior. For these reasons, it is important that a final stability check is made with production layout and components. The LT1766 uses current mode control. This alleviates many of the phase shift problems associated with the inductor. The basic regulator loop is shown in Figure 10. The LT1766 can be considered as two gm blocks, the error amplifier and the power stage. Figure 11 shows the overall loop response. At the VC pin, the frequency compensation components used are: . RC = 2.2k, CC = 0.022μF and CF = 220pF The output capacitor used is a 100μF 10V tantalum capacitor with , typical ESR of 100mΩ. The ESR of the tantalum output capacitor provides a useful zero in the loop frequency response for maintaining
GAIN (dB)
LT1766 CURRENT MODE POWER STAGE gm = 2mho VSW ERROR AMPLIFIER FB gm = 2000μmho RO 200k GND VC R2 RC CC
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OUTPUT CFB R1 TANTALUM CERAMIC ESR RLOAD ESL C1
CF
Figure 10. Model for Loop Response
80 60 GAIN 40 20 PHASE 0 –20 –40 60 30 0 1M
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10
1k 10k 100k FREQUENCY (Hz) VIN = 42V RC = 2.2k VOUT = 5V CC = 22nF ILOAD = 500mA CF = 220pF COUT = 100μF, 10V, 0.1Ω
Figure 11. Overall Loop Response
stability. This ESR, however, contributes significantly to the ripple voltage at the output (see Output Ripple Voltage in the Applications Section). It is possible to reduce capacitor size and output ripple voltage by replacing the tantalum output capacitor with a ceramic output capacitor because of its very low ESR. The zero provided by the tantalum output capacitor must now be reinserted back into the loop. Alternatively there may be cases where, even with the tantalum output capacitor, an additional zero is required in the loop to increase phase margin for improved transient response. A zero can be added into the loop by placing a resistor, RC, at the VC pin in series with the compensation capacitor, CC or by placing a capacitor, CFB, between the output and the FB pin.
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– +
1.22V
+
C1
180 150 120 90
PHASE (DEG)
100
23
LT1766/LT1766-5 APPLICATIONS INFORMATION
When using RC, the maximum value has two limitations. First, the combination of output capacitor ESR and RC may stop the loop rolling off altogether. Second, if the loop gain is not rolled off sufficiently at the switching frequency, output ripple will peturb the VC pin enough to cause unstable duty cycle switching similar to subharmonic oscillations. If needed, an additional capacitor, CF , can be added across the RC/CC network from the VC pin to ground to further suppress VC ripple voltage. With a tantalum output capacitor, the LT1766 already includes a resistor, RC and filter capacitor, CF , at the VC pin (see Figures 10 and 11) to compensate the loop over the entire VIN range (to allow for stable pulse skipping for high VIN-to-VOUT ratios ≥10). A ceramic output capacitor can still be used with a simple adjustment to the resistor RC for stable operation. (See Ceramic Capacitors section for stabilizing LT1766). If additional phase margin is required, a capacitor, CFB, can be inserted between the output and FB pin but care must be taken for high output voltage applications. Sudden shorts to the output can create unacceptably large negative transients on the FB pin. For VIN-to-VOUT ratios ( VIN )2 (IP )2 4( VIN + VOUT )( VIN + VOUT + VF )
Minimum inductor discontinuous mode: LMIN = 2( VOUT )(IOUT ) ( f)(IP )2
Minimum inductor continuous mode: LMIN = ( VIN )( VOUT ) ⎡ ⎛ (V + V )⎞ ⎤ 2( f)( VIN + VOUT )⎢IP – IOUT ⎜ 1 + OUT F ⎟ ⎥ ⎝ ⎠⎦ VIN ⎣
INPUT† 5.5V TO 48V
BOOST VIN
For a 40V to –12V converter using the LT1766 with peak switch current of 1.5A and a catch diode of 0.63V:
C1 100μF 25V TANT OUTPUT** –12V, 0.25A
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C3 2.2μF 100V CER
+
R2 4.99k
CC CF RC
ICONT >
(40)2 (1.5)2 = 0.573A 4(40 + 12)(40 + 12 + 0.63)
* INCREASE L1 TO 30μH OR 60μH FOR HIGHER CURRENT APPLICATIONS. SEE APPLICATIONS INFORMATION ** MAXIMUM LOAD CURRENT DEPENDS ON MINIMUM INPUT VOLTAGE AND INDUCTOR SIZE. SEE APPLICATIONS INFORMATION † FOR V > 44V AND V IN OUT = –12V, ADDITIONAL VOLTAGE DROP IN THE PATH OF D2 IS REQUIRED TO ENSURE BOOST PIN MAXIMUM RATING IS NOT EXCEEDED. SEE APPLICATIONS INFORMATION (BOOST PIN VOLTAGE)
Figure 15. Positive-to-Negative Converter
