LTC2393HLX-16PBF

LTC2393-16 16-Bit, 1Msps SAR ADC With 94dB SNR FEATURES n n n n n n n n n n n n n n DESCRIPTION The LTC®2393-16 is a low noise, high speed 16-bit successive approximation register (SAR) ADC. Operating from a single 5V supply, the LTC2393-16 supports a large ±4.096V fully differential input range, making it ideal for high performance applications which require maximum dynamic range. The LTC2393-16 achieves ±2LSB INL max, no missing codes at 16-bits and 94.2dB SNR (typ). The LTC2393-16 includes a precision internal reference with a guaranteed 0.5% initial accuracy and a ±20ppm/°C (max) temperature coefficient. Fast 1Msps throughput with no cycle latency in both parallel and serial interface modes makes the LTC2393-16 ideally suited for a wide variety of high speed applications. An internal oscillator sets the conversion time, easing external timing considerations. The LTC2393-16 dissipates only 140mW at 1Msps, while both nap and sleep power-down modes are provided to further reduce power during inactive periods. L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. 1Msps Throughput Rate ±2LSB INL (Max) Guaranteed 16-Bit No Missing Codes 94.2dB SNR (Typ) at fIN = 20kHz Guaranteed Operation to 125°C Single 5V Supply 1.8V to 5V I/O Voltages 140mW Power Dissipation ±4.096V Differential Input Range Internal Reference (20ppm/°C Max) No Pipeline Delay, No Cycle Latency Parallel and Serial Interface Internal Conversion Clock 48-pin 7mm × 7mm LQFP and QFN Packages APPLICATIONS n n n n n n Medical Imaging High Speed Data Acquisition Digital Signal Processing Industrial Process Control Instrumentation ATE TYPICAL APPLICATION 5V 10μF ANALOG INPUT 0V TO 4.096V 0.1μF 10μF 5V 0.1μF 1.8V TO 5V 4.7μF 16k Point FFT fS = 1Msps, fIN = 20kHz 0 –20 PARALLEL OR 16 BIT SERIAL INTERFACE SER/PAR BYTESWAP OB/2C CS RD BUSY 239316 TA01 AVP 249Ω IN+ DVP OVP –40 AMPLITUDE (dBFS) –60 –80 –100 –120 –140 –160 –180 0 100 SNR = 94.2dB THD –105dB SINAD = 93.9dB SFDR = 108dB LT6350 2200pF 249Ω IN– LTC2393-16 SINGLE-ENDEDTO-DIFFERENTIAL DRIVER VCM REFIN REFOUT CNVST PD RESET GND OGND 10μF 1μF SAMPLE CLOCK 300 200 FREQUENCY (kHz) 400 500 239316 G08 239316f 1 LTC2393-16 ABSOLUTE MAXIMUM RATINGS (Notes 1, 2) Supply Voltage (VAVP , VDVP , VOVP) ..........................6.0V Analog Input Voltage (Note 3) IN+, IN–, REFIN, CNVST .. (GND – 0.3V) to (VAVP + 0.3V) Digital Input Voltage........ (GND – 0.3V) to (VOVP + 0.3V) Digital Output Voltage ..... (GND – 0.3V) to (VOVP + 0.3V) Power Dissipation ...............................................500mW Operating Temperature Range LTC2393C ................................................ 0°C to 70°C LTC2393I.............................................. –40°C to 85°C LTC2393H .......................................... –40°C to 125°C Storage Temperature Range................... –65°C to 150°C PIN CONFIGURATION 48 GND 47 AVP 46 AVP 45 AVP 44 GND 43 IN+ 42 IN– 41 GND 40 AVP 39 REFSENSE 38 REFIN 37 REFOUT TOP VIEW GND AVP AVP AVP GND IN+ IN– GND AVP REFSENSE REFIN REFOUT 36 VCM 35 GND 34 CNVST 33 PD 32 RESET 31 CS 30 RD 29 BUSY 28 D15 27 D14 26 D13 25 D12 GND 1 AVP 2 DVP 3 SER/PAR 4 GND 5 OB/2C 6 GND 7 BYTESWAP 8 D0 9 D1 10 D2 11 D3 12 48 47 46 45 44 43 42 41 40 39 38 37 TOP VIEW GND 1 AVP 2 DVP 3 SER/PAR 4 GND 5 OB/2C 6 GND 7 BYTESWAP 8 D0 9 D1 10 D2 11 D3 12 49 GND 36 35 34 33 32 31 30 29 28 27 26 25 VCM GND CNVST PD RESET CS RD BUSY D15 D14 D13 D12 D4 13 D5 14 D6 15 D7 16 OGND 17 OVP 18 DVP 19 GND 20 D8 21 D9/SDIN 22 D10/SDOUT 23 D11/SCLK 24 UK PACKAGE 48-LEAD (7mm 7mm) PLASTIC QFN TJMAX = 125°C, θJA = 29°C/W EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB LX PACKAGE 48-LEAD (7mm 7mm) PLASTIC LQFP TJMAX = 125°C, θJA = 55°C/W ORDER INFORMATION LEAD FREE FINISH LTC2393CUK-16#PBF LTC2393IUK-16#PBF LEAD FREE FINISH LTC2393CLX-16#PBF LTC2393ILX-16#PBF LTC2393HLX-16#PBF TAPE AND REEL LTC2393CUK-16#TRPBF LTC2393IUK-16#TRPBF TRAY LTC2393CLX-16#PBF LTC2393ILX-16#PBF LTC2393HLX-16#PBF PART MARKING* LTC2393UK-16 LTC2393UK-16 PART MARKING* LTC2393LX-16 LTC2393LX-16 LTC2393LX-16 PACKAGE DESCRIPTION 48-Lead 7mm × 7mm Plastic QFN 48-Lead 7mm × 7mm Plastic QFN PACKAGE DESCRIPTION 48-Lead 7mm × 7mm Plastic LQFP 48-Lead 7mm × 7mm Plastic LQFP 48-Lead 7mm × 7mm Plastic LQFP TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 239316f 2 D4 13 D5 14 D6 15 D7 16 OGND 17 OVP 18 DVP 19 GND 20 D8 21 D9/SDIN 22 D10/SDOUT 23 D11/SCLK 24 LTC2393-16 ANALOG INPUT The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL VIN + PARAMETER Absolute Input Range (IN+) Absolute Input Range (IN–) Input Differential Voltage Range Common Mode Input Range Analog Input Leakage Current Analog Input Capacitance Input Common Mode Rejection Ratio CONDITIONS (Note 5) (Note 5) VIN = VIN+ – VIN– l l l l l MIN –0.05 –0.05 –VREF VREF/2 – 0.05 TYP MAX AVP AVP VREF UNITS V V V V μA pF pF dB VIN– VIN+ – VIN– VCM IIN CIN CMRR VREF/2 45 5 70 VREF/2 + 0.05 ±1 Sample Mode Hold Mode CONVERTER CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER Resolution No Missing Codes Transition Noise INL DNL BZE FSE Integral Linearity Error Differential Linearity Error Bipolar Zero Error Bipolar Zero Error Drift Bipolar Full-Scale