For a load current of 0.25A, this says that discontinuous mode can be used and the minimum inductor needed is found from: 2(12)(0.25) LMIN = = 13.3μH (200 • 103 )(1.5)2 In practice, the inductor should be increased by about 30% over the calculated minimum to handle losses and variations in value. This suggests a minimum inductor of 18μH for this application. Ripple Current in the Input and Output Capacitors Positive-to-negative converters have high ripple current in the input capacitor. For long capacitor lifetime, the RMS value of this current must be less than the high frequency ripple current rating of the capacitor. The following formula will give an approximate value for RMS ripple current. This formula assumes continuous mode and large inductor value. Small inductors will give somewhat higher ripple current, especially in discontinuous mode. The exact formulas are very complex and appear in Application
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Inductor Value The criteria for choosing the inductor is typically based on ensuring that peak switch current rating is not exceeded. This gives the lowest value of inductance that can be used, but in some cases (lower output load currents) it may give a value that creates unnecessarily high output ripple voltage. The difficulty in calculating the minimum inductor size needed is that you must first decide whether the switcher will be in continuous or discontinuous mode at the critical point where switch current reaches 1.5A. The first step is to use the following formula to calculate the load current above which the switcher must use continuous mode. If your load current is less than this, use the discontinuous
26
LT1766/LT1766-5 APPLICATIONS INFORMATION
Note 44, pages 29 and 30. For our purposes here a fudge factor (ff) is used. The value for ff is about 1.2 for higher load currents and L ≥15μH. It increases to about 2.0 for smaller inductors at lower load currents. Input Capacitor IRMS = ( ff)(IOUT ) ff = 1.2 to 2.0 The output capacitor ripple current for the positive-tonegative converter is similar to that for a typical buck regulator—it is a triangular waveform with peak-to-peak value equal to the peak-to-peak triangular waveform of the inductor. The low output ripple design in Figure 15 places the input capacitor between VIN and the regulated negative output. This placement of the input capacitor significantly reduces the size required for the output capacitor (versus placing the input capacitor between VIN and ground). The peak-to-peak ripple current in both the inductor and output capacitor (assuming continuous mode) is: IP-P = DC • VIN f •L VOUT + VF VOUT + VIN + VF VOUT VIN Keep in mind that during start-up and output overloads, average diode current may be much higher than with normal loads. Care should be used if diodes rated less than 1A are used, especially if continuous overload conditions must be tolerated. BOOST Pin Voltage To ensure that the BOOST pin voltage does not exceed its absolute maximum rating of 68V with respect to device GND pin voltage, care should be taken in the generation of boost voltage. For the conventional method of generating boost voltage, shown in Figure 1, the voltage at the BOOST pin during switch on time is approximately given by: VBOOST (GND pin) = (VIN – VGNDPIN) + VC2 where: VC2 = (D2+) – VD2 – (D1+) + VD1 = voltage across the boost capacitor For the positive-to-negative converter shown in Figure 15, the conventional Buck output node is grounded (D2+) = 0V and the catch diode (D1+) is connected to the negative output = VOUT = –12V. Absolute maximum ratings should also be observed with the GND pin now at –12V. It can be seen that for VD1 = VD2: VC2 = (D2+) – (D1+) = |VOUT| = 12V The maximum VIN voltage allowed for the device (GND pin at –12V) is 48V. The maximum VIN voltage allowed without exceeding the BOOST pin voltage absolute maximum rating is given by: VIN(MAX) = Boost (Max) + (VGNDPIN) – VC2 VIN(MAX) = 68 + (–12) – 12 = 44V To increase usable VIN voltage, VC2 must be reduced. This can be achieved by placing a zener diode VZ1 (anode at C2+) in series with D2. Note: A maximum limit on VZ1 must be observed to ensure a minimum VC2 is maintained on the boost capacitor; referred to as VBOOST(MIN) in the Electrical Characteristics.
DC = Duty Cycle = ICOUT (RMS) =
IP-P 12
The output ripple voltage for this configuration is as low as the typical buck regulator based predominantly on the inductor’s triangular peak-to-peak ripple current and the ESR of the chosen capacitor (see Output Ripple Voltage in Applications Information). Diode Current
Average diode current is equal to load current. Peak diode current will be considerably higher.