Error Bipolar Full-Scale Error Drift External Reference Internal Reference (Note 7) l CONDITIONS l l l l l MIN 16 16 TYP MAX UNITS Bits Bits 0.3 (Note 6) (Note 7) –2 –1 –7 1 0.1 0.1 ±10 ±1 2 1 7 LSBRMS LSB LSB LSB ppm/°C % % ppm/°C DYNAMIC ACCURACY The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. AIN = –1dBFS (Notes 4, 8) SYMBOL SINAD SNR THD SFDR PARAMETER Signal-to-(Noise + Distortion) Ratio Signal-to-Noise Ratio Total Harmonic Distortion Spurious-Free Dynamic Range –3dB Input Bandwidth Aperture Delay Aperture Jitter Transient Response Full-Scale Step CONDITIONS fIN = 20kHz fIN = 20kHz fIN = 20kHz, First 5 Harmonics (C- and I-Grades) fIN = 20kHz, First 5 Harmonics (H-Grade) fIN = 20kHz l l l MIN 92 92.5 TYP 93.9 94.2 –105 –105 104 50 0.5 7 60 MAX UNITS dB dB –100 –98 dB dB dB MHz ns psRMS ns 239316f 3 LTC2393-16 INTERNAL REFERENCE CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER VREF Output Voltage VREF Output Tempco VREF Output Impedance External Reference Voltage REFIN Input Impedance VREF Line Regulation VCM Output Voltage AVP = 4.75V to 5.25V IOUT = 0 CONDITIONS IOUT = 0 IOUT = 0 (I- and H-Grades) (Note 11) –0.1mA ≤ IOUT ≤ 0.1mA 2.5 l MIN 4.076 TYP 4.096 ±10 2.6 4.096 85 0.3 2.08 MAX 4.116 ±20 AVP – 0.5 UNITS V ppm/°C kΩ V kΩ mV/V V DIGITAL INPUTS AND DIGITAL OUTPUTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER High Level Input Voltage Low Level Input Voltage Digital Input Current Digital Input Capacitance High Level Output Voltage Low Level Output Voltage Hi-Z Output Leakage Current Output Source Current Output Sink Current IO = –500μA IO = 500μA VOUT = 0V to OVP VOUT = 0V VOUT = OVP l l l SYMBOL VIH VIL IIN CIN VOH VOL IOZ ISOURCE ISINK CONDITIONS l l l MIN 0.8 • OVP TYP MAX 0.5 UNITS V V μA pF V VIN = 0V to OVP –10 5 OVP – 0.2 10 0.2 –10 –10 10 10 V μA mA mA POWER REQUIREMENTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER Supply Voltage Supply Voltage Supply Current Power Down Mode Power Dissipation Power Down Mode 1Msps Sample Rate with Nap Mode Conversion Done and All Digital Inputs Tied to OVP 1Msps Sample Rate with Nap Mode Conversion Done and All Digital Inputs Tied to OVP l l SYMBOL VAVP , VDVP VOVP IDD PD CONDITIONS l MIN 4.75 1.71 TYP 5 28 35 140 175 MAX 5.25 5.25 35 250 175 1250 UNITS V V mA μA mW μW 239316f 4 LTC2393-16 TIMING CHARACTERISTICS SYMBOL fSMPL tCONV tACQ t4 t5 t6 t7 t8 t9 t10 tr , tf t11 t12 t13 t14 t15 t16 t17 t18 PARAMETER Sampling Frequency Conversion Time Acquisition Time CNVST Low Time CNVST High Time CNVST↓ to BUSY Delay RESET Pulse Width SCLK Period SCLK High Time SCLK Low Time SCLK Rise and Fall Times SDIN Setup Time SDIN Hold Time SDOUT Delay After SCLK↑ SDOUT Delay After CS↓ CS↓ to SCLK Setup Time Data Valid to BUSY↓ Data Access Time after RD↓ or BYTESWAP↑ Bus Relinquish Time CL = 15pF (Note 10) l l l l l l l l The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) CONDITIONS l l l l l l l MIN TYP MAX 1 600 385 UNITS Msps ns ns ns ns 20 250 15 5 12.5 4 4 1 2 1 2 20 1 10 10 8 8 CL = 15pF (Note 9) ns ns ns ns ns μs ns ns ns ns ns ns ns ns l l l Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground. Note 3: When these pin voltages are taken below ground or above AVP DVP or OVP they will be clamped by internal diodes. This product can , , handle input currents up to 100mA below ground or above AVP DVP or , OVP without latchup. Note 4: AVP = DVP = OVP = 5V, fSMPL = 1MHz, external reference equal to 4.096V unless otherwise noted. Note 5: Recommended operating conditions. Note 6: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 7: Bipolar zero error is the offset voltage measured from –0.5LSB when the output code flickers between 0000 0000 0000 0000 and 1111 1111 1111 1111. Bipolar full-scale error is the worst-case of –FS or +FS untrimmed deviation from ideal first and last code transitions and includes the effect of offset error. Note 8: All specifications in dB are referred to a full-scale ±4.096V input with a 4.096V reference voltage. Note 9: t13 of 8ns maximum allows a shift clock frequency up to 2 • (t13 + tSETUP) for falling edge capture with 50% duty cycle and up to 80MHz for rising capture. tSETUP is the set-up time of the receiving logic. Note 10: Guaranteed by design. Note 11: Temperature coefficient is calculated by dividing the maximum change in output voltage by the specified temperature range. 4V 0.5V tDELAY 4V 0.5V tDELAY 4V 0.5V 50% tWIDTH 50% 239316F01 Figure 1. Voltage Levels for Timing Specifications 239316f 5 LTC2393-16 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, fSMPL = 1Msps, unless otherwise noted. Integral Nonlinearity vs Output Code 2.0 1.5 1.0 DNL ERROR (LSB) INL ERROR (LSB) COUNTS 0.5 0 –0.5 –1.0 –1.5 –2.0 0 16384 32768 OUTPUT CODE 239316 G01 Differential Nonlinearity vs Output Code 1.5 1.0 0.5 0 –0.5 –1.0 –1.5 49152 65536 0 16384 32768 49152 OUTPUT CODE 65536 239316 G02 DC Histogram (External Reference) 2000000 1800000 1600000 1400000 1200000 1000000 800000 600000 400000 200000 0 32764 32766 32768 CODE 32770 32772 239316 G03 DC Histogram (Internal Reference) 2000000 1800000 1600000 REFERENCE OUTPUT (V) 1400000 COUNTS 1200000 1000000 800000 600000 400000 200000 0 32764 32766 32768 CODE 32770 32772 239316 G04 Internal Reference Output vs Temperature 4.0975 4.0970 4.0965 4.0960 4.0955 4.0950 4.0945 4.0940 4.0935 4.0930 4.0925 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G05 Offset Error vs Temperature 1.0 TC = 4ppm/°C 0.8 OFFSET ERROR (LSB) 0.6 0.4 0.2 0 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G06 Full-Scale Error vs Temperature 10 8 FULL-SCALE ERROR (LSB) 6 AMPLITUDE (dBFS) 4 2 0 –2 –4 –6 –8 –10 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G07 16k Point FFT fS = 1Msps, fIN = 20kHz 0 –20 –40 –60 –80 –100 –120 –140 –160 –180 0 100 300 200 FREQUENCY (kHz) 400 500 SNR = 94.2dB THD –105dB SINAD = 93.9dB SFDR = 108dB AMPLITUDE (dBFS) 0 –20 –40 –60 –80 –100 –120 –140 –160 –180 16k Point FFT fS = 1Msps, fIN = 100kHz SNR = 94.2dB THD –100.6dB SINAD = 93.3dB SFDR = 105.2dB 0 100 300 200 FREQUENCY (kHz) 400 500 239316 G08 239316 G09 239316f 6 LTC2393-16 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, fSMPL = 1Msps, unless otherwise noted. SNR, SINAD vs Input Frequency 96 SNR 94 SNR, SINAD (dBFS) 92 90 88 86 84 82 80 0 25 50 75 100 125 150 175 200 FREQUENCY (kHz) 239316 G10 THD, Harmonics vs Input Frequency –70 –75 HARMONICS, THD (dBFS) –80 SNR, SINAD (dBFS) –85 –90 –95 –100 –105 –110 –115 –120 0 25 50 75 100 125 150 175 200 FREQUENCY (kHz) 239316 G11 SNR, SINAD at fIN = 20kHz vs Temperature 95.0 SINAD 94.5 SNR THD 94.0 SINAD 3RD 2ND 93.5 93.0 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G12 THD, Harmonics at fIN = 20kHz vs Temperature –90 –95 HARMONICS, THD (dBFS) 94.5 SNR, SINAD (dBFS) –100 –105 –110 –115 –120 –55 –35 –15 THD 3RD 2ND 95.0 SNR, SINAD vs Input Level 30 POWER SUPPLY CURRENT (mA) SNR SINAD 25 20 15 10 5 Supply Current vs Sampling Frequency 94.0 93.5 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G13 93.0 –40 –30 –20 INPUT LEVEL (dB) –10 0 239316 G14 0 0.1 1 10 100 SAMPLING FREQUENCY (kHz) 1000 239316 G15 Supply Current vs Temperature 30 POWER SUPPLY CURRENT (mA) 25 AVP 20 15 10 5 0 –55 –35 –15 DVP OVP 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G16 Power-Down Current vs Temperature 90 80 POWER-DOWN CURRENT (μA) 70 60 50 40 30 20 10 0 –55 –35 –15 AVP OVP 5 25 45 65 85 105 125 TEMPERATURE (°C) 239316 G17 DVP 239316f 7 LTC2393-16 PIN FUNCTIONS GND (Pins 1, 5, 7, 20, 35, 41, 44, 48, Exposed Pad Pin 49 (QFN Only)): Ground. All GND pins must be connected to a solid ground plane. Exposed pad must be soldered directly to the ground plane. AVP (Pins 2, 40, 45, 46, 47): 5V Analog Power Supply. The range of AVP is 4.75V to 5.25V. Bypass AVP to GND with a good quality 0.1μF and a 10μF ceramic capacitor in parallel. DVP (Pins 3, 19): 5V Digital Power Supply. The range of DVP is 4.75V to 5.25V. Bypass DVP to GND with a good quality 0.1μF and a 10μF ceramic capacitor in parallel. SER/PAR (Pin 4): Serial/Parallel Selection Input. This pin controls the digital interface. A logic high on this pin selects the serial interface and a logic low selects the parallel interface. In the serial mode the non-active digital outputs are high impedance. OB/2C (Pin 6): Offset Binary/Two’s Complement Input. When OB/2C is high, the digital output is offset binary. When low, the MSB is inverted resulting in two’s complement output. BYTESWAP (Pin 8): BYTESWAP Input. With BYTESWAP low, data will be output with Pin 28 (D15) being the MSB and Pin 9 (D0) being the LSB. With BYTESWAP high, the upper eight bits and the lower eight bits will be switched. The MSB is output on Pin 16 and Bit 8 is output on Pin 9. Bit 7 is output on Pin 28 and the LSB is output on Pin 21. D0 (Pin 9): Data Bit 0. When SER/PAR = 0 this pin is Bit 0 of the parallel port data output bus. D1 (Pin 10): Data Bit 1. When SER/PAR = 0 this pin is Bit 1 of the parallel port data output bus. D2 (Pin 11): Data Bit 2. When SER/PAR = 0 this pin is Bit 2 of the parallel port data output bus. D3 (Pin 12): Data Bit 3. When SER/PAR = 0 this pin is Bit 3 of the parallel port data output bus. D4 (Pin 13): Data Bit 4. When SER/PAR = 0 this pin is Bit 4 of the parallel port data output bus. D5 (Pin 14): Data Bit 5. When SER/PAR = 0 this pin is Bit 5 of the parallel port data output bus. D6 (Pin 15): Data Bit 6. When SER/PAR = 0 this pin is Bit 6 of the parallel port data output bus. D7 (Pin 16): Data Bit 7. When SER/PAR = 0 this pin is Bit 7 of the parallel port data output bus. OGND (Pin 17): Digital Ground for the Input/Output Interface. OVP (Pin 18): Digital Power Supply for the Input/Output Interface. The range for OVP is 1.8V to 5V. Bypass OVP to OGND with a good quality 4.7μF ceramic capacitor close to the pin. D8 (Pin 21): Data Bit 8. When SER/PAR = 0 this pin is Bit 8 of the parallel port data output bus. D9/SDIN (Pin 22): Data Bit 9/Serial Data Input. When SER/PAR = 0 this pin is Bit 9 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial data input. SDIN can be used as a data input to daisy-chain two or more conversion results into a single SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after the start of the read sequence. D10/SDOUT (Pin 23): Data Bit 10/Serial Data Ouput. When SER/PAR = 0 this pin is Bit 10 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial data output. The conversion result can be clocked out serially on this pin synchronized to SCLK. The data is clocked out MSB first on the rising edge of SCLK and is valid on the falling edge of SCLK. The data format is determined by the logic level of OB/2C. D11/SCLK (Pin 24): Data Bit 11/Serial Clock Input. When SER/PAR = 0 this pin is Bit 11 of the parallel port data output bus. When SER/PAR = 1, (serial mode) this is the serial clock input. D12 (Pin 25): Data Bit 12. When SER/PAR = 0 this pin is Bit 12 of the parallel port data output bus. D13 (Pin 26): Data Bit 13. When SER/PAR = 0 this pin is Bit 13 of the parallel port data output bus. D14 (Pin 27): Data Bit 14. When SER/PAR = 0 this pin is Bit 14 of the parallel port data output bus. 239316f 8 LTC2393-16 PIN FUNCTIONS D15 (Pin 28): Data Bit 15. When SER/PAR = 0 this pin is Bit 15 of the parallel port data output bus. The data format is determined by the logic level of OB/2C. BUSY (Pin 29): Busy Output. A low-to-high transition occurs when a conversion is started. It stays high until the conversion is complete. The falling edge of BUSY can be used as the data-ready clock signal. RD (Pin 30): Read Data Input. When CS and RD are both low, the parallel and serial output bus is enabled. CS (Pin 31): Chip Select. When CS and RD are both low, the parallel and serial output bus is enabled. CS is also used to gate the external shift clock. RESET (Pin 32): Reset Input. When high the LTC2393-16 is reset, and if this occurs during a conversion, the conversion is halted and the data bus is put into Hi-Z mode. PD (Pin 33): Power-Down Input. When high, the LTC2393-16 is powered down and subsequent conversion requests are ignored. Before entering power shutdown, the digital output data should be read. CNVST (Pin 34): Conversion Start Input. A falling edge on CNVST puts the internal sample-and-hold into the hold mode and starts a conversion. CNVST is independent of CS. VCM (Pin 36): Common Mode Analog Output. Typically the output voltage is 2.048V. Bypass to GND with a 10μF capacitor. REFOUT (Pin 37): Internal Reference Output. Nominal output voltage is 4.096V. Connect this pin to REFIN if using the internal reference. If an external reference is used connect REFOUT to ground. REFIN (Pin 38): Reference Input. An external reference can be applied to REFIN if a more accurate reference is required. If an external reference is used tie REFOUT to ground. REFSENSE (Pin 39): Reference Input Sense. Leave REFSENSE open when using the internal reference. If an external reference is used connect REFSENSE to the ground pin of the external reference. IN–, IN+ (Pin 42, Pin 43): Differential Analog Inputs. IN+ – (IN–) can range up to ±VREF . 239316f 9 LTC2393-16 FUNCTIONAL BLOCK DIAGRAM LTC2393-16 AVP DVP OVP 16-BIT OR TWO BYTE SDIN IN+ IN– 1x BUFFER REFIN 16-BIT SAMPLING ADC 16-BIT PARALLEL/ SERIAL INTERFACE SDOUT SCLK CS RD SER/PAR BYTESWAP REFOUT VCM 4.096V REFERENCE REFSENSE CONTROL LOGIC CNVST PD RESET GND OGND 239316BD OB/2C BUSY TIMING DIAGRAMS Conversion Timing Using the Parallel Interface CS, RD = 0 CNVST ACQUIRE BUSY CONVERT D[15:0] PREVIOUS CONVERSION CURRENT CONVERSION 239315 TD01 Conversion Timing Using the Serial Interface CS, RD = 0 CNVST ACQUIRE BUSY CONVERT SCLK D14 D12 D10 D8 D6 D4 D2 D0 SDOUT 239315 TD02 D15 D13 D11 D9 D7 D5 D3 D1 239316f 10 LTC2393-16 APPLICATIONS INFORMATION The LTC2393-16 is a low noise, high speed 16-bit successive approximation register (SAR) ADC. Operating from a single 5V supply, the LTC2393-16 supports a large ±4.096V fully differential input range, making it ideal for high performance applications which require a wide dynamic range. The LTC2393-16 achieves ±2LSB INL max, no missing codes at 16 bits and 94.2dB SNR (typ). The LTC2393-16 includes a precision internal reference with a guaranteed 0.5% initial accuracy and a ±20ppm/°C (max) temperature coefficient. Fast 1Msps throughput with no cycle latency in both parallel and serial interface modes makes the LTC2393-16 ideally suited for a wide variety of high speed applications. An internal oscillator sets the conversion time, easing external timing considerations. The LTC2393-16 dissipates only 140mW at 1Msps, while both nap and sleep power-down modes are provided to further reduce power during inactive periods. CONVERTER OPERATION The LTC2393-16 operates in two phases. During the acquisition phase, the charge redistribution capacitor D/A converter (CDAC) is connected to the IN+ and IN– pins to sample the differential analog input voltage. A falling edge on the CNVST pin initiates a conversion. During the conversion phase, the 16-bit CDAC is sequenced through a successive approximation algorithm, effectively comparing the sampled input with binary-weighted fractions of the reference voltage (e.g., VREF/2, VREF/4 … VREF/65536) using the differential comparator. At the end of conversion, the CDAC output approximates the sampled analog input. The ADC control logic then prepares the 16-bit digital output code for parallel or serial transfer. TRANSFER FUNCTION The LTC2393-16 digitizes the full-scale voltage of 2 • VREF into 216 levels, resulting in an LSB size of 125μV when VREF = 4.096V. The ideal transfer function for two’s complement is shown in Figure 2. The OB/2C pin selects either offset binary or two’s complement format. IN– OUTPUT CODE (TWO’S COMPLEMENT) OVERVIEW 011...111 011...110 BIPOLAR ZERO 000...001 000...000 111...111 111...110 100...001 100...000 –FSR/2 FSR = +FS – –FS 1LSB = FSR/65536 –1 0V 1 FSR/2 – 1LSB LSB LSB INPUT VOLTAGE (V) 239316 F02 Figure 2. LTC2393-16 Two’s Complement Transfer Function ANALOG INPUT The analog inputs of the LTC2393-16 are fully differential in order to maximize the signal swing that can be digitized. The analog inputs can be modeled by the equivalent circuit shown in Figure 3. The diodes at the input provide ESD protection. The analog inputs should not exceed the supply or go below ground. In the acquisition phase, each input sees approximately 40pF (CIN) from the sampling CDAC in series with 50Ω (RIN) from the on-resistance of the sampling switch. Any unwanted signal that is common to both inputs will be reduced by the common mode rejection of the ADC. The inputs draw only one small current spike while charging the CIN capacitors during acquisition. During conversion, the analog inputs draw only a small leakage current. AVP IN+ RIN CIN AVP RIN CIN BIAS VOLTAGE 239316 F03 Figure 3. The Equivalent Circuit for the Differential Analog Input of the LTC2393-16 239316f 11 LTC2393-16 APPLICATIONS INFORMATION INPUT DRIVE CIRCUITS A low impedance source can directly drive the high impedance inputs of the LTC2393-16 without gain error. A high impedance source should be buffered to minimize settling time during acquisition and to optimize the distortion performance of the ADC. For best performance, a buffer amplifier should be used to drive the analog inputs of the LTC2393-16. The amplifier provides low output impedance to allow for fast settling of the analog signal during the acquisition phase. It also provides isolation between the signal source and the ADC inputs which draw a small current spike during acquisition. Input Filtering The noise and distortion of the buffer amplifier and other circuitry must be considered since they add to the ADC noise and distortion. Noisy input circuitry should be filtered prior to the analog inputs to minimize noise. A simple 1-pole RC filter is sufficient for many applications. Large filter RC time constants slow down the settling at the analog inputs. It is important that the overall RC time constants be short enough to allow the analog inputs to completely settle to 16-bit resolution within the acquisition time (tACQ). High quality capacitors and resistors should be used in the RC filter since these components can add distortion. NPO and silver mica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can generate distortion from self heating and from damage that may occur during soldering. Metal film surface mount resistors are much less susceptible to both problems. Single-to-Differential Conversion For single-ended input signals, a single-ended-to-differential conversion circuit must be used to produce a differential signal at the ADC inputs. The LT6350 ADC driver is recommended for performing a single-ended-to-differential conversion, as shown in Figure 4a. Its low noise and good DC linearity allows the LTC2393-16 to meet full data sheet specifications. An alternative solution using two op amps is shown in Figure 4b. Using two LT1806 op amps, the circuit achieves 94.1dB signal-to-noise ratio (SNR). For a 20kHz input signal, the input of the LTC2393-16 has been bandwidth limited to about 25kHz. ADC REFERENCE A low noise, low temperature drift reference is critical to achieving the full data sheet performance of the ADC. The LTC2393-16 provides an excellent internal reference with a ±20ppm/°C (max) temperature coefficient. For better accuracy, an external reference can be used. The high speed, low noise internal reference buffer is used for both internal and external reference applications. It cannot be bypassed. ANALOG INPUT 0V TO 4.096V + LT1806 – 249Ω 301Ω 249Ω ANALOG INPUT 0V TO 4.096V 2200pF 249Ω IN– 239316 F04a IN+ 0.013μF IN– 239316 F04b IN+ LTC2393-16 LTC2393-16 301Ω 249Ω LT6350 – COMMON MODE VOLTAGE LT1806 SINGLE-ENDEDTO-DIFFERENTIAL DRIVER + Figure 4a. Recommended Single-Ended-to-Differential Conversion Circuit Using the LT6350 ADC Driver Figure 4b. Alternative Single-Ended-to-Differential Conversion Circuit Using Two LT1806 Op Amps 239316f 12 LTC2393-16 APPLICATIONS INFORMATION Internal Reference To use the internal reference, simply tie the REFOUT and REFIN pins together. This connects the 4.096V output of the internal reference to the input of the internal reference buffer. The output impedance of the internal reference is approximately 2.6kΩ and the input impedance of the internal reference buffer is about 85kΩ. It is recommended that this node be bypassed to ground with a 1μF or larger capacitor to filter the output noise of the internal reference. The REFSENSE pin should be left floating when using the internal reference. External Reference An external reference can be used with the LTC2393-16 when even higher performance is required. The LT1790-4.096 offers 0.05% (max) initial accuracy and 10ppm/°C (max) temperature coefficient. When using an external reference, connect the reference output to the REFIN pin and connect the REFOUT pin to ground. The REFSENSE pin should be connected to the ground of the external reference. 0 –20 –40 AMPLITUDE (dBFS) –60 –80 –100 –120 –140 –160 –180 0 100 300 200 FREQUENCY (kHz) 400 500 SNR = 94.2dB THD –105dB SINAD = 93.9dB SFDR = 108dB DYNAMIC PERFORMANCE Fast fourier transform (FFT) techniques are used to test the ADC’s frequency response, distortion and noise at the rated throughput. By applying a low distortion sine wave and analyzing the digital output using an FFT algorithm, the ADC’s spectral content can be examined for frequencies outside the fundamental. The LTC2393-16 provides guaranteed tested limits for both AC distortion and noise measurements. Signal-to-Noise and Distortion Ratio (SINAD) The signal-to-noise and distortion ratio (SINAD) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the A/D output. The output is band-limited to frequencies from above DC and below half the sampling frequency. Figure 5 shows that the LTC2393-16 achieves a typical SINAD of 93.9dB at a 1MHz sampling rate with a 20kHz input. 239316 G08 Figure 5. 16k Point FFT of the LTC2393-16, fS = 1Msps, fIN = 20kHz 239316f 13 LTC2393-16 APPLICATIONS INFORMATION Signal-to-Noise Ratio (SNR) The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. Figure 5 shows that the LTC2393-16 achieves a typical SNR of 94.2dB at a 1MHz sampling rate with a 20kHz input. Total Harmonic Distortion (THD) Total harmonic distortion (THD) is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency (fSMPL/2). THD is expressed as: THD = 20 log V22 + V32 + V42...VN2 V1 Power Supply Sequencing The LTC2393-16 does not have any specific power supply sequencing requirements. Care should be taken to observe the maximum voltage relationships described in the Absolute Maximum Ratings section. The LTC2393-16 has a power-on-reset (POR) circuit. With the POR, the result of the first conversion is valid after power has been applied to the ADC. The LTC2393-16 will reset itself if the power supply voltage drops below 2.5V. Once the supply voltage is brought back to its nominal value, the POR will reinitialize the ADC and it will be ready to start a new conversion. Nap Mode The LTC2393-16 can be put into the nap mode after a conversion has been completed to reduce the power consumption between conversions. In this mode some of the circuitry on the device is turned off. Nap mode is enabled by keeping CNVST low between conversions. When the next conversion is requested, bring CNVST high and hold for at least 250ns, then start the next conversion by bringing CNVST low. See Figure 6. Power Shutdown Mode When PD is tied high, the LTC2393-16 enters power shutdown and subsequent requests for conversion are ignored. Before entering power shutdown, the digital output data needs to be read. However, if a request for power shutdown (PD = high) occurs during a conversion, the conversion where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second through Nth harmonics. POWER CONSIDERATIONS The LTC2393-16 provides three sets of power supply pins: the analog 5V power supply (AVP), the digital 5V power supply (DVP) and the digital input/output interface power supply (OVP). The flexible OVP supply allows the LTC2393-16 to communicate with any digital logic operating between 1.8V and 5V, including 2.5V and 3.3V systems. t5 CNVST tCONV BUSY tACQ NAP NAP MODE 239316 F06 Figure 6. Nap Mode Timing for the LTC2393-16 239316f 14 LTC2393-16 APPLICATIONS INFORMATION will finish and then the device will power down. The data from that conversion can be read after PD = low is applied. In this mode power consumption drops to a typical value of 175μW from 140mW. This mode can be used if the LTC2393-16 is inactive for a long period of time and the user wants to minimize the power dissipation. Recovery from Power Shutdown Mode Once the PD pin is returned to a low level, ending the power shutdown request, the internal circuitry will begin to power up. If the internal reference is used, the 2.6kΩ output impedance with the 1μF bypass capacitor on the REFIN/REFOUT pins will be the main time constant for the power-on recovery time. If an external reference is used, typically allow 5ms for recovery before initiating a new conversion. Power Dissipation vs Sampling Frequency The power dissipation of the LTC2393-16 will decrease as the sampling frequency is reduced when nap mode is activated. See Figure 7. In nap mode, a portion of the circuitry on the LTC2393-16 is turned off after a conversion has been completed. Increasing the time allowed between conversions lowers the average power. 30 POWER SUPPLY CURRENT (mA) 25 20 15 10 5 0 0.1 TIMING AND CONTROL The LTC2393-16 conversion is controlled by CNVST. A falling edge on CNVST will start a conversion. CS and RD control the digital interface on the LTC2393-16. When either CS or RD is high, the digital outputs are high impedance. CNVST Timing The LTC2393-16 conversion is controlled by CNVST. A falling edge on CNVST will start a conversion. Once a conversion has been initiated, it cannot be restarted until the conversion is complete. For optimum performance CNVST should be a clean low jitter signal. Converter status is indicated by the BUSY output which remains high while the conversion is in progress. To ensure no errors occur in the digitized results return the rising edge either within 40ns from the start of the conversion or wait until after the conversion has been completed. The CNVST timing needed to take advantage of the reduced power mode of operation is described in the Nap Mode section. Internal Conversion Clock The LTC2393-16 has an internal clock that is trimmed to achieve a maximum conversion time of 600ns. No external adjustments are required and with a maximum acquisition time of 385ns, a throughput performance of 1Msps is guaranteed. DIGITAL INTERFACE The LTC2393-16 allows both parallel and serial digital interfaces. The flexible OVP supply allows the LTC2393-16 to communicate with any digital logic operating between 1.8V and 5V, including 2.5V and 3.3V systems. 10 100 1 SAMPLING FREQUENCY (kHz) 1000 239316 G15 Figure 7. Power Dissipation of the LTC2393-16 Decreases with Decreasing Sampling Frequency 239316f 15 LTC2393-16 APPLICATIONS INFORMATION Parallel Modes The parallel output data interface is active when the SER/PAR pin is tied low and when both CS and RD are low. The output data can be read as a 16-bit word as shown in Figures 8, 9 and 10 or it can be read as two 8-bit bytes by using the BYTESWAP pin. As shown in Figure 11, with the BYTESWAP pin low, the first eight MSBs are output on the D15 to D8 pins and the eight LSBs are output on the D7 to DO pins. When BYTESWAP is taken high, the eight LSBs now are output on the D15 to D8 pins and the eight MSBs are output on the D7 to D0 pins. Serial Modes The serial output data interface is active when the SER/PAR pin is tied high and when both CS and RD are low. The serial output data will be clocked out on the SDOUT pin when an external clock is applied to the SCLK pin. Clocking out the data after the conversion will yield the best performance. With a shift clock frequency of at least 40MHz, a 1Msps throughput is still achieved. The serial output data changes state on the rising edge of SCLK and can be captured on the falling edge of SCLK. D15 remains valid till the first rising edge of shift clock after the first falling edge of shift clock. The non-active digital outputs are high impedance when operating in the serial mode. CS = RD = 0 t4 CNVST The SDIN input pin is used to daisy-chain multiple converters. This is useful for applications where hardware constraints may limit the number of lines needed to interface to a large number of converters. For example, if two devices are cascaded, the MSB of the first device will appear at the output after 17 SCLK cycles. The first MSB is clocked in on the falling edge of the first SCLK. See Figure 12. Data Format When OB/2C is high, the digital output is offset binary. When low, the MSB is inverted resulting in two’s complement output. This pin is active in both the parallel and serial modes of operation. Reset When the RESET pin is high, the LTC2393-16 is reset, and if this occurs during a conversion, the conversion is halted and the data bus is put into Hi-Z mode. In reset, requests for new conversions are ignored. Once RESET returns low, the LTC2393-16 is ready to start a new conversion after the acquisition time has been met. See Figure 13. BUSY tCONV t6 DATA BUS D[15:0] PREVIOUS CONVERSION t16 NEW 239316 F08 Figure 8. Read the Parallel Data Continuously. The Data Bus is Always Driven and Can’t Be Shared 239316f 16 LTC2393-16 APPLICATIONS INFORMATION CS RD BUSY DATA BUS D[15:0] Hi-Z t17 CURRENT CONVERSION Hi-Z 239316 F09 t18 Figure 9. Read the Parallel Data After the Conversion CS = 0 CNVST, RD t4 BUSY tCONV t6 DATA BUS D[15:0] Hi-Z t17 PREVIOUS CONVERSION Hi-Z 239316 F09 t18 Figure 10. Read the Parallel Data During the Conversion CS, RD 8-BIT INTERFACE BYTESWAP D[15:8] Hi-Z t17 HIGH BYTE t17 LOW BYTE t18 Hi-Z 239316 F11 Figure 11. 8-Bit Parallel Interface Using the BYTESWAP Pin 239316f 17 LTC2393-16 APPLICATIONS INFORMATION RD = 0 t15 CS SCLK STARTS LOW BUSY t8 t9 SCLK 1 t10 2 t13 3 4 15 16 17 18 SDOUT (ADC 2) Hi-Z D15 t14 t12 t11 X15 D14 D13 D1 D0 X15 X14 SDIN (ADC 2) X14 X13 X1 X0 RD = 0 CS SCLK STARTS HIGH BUSY t8 t9 2 t13 SDOUT (ADC 2) Hi-Z D15 t14 SDIN (ADC 2) t12 t11 X15 X14 X13 X1 X0 D14 D13 D1 D0 X15 X14 3 4 15 16 17 18 t10 SCLK 1 CNVST IN CS IN RD IN SCLK IN LTC2393-16 CNVST CS RD SCLK SDIN SDOUT ADC 1 LTC2393-16 CNVST CS RD SCLK SDIN SDOUT ADC 2 DATA OUT 239316 F12 Figure 12. Serial Interface with External Clock. Read After the Conversion. Daisy-Chain Multiple Converters 239316f 18 LTC2393-16 APPLICATIONS INFORMATION t7 RESET tACQ CVNST Hi-Z 239316 F13 DATA BUS D[15:0] Figure 13. RESET Pin Timing 239316f 19 LTC2393-16 APPLICATIONS INFORMATION BOARD LAYOUT To obtain the best performance from the LTC2393-16, a printed circuit board (PCB) is recommended. Layout for the printed circuit board should ensure the digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital clocks or signals alongside analog signals or underneath the ADC. Recommended Layout The following is an example of a recommended PCB layout. A single solid ground plane is used. Bypass capacitors to the supplies are placed as close as possible to the supply pins. Low impedance common returns for these bypass capacitors are essential to the low noise operation of the ADC. The analog input traces are screened by ground. For more details and information refer to DC1500A, the evaluation kit for the LTC2393-16 Partial Schematic of Demoboard CNVST R2 249Ω 1% C54 OPT C36 1μF 34 CNVST 43 39 REFSENSE 38 REFIN 37 REFOUT BUSY D15 D14 D13 D12 D11/SCLK D10/SDOUT D9/SDIN D8 D7 D6 D5 D4 D3 D2 D1 D0 BYTESWAP GND CS RD 31 30 33 29 28 27 26 25 24 23 22 21 16 15 14 13 12 11 10 9 8 7 BUSY D15 D14 D13 D12 D11/SCLK D10/SDOUT D9/SDIN D8 D7 D6 D5 D4 D3 D2 D1 D0 IN+ C2 2200pF 1206 NPO R3 249Ω 1% C55 OPT VCM OB/2C C53 10μF 36 6 5 LTC2393-16 44 IN– GND SER/PAR RESET PD 4 32 C31 0.1μF 5V 47 46 C30 10μF R24 1.0Ω 45 40 2 19 C29 0.1μF C28 10μF 3.3V 3 18 AVP/AVL AVP AVP AVP AVP LTC2393-16 DVP DVP/DVL OVP C40 4.7μF GND GND GND GND GND GND OGND 48 44 41 35 20 1 17 239316 TA02 239316f 20 LTC2393-16 APPLICATIONS INFORMATION Partial Top Silkscreen Partial Layer 1 Component Side Partial Layer 2 Ground Plane 239316f 21 LTC2393-16 PACKAGE DESCRIPTION UK Package 48-Lead Plastic QFN (7mm × 7mm) (Reference LTC DWG # 05-08-1704) 0.70 0.05 5.15 0.05 5.50 REF 6.10 0.05 7.50 0.05 (4 SIDES) 5.15 0.05 PACKAGE OUTLINE 0.25 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 0.10 (4 SIDES) 0.75 0.05 R = 0.115 TYP R = 0.10 TYP 47 48 0.40 1 2 PIN 1 CHAMFER C = 0.35 0.10 PIN 1 TOP MARK (SEE NOTE 6) 5.15 5.50 REF (4-SIDES) 0.10 5.15 0.10 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE (UK48) QFN 0406 REV C 0.25 BOTTOM VIEW—EXPOSED PAD 0.05 0.50 BSC 239316f 22 LTC2393-16 PACKAGE DESCRIPTION LX Package 48-Lead Plastic LQFP (7mm × 7mm) (Reference LTC DWG # 05-08-1760 Rev Ø) 7.15 – 7.25 5.50 REF 48 9.00 BSC 7.00 BSC 0.50 BSC 1 2 48 1 2 SEE NOTE: 4 9.00 BSC 5.50 REF 0.20 – 0.30 7.15 – 7.25 A A 7.00 BSC PACKAGE OUTLINE C0.30 – 0.50 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.60 1.35 – 1.45 MAX R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° 11° – 13° 11° – 13° 1.00 REF 0.45 – 0.75 SECTION A – A 0.09 – 0.20 0.50 BSC 0.17 – 0.27 0.05 – 0.15 LX48 LQFP 0907 REVØ NOTE: 1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE 2. DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER 5. DRAWING IS NOT TO SCALE 239316f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23 LTC2393-16 TYPICAL APPLICATION ADC Driver: Single-Ended Input to Differential Output 5V 0.1μF VIN 0V to 4V 249Ω 5V AIN– + – +IN1 SHDN V+ OUT2 + – + – V– OUT1 249Ω 0.1μF 2V –5V 0.1μF LT6350 2200pF LTC2393-16 AIN+ – IN1 +IN2 239316 TA03 499Ω RELATED PARTS PART NUMBER LTC1411 LTC1609 LTC1864 LTC1864L LTC1865 LTC1865L LTC1867 LTC2355-14/LTC2356-14 LTC2392-16 LTC2391-16 DACs LTC2641 LTC2630 References LT1236 LTC6655 Amplifiers LT1469 LT1806/LT1807 LTC6200/LTC6200-5/ LTC6200-10 LT6350 DESCRIPTION 14-Bit 2.5Msps Parallel ADC 16-Bit 200ksps Serial ADC 16-Bit 250ksps Serial ADC 16-Bit 150ksps Serial ADC 16-Bit 250ksps Serial ADC 16-Bit 150ksps Serial ADC 16-Bit, 200ksps 8-Channel ADC 14-Bit, 3.5Msps Serial ADC 16-Bit, 500ksps Parallel/Serial ADC 16-Bit, 500ksps Parallel/Serial ADC COMMENTS 5V Supply, 1-Channel, 80dB SNR, ±1.8V Input Range, SSOP-36 Package 5V Supply, 1-Channel, 87dB SNR, Resistor-Selectable Inputs: ±10V, ±5V, ±3.3V, 0V to 4V, 0V to 5V, 0V to 10V 5V Supply, 1-Channel, 4.3mW, MSOP-8 Package 3V Supply, 1-Channel, 1.3mW, MSOP-8 Package 5V Supply, 2-Channel, 4.3mW, MSOP-8 Package 3V Supply, 2-Channel, 1.3mW, MSOP-8 Package 5V Supply, 6.5mW, SSOP-16 Package, Pin Compatible with LTC1863, LTC1867L 3.3V Supply, 1-Channel, 18mW, MSOP-10 Package 5V Supply, Differential Input, 94dB SNR, ±4.096V Input Range, Pin Compatible with the LTC2393-16, LTC2391-16 5V Supply, Differential Input, 94dB SNR, ±4.096V Input Range, Pin Compatible with the LTC2393-16, LTC2392-16 ±1LSB INL, ±1LSB DNL, MSOP-8 Package, 0V to 5V Output SC70 6-Pin Package, Internal Reference, ±1LSB INL (12 Bits) 5V, 10V; 0.05% Initial Accuracy (Max); 5ppm Tempco (Max) 2.025% Initial Accuracy (Max), 2ppm Tempco (Max), 0.25ppmP-P Noise (0.1Hz to 10Hz) in MSOP-8 Package 125mV (Max) Input Offset Voltage, Low Distortion: –96.5dB at 100kHz, 10VP-P , Settling Time: 900ns Rail-to-Rail Input and Output, Low Distortion, –80dBc at 5MHz, Low Voltage Noise: 3.5nV/√Hz Low Noise Voltage: 0.95nV/√Hz (100kHz), Low Distortion: –80dB at 1MHz, TSOT23-6 Package Rail-to-Rail Input and Outputs, 240ns 0.01% Settling Time 239316f LT 0110 • PRINTED IN USA 16-Bit Single Serial VOUT DACs 12-/10-/8-Bit Single VOUT DACs Precision Reference in SO-8 Package 0.25ppmP-P Noise, Low Drift Precision Reference Dual 90MHz, 22V/μs Dual Op Amps in 4mm × 4mm DFN-12 Package 325MHz, Single/Dual Precision Op Amp in TSOT23-6 Package 165MHz/800MHz/1.6GHz Op Amp with Unity Gain/AV = 5/AV = 10 Low Noise Single-Ended-to-Differential ADC Driver 24 Linear Technology Corporation (408) 432-1900 ● FAX: (408) 434-0507 ● 1630 McCarthy Blvd., Milpitas, CA 95035-7417 www.linear.com © LINEAR TECHNOLOGY CORPORATION 2010