Peak diode current: Continuous Mode = (V + V ) ( VIN )( VOUT ) IOUT IN OUT + VIN 2(L)( f)( VIN + VOUT ) Discontinuous Mode = 2(IOUT )( VOUT ) (L)( f)
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27
LT1766/LT1766-5 PACKAGE DESCRIPTION
FE Package 16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
3.58 (.141) 1.10 (.0433) MAX
0 –8
4.90 – 5.10* (.193 – .201) 3.58 (.141) 16 1514 13 12 1110 9
4.30 – 4.50* (.169 – .177) 6.60 0.10 4.50 0.10
SEE NOTE 4
0.25 REF
2.94 (.116) 0.45 0.05 1.05 0.10 0.65 BSC
NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE
0.09 – 0.20 (.0035 – .0079)
0.50 – 0.75 (.020 – .030)
0.65 (.0256) BSC
0.195 – 0.30 (.0077 – .0118) TYP
0.05 – 0.15 (.002 – .006)
2.94 6.40 (.116) (.252) BSC
RECOMMENDED SOLDER PAD LAYOUT
4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE
12345678
FE16 (BB) TSSOP 0204
GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 .005 .015 .004 (0.38 0.10) .254 MIN .007 – .0098 .150 – .165 (0.178 – 0.249) .016 – .050 (0.406 – 1.270) .0165 .0015 .0250 BSC NOTE: 1. CONTROLLING DIMENSION: INCHES INCHES 2. DIMENSIONS ARE IN (MILLIMETERS) 3. DRAWING NOT TO SCALE
.189 – .196* (4.801 – 4.978) 45 0 – 8 TYP .229 – .244 (5.817 – 6.198) .0532 – .0688 (1.35 – 1.75) .004 – .0098 (0.102 – 0.249) 16 15 14 13 12 11 10 9
.009 (0.229) REF
.008 – .012 (0.203 – 0.305) TYP
.0250 (0.635) BSC
.150 – .157** (3.810 – 3.988)
RECOMMENDED SOLDER PAD LAYOUT
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN16 (SSOP) 0204
1
23
4
56
7
8
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28
LT1766/LT1766-5 REVISION HISTORY
REV C DATE 03/10 DESCRIPTION Removed LT1766HGN from Order Information
(Revision history begins at Rev C)
PAGE NUMBER 2
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
29
LT1766/LT1766-5 RELATED PARTS
PART NUMBER LT1074/LT1074HV LT1076/LT1076HV LT1616 LT1676 LT1765 LT1766 LT1767 LT1776 LT1940 LT1956 LT1976 LT3010 LTC3412 LTC3414 LT3430/LT3431 LT3433 LTC3727/LTC3727-1 DESCRIPTION 4.4A (IOUT), 100kHz, High Efficiency Step-Down DC/DC Converters 1.6A (IOUT), 100kHz, High Efficiency Step-Down DC/DC Converters 500mA (IOUT), 1.4MHz, High Efficiency Step-Down DC/DC Converter 60V, 440mA (IOUT), 100kHz, High Efficiency Step-Down DC/DC Converter 25V, 2.75A (IOUT), 1.25MHz, High Efficiency Step-Down DC/DC Converter 60V, 1.2A (IOUT), 200kHz, High Efficiency Step-Down DC/DC Converter 25V, 1.2A (IOUT), 1.25MHz, High Efficiency Step-Down DC/DC Converter 40V, 550mA (IOUT), 200kHz, High Efficiency Step-Down DC/DC Converter Dual Output 1.4A (IOUT), Constant 1.1MHz, High Efficiency Step-Down DC/DC Converter 60V, 1.2A (IOUT), 500kHz, High Efficiency Step-Down DC/DC Converter 60V, 1.2A (IOUT), 200kHz, Micropower (IQ = 100μA), High Efficiency Step-Down DC/DC Converter 80V, 50mA, Low Noise Linear Regulator 2.5A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 4A (IOUT), 4MHz, Synchronous Step-Down DC/DC Converter 60V, 2.75A (IOUT), 200kHz/500kHz, High Efficiency Step-Down DC/DC Converters High Voltage, Micropower (IQ = 100μA), Buck-Boost DC/DC Converter 36V, 500kHz, High Efficiency Step-Down DC/DC Controllers COMMENTS VIN: 7.3V to 45V/64V, VOUT(MIN): 2.21V, IQ: 8.5mA, ISD: 10μA, DD-5/7, TO220-5/7 VIN: 7.3V to 45V/64V, VOUT(MIN): 2.21V, IQ: 8.5mA, ISD: 10μA, DD-5/7, TO220-5/7 VIN: 3.6V to 25V, VOUT(MIN): 1.25V, IQ: 1.9mA, ISD: