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LTC3550

LTC3550

  • 厂商:

    LINER

  • 封装:

  • 描述:

    LTC3550 - Dual Input USB/AC Adapter Li-Ion Battery Charger with 600mA Buck Converter - Linear Techno...

  • 详情介绍
  • 数据手册
  • 价格&库存
LTC3550 数据手册
LTC3550 Dual Input USB/AC Adapter Li-Ion Battery Charger with 600mA Buck Converter FEATURES ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ DESCRIPTIO Charges Single-Cell Li-Ion Battery from Wall Adapter and USB Inputs Automatic Input Power Detection and Selection Charge Current Programmable Up to 950mA from Wall Adapter Input Adjustable Output, High Efficiency 600mA Synchronous DC/DC Converter No External MOSFET, Sense Resistor or Blocking Diode Needed Thermal Regulation Maximizes Charge Rate Without Risk of Overheating* Preset Charge Voltage with ±0.6% Accuracy Programmable Charge Current Termination 1.5MHz Constant Frequency Operation (Step-Down Converter) 18μA USB Suspend Current in Shutdown “Power Present” Status Output Charge Status Output Automatic Recharge Available in a Thermally Enhanced, Low Profile (0.75mm) 16-Lead (5mm × 3mm) DFN Package The LTC®3550 is a standalone linear charger with a 600mA monolithic synchronous buck converter. It is capable of charging a single-cell Li-Ion battery from both wall adapter and USB inputs. The charger automatically selects the appropriate power source for charging. Internal thermal feedback regulates the battery charge current to maintain a constant die temperature during high power operation or high ambient temperature conditions. The float voltage is fixed at 4.2V and the charge currents are programmed with external resistors. The LTC3550 terminates the charge cycle when the charge current drops below the programmed termination threshold after the final float voltage is reached. With power applied to both inputs, the LTC3550 can be put into shutdown mode reducing the DCIN supply current to 20μA, the USBIN supply current to 10μA, and the battery drain current to less than 2μA. The DC/DC converter switching frequency is internally set at 1.5MHz, allowing the use of small surface mount inductors and capacitors. , LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. *Protected by U.S. patents, includng 6522118, 6700364, 6580258, 5481178, 6304066, 6127815, 6498466, 6611131 APPLICATIO S ■ Cellular Telephones TYPICAL APPLICATIO 2.2µH SW LTC3550 WALL ADAPTER USB PORT DCIN USBIN 1µF 1µF 2k 1% IUSB VFB RUN VCC BAT 800mA (WALL) 500mA (USB) 4.7µF 2k 1% 301k 22pF 301k COUT 10µF CER VOUT 1.2V 600mA BATTERY CHARGE VOLTAGE (V) CURRENT (mA) Dual Input Battery Charger and DC/DC Converter DCIN VOLTAGE (V) ITERM IDC GND 1.24k 1% + 4.2V SINGLE-CELL Li-Ion BATTERY 3550 TA01 U Complete Charge Cycle (1100mA Battery) 1000 800 600 400 200 0 4.2 4.0 3.8 3.6 3.4 5.0 2.5 0 0 0.5 1.0 2.0 1.5 TIME (HR) 2.5 3.0 3550fa U U CONSTANT VOLTAGE USBIN = 5V TA = 25°C RIDC = 1.24k RIUSB = 2k 3550 TA02 1 LTC3550 ABSOLUTE (Note 1) AXI U RATI GS PACKAGE/ORDER I FOR ATIO TOP VIEW USBIN IUSB ITERM PWR CHRG VFB VCC GND 1 2 3 4 5 6 7 8 17 16 DCIN 15 BAT 14 IDC 13 HPWR 12 EN 11 RUN 10 SW 9 GND DCIN, USBIN .............................................. –0.3V to 10V EN, ⎯C⎯H⎯R⎯G, ⎯P⎯W⎯R, HPWR ............................ –0.3V to 10V BAT, IDC, IUSB, ITERM ................................ –0.3V to 7V VCC ............................................................... –0.3V to 6V RUN, VFB .....................................................–0.3V to VCC SW (DC)........................................–0.3V to (VCC + 0.3V) DCIN Pin Current (Note 2) ..........................................1A USBIN Pin Current (Note 2) .................................700mA BAT Pin Current (Note 2) ............................................1A P-Channel SW Source Current (DC).....................800mA N-Channel SW Source Current (DC) ....................800mA Peak SW Sink and Source Current ...........................1.3A Operating Temperature Range (Note 3) ... –40°C to 85°C Maximum Junction Temperature .......................... 125°C Storage Temperature Range................... –65°C to 125°C DHC PACKAGE 16-LEAD (5mm × 3mm) PLASTIC DFN TJMAX = 125°C, θJA = 40°C (NOTE 4) EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB ORDER PART NUMBER LTC3550EDHC DHC PART MARKING 3550 Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/ Consult LTC Marketing for parts specified with wider operating temperature ranges. ELECTRICAL CHARACTERISTICS SYMBOL VDCIN VUSBIN VCC VEN REN VRUN IRUN V⎯C⎯H⎯R⎯G V⎯P⎯W⎯R VHPWR RHPWR VUVDC VUVUSB VASD-DC VASD-USB PARAMETER Wall Adapter Input Supply Voltage USB Port Input Supply Voltage Buck Regulator Input Supply Voltage EN Input Threshold Voltage EN Pull-Down Resistance RUN Threshold Voltage RUN Leakage Current ⎯CH⎯R⎯G Output Low Voltage ⎯ ⎯P⎯W⎯R Output Low Voltage HPWR Input Threshold Voltage HPWR Pull-Down Resistance DCIN Undervoltage Lockout Voltage USBIN Undervoltage Lockout Voltage The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDCIN = 5V, VUSBIN = 5V, VCC = 3.6V unless otherwise noted. CONDITIONS ● ● ● MIN 4.3 4.3 2.5 0.4 1.2 ● ● TYP MAX 8 8 5.5 UNITS V V V V MΩ V µA V V V MΩ V mV V mV mV mV mV mV 3550fa 0.7 2 1 ±0.01 0.35 0.35 1.0 5 1.5 ±1 0.6 0.6 1 5 4.3 4.1 220 80 220 80 0.3 I⎯C⎯H⎯R⎯G = 5mA I⎯P⎯W⎯R = 5mA 0.4 ● 0.7 2 4.15 200 3.95 200 180 50 180 50 1 4.0 3.8 140 20 140 20 From Low to High Hysteresis From Low to High Hysteresis VDCIN – VBAT Lockout Threshold Voltage VDCIN from Low to High, VBAT = 4.2V VDCIN from High to Low, VBAT = 4.2V VUSBIN – VBAT Lockout Threshold Voltage VUSBIN from Low to High, VBAT = 4.2V VUSBIN from High to Low, VBAT = 4.2V 2 U W U U WW W LTC3550 ELECTRICAL CHARACTERISTICS SYMBOL Battery Charger IDCIN DCIN Supply Current Charge Mode (Note 5) Standby Mode Shutdown Mode USBIN Supply Current Charge Mode (Note 6) Standby Mode Shutdown Mode Shutdown Mode Regulated Output (Float) Voltage BAT Pin Current Constant-Current Mode Constant-Current Mode Constant-Current Mode Standby Mode Shutdown Mode Sleep Mode IDC Pin Regulated Voltage IUSB Pin Regulated Voltage Charge Current Termination Threshold RIDC = 10k Charge Terminated ENABLE = 5V RIUSB = 10k, VDCIN = 0V Charge Terminated VDCIN = 0V, ENABLE = 0V VDCIN > VUSBIN IBAT = 1mA IBAT = 1mA, 0°C < TA < 85°C RIDC = 1.25k RIUSB = 2.1k RIDC = 10k or RIUSB = 10k Charge Terminated Charger Disabled DCIN = 0V, USBIN = 0V Constant-Current Mode Constant-Current Mode RITERM = 1k RITERM = 2k RITERM = 10k RITERM = 20k VBAT < VTRIKL; RIDC = 1.25k VBAT < VTRIKL; RIUSB = 2.1k VBAT Rising Hysteresis VFLOAT – VRECHRG, 0°C < TA < 85°C VBAT from High to Low IBAT Drops Below Termination Threshold IBAT = 10% to 90% Full-Scale ● ● ● ● ● ● ● ● ● The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDCIN = 5V, VUSBIN = 5V, VCC = 3.6V unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS 250 50 20 250 50 18 10 4.175 4.158 760 450 93 4.2 4.2 800 476 100 –3 –1 ±1 1.0 1.0 100 50 10 5 80 47.5 2.9 100 100 6 1.5 250 400 550 105 800 100 40 800 100 36 20 4.225 4.242 840 500 107 –6 –2 ±2 1.05 1.05 110 55 11.5 6 100 65 3 135 9 2.2 325 µA µA µA µA µA µA µA V V mA mA mA µA µA µA V V mA mA mA mA mA mA V mV mV ms ms µs mΩ mΩ °C IUSBIN ● ● VFLOAT IBAT VIDC VIUSB ITERMINATE 0.95 0.95 90 45 8.5 4 60 30 2.8 65 3 0.8 175 ITRIKL VTRIKL ΔVRECHRG tRECHRG tTERMINATE tSS RON-DC RON-USB TLIM Switching Regulator VFB ΔVFB IPK VLOADREG Trickle Charge Current Trickle Charge Threshold Voltage Recharge Battery Threshold Voltage Recharge Comparator Filter Time Termination Comparator Filter Time Soft-Start Time Power FET On-Resistance (Between DCIN and BAT) Power FET On-Resistance (Between USBIN and BAT) Junction Temperature in ConstantTemperature Mode Regulated Feedback Voltage TA = 25°C 0°C ≤ TA ≤ 85°C –40°C ≤ TA ≤ 85°C VCC = 3V, VFB = 0.5V ● ● 0.5880 0.5865 0.5850 0.75 0.6 0.6 0.6 0.04 1 0.5 0.6120 0.6135 0.6150 0.4 1.25 V V V %/V A % Reference Voltage Line Regulation Peak Inductor Current Output Voltage Load Regulation 3550fa 3 LTC3550 ELECTRICAL CHARACTERISTICS SYMBOL IS PARAMETER VCC Supply Current Active Mode Sleep Mode Shutdown Oscillator Frequency RDS(ON) of P-Channel FET RDS(ON) of N-Channel FET SW Leakage Current The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDCIN = 5V, VUSBIN = 5V, VCC = 3.6V unless otherwise noted. CONDITIONS (Note 7) VFB = 0.5V, ILOAD = 0A VFB = 0.62V, ILOAD = 0A VRUN = 0V, VCC = 5.5V VFB = 0.6V VFB = 0V 1.2 MIN TYP 300 20 0.1 1.5 210 0.4 0.35 0.01 ±1 MAX 400 35 1 1.8 UNITS µA µA µA MHz kHz Ω Ω µA fOSC RPFET RNFET ILSW Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: Guaranteed by long term current density limitations. Note 3: The LTC3550E is guaranteed to meet the performance specifications from 0°C to 85°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 4: Failure to solder the exposed backside of the package to the PC board will result in a thermal resistance much higher than 40°C/W. See Thermal Considerations. Note 5: Supply Current includes IDC and ITERM pin current (approximately 100μA each) but does not include any current delivered to the battery through the BAT pin (approximately 100mA). Note 6: Supply Current includes IUSB and ITERM pin current (approximately 100μA each) but does not include any current delivered to the battery through the BAT pin (approximately 100mA). Note 7: Dynamic supply current is higher due to the gate charge being delivered at the switching frequency. 3550fa 4 LTC3550 TYPICAL PERFOR A CE CHARACTERISTICS Regulated Charger Output (Float) Voltage vs Charge Current 4.26 4.24 4.22 VFLOAT (V) VFLOAT (V) 4.20 4.18 4.16 4.14 4.12 4.10 0 100 200 300 400 500 600 700 800 CHARGE CURRENT (mA) 3550 G01 VDCIN = VUSBIN = 5V 4.215 4.210 4.205 4.200 4.195 4.190 4.185 4.180 –50 VIDC (V) RIDC = RIUSB = 2k RIDC = 1.25k IUSB Pin Voltage vs Temperature (Constant-Current Mode) 1.008 1.006 1.004 VIUSB (V) VIUSB (V) 1.002 VUSBIN = 8V 1.000 0.998 0.996 0.994 0.992 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 3550 G04 HPWR = 5V IBAT (mA) VUSBIN = 4.3V Charge Current vs IUSB Pin Voltage 900 800 700 25 600 IPWR (mA) IBAT (mA) 500 400 300 200 100 0 0 0.2 0.4 0.6 0.8 VIUSB (V) 1.0 1.2 3550 G06 VUSBIN = 5V RIUSB = 1.25k 30 RIUSB = 2k ICHRG (mA) RIUSB = 10k UW TA = 25°C, unless otherwise noted. IDC Pin Voltage vs Temperature (Constant-Current Mode) 1.008 1.006 1.004 1.002 1.000 0.998 0.996 0.994 VDCIN = 4.3V VDCIN = 8V Regulated Charger Output (Float) Voltage vs Temperature 4.220 VDCIN = VUSBIN = 5V –25 0 25 50 TEMPERATURE (°C) 75 100 3550 G02 0.992 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 3550 G03 IUSB Pin Voltage vs Temperature (Constant-Current Mode) 0.208 0.206 0.204 0.202 0.200 0.198 0.196 0.194 0.192 –50 –25 50 25 TEMPERATURE (°C) 0 75 100 3550 G43 Charge Current vs IDC Pin Voltage 900 800 700 600 RIDC = 1.25k RIDC = 2k VDCIN = 5V HPWR = 0V VUSBIN = 8V VUSBIN = 4.3V 500 400 300 200 100 0 0 0.2 0.4 0.6 0.8 VIDC (V) RIDC = 10k 1.0 1.2 3550 G05 ⎯P⎯W⎯R Pin I-V Curve 35 VDCIN = VUSBIN = 5V TA = – 40°C TA = 25°C TA = 90°C 35 30 25 20 15 10 5 0 0 1 2 4 3 VPWR (V) 5 6 7 3550 G07 ⎯C⎯H⎯R⎯G Pin I-V Curve VDCIN = VUSBIN = 5V TA = – 40°C TA = 25°C TA = 90°C 20 15 10 5 0 0 1 2 4 3 VCHRG (V) 5 6 7 3550 G08 3550fa 5 LTC3550 TYPICAL PERFOR A CE CHARACTERISTICS Charge Current vs Ambient Temperature 1000 ONSET OF THERMAL REGULATION 800 RIDC = 1.25k 700 IBAT (mA) IBAT (mA) 600 500 200 VDCIN = VUSBIN = 5V VBAT = 4V θJA = 40°C/W 50 25 75 0 TEMPERATURE (°C) 100 125 400 RIDC = 1.25k VBAT = 4V θJA = 40°C/W 5.0 5.5 6.0 6.5 VDCIN (V) 7.0 7.5 8.0 200 VDCIN = VUSBIN = 5V θJA = 40°C/W RIDC = 1.25k 2.4 2.7 3.0 3.3 3.6 VBAT (V) 3.9 4.2 4.5 IBAT (mA) 3550 G11 600 RIDC = RIUSB = 2k 400 0 –50 –25 DCIN Power FET On-Resistance vs Temperature 550 500 700 RDS(ON) (mΩ) RDS(ON) (mΩ) 450 400 350 300 400 250 –50 –25 50 25 75 0 TEMPERATURE (°C) 100 125 650 600 550 500 450 VBAT = 4V IBAT = 200mA 800 750 VEN (mV) DCIN Shutdown Current vs Temperature 50 45 40 35 IDCIN (µA) 30 25 20 15 10 5 0 –50 –25 VDCIN = 5V VDCIN = 8V IUSBIN (µA) 45 40 25 20 15 VUSBIN = 5V VHPWR (mV) VDCIN = 4.3V ENABLE = 5V 50 25 0 TEMPERATURE (°C) 75 100 3550 G16 6 UW 3550 G10 TA = 25°C, unless otherwise noted. Charge Current vs DCIN Voltage 900 800 ONSET OF THERMAL REGULATION 1000 Charge Current vs Battery Voltage 800 600 400 300 4.0 4.5 0 3550 G12 USBIN Power FET On-Resistance vs Temperature VBAT = 4V IBAT = 200mA 900 EN Pin Threshold Voltage (On-to-Off) vs Temperature VDCIN = VUSBIN = 5V 850 800 750 700 650 350 –50 –25 50 25 75 0 TEMPERATURE (°C) 100 125 600 –50 –25 50 25 0 TEMPERATURE (°C) 75 100 3550 G13 3550 G14 3550 G15 USBIN Shutdown Current vs Temperature 900 HPWR Pin Threshold Voltage (Rising) vs Temperature VDCIN = VUSBIN = 5V 850 35 30 VUSBIN = 8V 800 750 700 VUSBIN = 4.3V 650 5 0 –50 –25 ENABLE = 0V 50 25 0 TEMPERATURE (°C) 75 100 600 –50 –25 50 25 0 TEMPERATURE (°C) 75 100 10 3550 G17 3550 G44 3550fa LTC3550 TYPICAL PERFOR A CE CHARACTERISTICS HPWR Pin Pull-Down Resistance vs Temperature 2.8 2.6 2.4 REN (MΩ) 2.2 2.0 1.8 1.6 –50 2.8 2.6 2.4 VUV (V) 2.2 2.0 1.8 1.6 –50 RHPWR (MΩ) –25 50 25 0 TEMPERATURE (°C) Recharge Threshold Voltage vs Temperature 4.16 4.14 4.12 VRECHRG (V) 4.10 4.08 4.06 4.04 –50 VDCIN = VUSBIN = 4.3V VDCIN = VUSBIN = 8V IBAT (µA) 5 4 3 2 1 0 –25 0 25 50 TEMPERATURE (°C) Buck Regulator Efficiency vs VCC 100 95 90 EFFICIENCY (%) EFFICIENCY (%) IOUT = 100mA IOUT = 10mA 95 90 85 IOUT = 600mA 80 75 70 65 VOUT = 1.8V 2 3 4 VCC (V) 5 6 3550 G23 80 75 70 65 60 55 50 VCC = 4.2V VCC = 3.6V EFFICIENCY (%) 85 IOUT = 1mA IOUT = 0.1mA UW 75 75 3550 G20 TA = 25°C, unless otherwise noted. Undervoltage Lockout Threshold vs Temperature 4.25 4.20 DCIN UVLO 4.15 4.10 4.05 4.00 USBIN UVLO 3.95 3.90 3.85 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 3550 G19 EN Pin Pull-Down Resistance vs Temperature 100 3550 G45 –25 50 25 0 TEMPERATURE (°C) 75 100 3550 G18 Battery Drain Current vs Temperature VBAT = 4.2V VDCIN, VUSBIN (NOT CONNECTED) IBAT 500mA/DIV Charge Current During Turn-On and Turn-Off ENABLE 5V/DIV 100 –1 –50 –25 0 25 50 TEMPERATURE (°C) 75 100 3550 G21 VDCIN = 5V RIDC = 1.25k 100µs/DIV 3550 G22 Buck Regulator Efficiency vs Output Current VOUT = 1.8V VCC = 2.7V 95 90 85 Buck Regulator Efficiency vs Output Current VOUT = 1.5V VCC = 2.7V VCC = 4.2V 80 VCC = 3.6V 75 70 65 60 0.1 60 0.1 1 10 100 OUTPUT CURRENT (mA) 1000 3550 G24 1 10 100 OUTPUT CURRENT (mA) 1000 3550 G25 3550fa 7 LTC3550 TYPICAL PERFOR A CE CHARACTERISTICS Buck Regulator Efficiency vs Output Current 100 95 90 EFFICIENCY (%) VCC = 3.6V 85 80 75 70 65 60 0.1 10 100 1 OUTPUT CURRENT (mA) 1000 3550 G26 VOUT = 2.5V VCC = 2.7V REFERENCE VOLTAGE (V) 0.604 0.599 0.594 0.589 0.584 –50 –25 FREQUENCY (MHz) VCC = 4.2V Oscillator Frequency vs VCC 1.8 1.7 OUTPUT VOLTAGE (V) FREQUENCY (MHz) 1.6 1.5 1.4 1.3 1.2 1.844 1.834 1.824 1.814 1.804 1.794 1.784 1.774 2 3 4 VCC (V) 3550 G29 RDS(ON) (Ω) Buck Regulator Switches RDS(0N) vs Temperature 0.7 VCC = 2.7V 0.6 VCC = 4.2V 0.5 RDS(ON) (Ω) 0.4 0.3 0.2 0.1 MAIN SWITCH SYNCHRONOUS SWITCH 0 50 –50 –25 25 75 0 TEMPERATURE (°C) VCC = 3.6V SUPPLY CURRENT (µA) 50 45 40 SUPPLY CURRENT (µA) 8 UW 5 100 3550 G32 TA = 25°C, unless otherwise noted. Oscillator Frequency vs Temperature 1.70 VCC = 3.6V 1.65 1.60 1.55 1.50 1.45 1.40 1.35 1.30 –50 –25 50 25 75 0 TEMPERATURE (°C) 100 125 Buck Regulator Reference Voltage vs Temperature 0.614 VCC = 3.6V 0.609 50 25 75 0 TEMPERATURE (°C) 100 125 3550 G27 3550 G28 Buck Regulator Output Voltage vs Load Current VCC = 3.6V 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 RDS(ON) vs VCC MAIN SWITCH SYNCHRONOUS SWITCH 6 0 100 200 300 400 500 600 700 800 900 LOAD CURRENT (mA) 3550 G30 0 1 2 4 3 VCC (V) 5 6 7 3550 G31 Buck Regulator Supply Current vs VCC 50 VOUT = 1.875V ILOAD = 0A 45 40 35 30 25 20 15 10 5 2 3 4 VCC (V) 5 6 3550 G33 Buck Regulator Supply Current vs Temperature VCC = 3.6V VOUT = 1.875V ILOAD = 0A 35 30 25 20 15 10 5 125 0 0 –50 –25 50 25 0 75 TEMPERATURE (°C) 100 125 3550 G34 3550fa LTC3550 TYPICAL PERFOR A CE CHARACTERISTICS Switch Leakage Current vs Temperature 300 VCC = 5.5V RUN = 0V 250 SWITCH LEAKAGE (nA) 200 150 100 50 0 –50 –25 MAIN SWITCH 20 SYNCHRONOUS SWITCH 50 25 75 0 TEMPERATURE (°C) 100 125 0 0 1 2 3 VCC (V) 4 5 6 3550 G36 SWITCH LEAKAGE (pA) Burst Mode Operation RUN 2V/DIV VOUT 1V/DIV SW 5V/DIV VOUT 100mV/DIV AC COUPLED IL 200mA/DIV VCC = 3.6V VOUT = 1.8V ILOAD = 50mA 4µs/DIV Load Step VOUT 100mV/DIV AC COUPLED VOUT 100mV/DIV AC COUPLED IL 500mA/DIV ILOAD 500mA/DIV VCC = 3.6V 20µs/DIV VOUT = 1.8V ILOAD = 50mA TO 600mA 3550 G40 UW TA = 25°C, unless otherwise noted. Switch Leakage Current vs VCC 120 100 80 60 40 SYNCHRONOUS SWITCH RUN = 0V MAIN SWITCH 3550 G35 Start-Up from Shutdown VOUT 100mV/DIV AC COUPLED IL 500mA/DIV Load Step ILOAD 500mA/DIV ILOAD 500mA/DIV VCC = 3.6V VOUT = 1.8V ILOAD = 600mA 40µs/DIV 3550 G38 3550 G37 VCC = 3.6V 20µs/DIV VOUT = 1.8V ILOAD = 0mA TO 600mA 3550 G39 Load Step VOUT 100mV/DIV AC COUPLED Load Step IL 500mA/DIV IL 500mA/DIV ILOAD 500mA/DIV VCC = 3.6V 20µs/DIV VOUT = 1.8V ILOAD = 100mA TO 600mA 3550 G41 ILOAD 500mA/DIV VCC = 3.6V 20µs/DIV VOUT = 1.8V ILOAD = 200mA TO 600mA 3550 G42 3550fa 9 LTC3550 PI FU CTIO S USBIN (Pin 1): USB Input Supply Pin. Provides power to the battery charger. The maximum supply current is 650mA. This should be bypassed with a 1µF capacitor. IUSB (Pin 2): USB Charge Current Program and Monitor Pin. The charge current can be set by connecting a resistor, RIUSB, to ground. When charging in constant-current mode, this pin servos to 1V. The voltage on this pin can be used to measure the charge current delivered from the USB input using the following formula: IBAT = VIUSB • 1000 RIUSB VFB (Pin 6): Voltage Feedback Pin. Receives the feedback voltage from an external resistor divider across the buck regulator output. VCC (Pin 7): Buck Regulator Input Supply Pin. Must be closely decoupled to GND (Pins 8, 9) with a 2.2µF or greater ceramic capacitor. GND (Pins 8, 9): Ground. SW (Pin 10): Buck Regulator Switch Node Connection to Inductor. This pin connects to the drains of the internal main (top) and synchronous (bottom) power MOSFET switches. RUN (Pin 11): Buck Regulator Run Control Input. Forcing this pin above 1.5V enables the regulator. Forcing this pin below 0.3V shuts it down. In shutdown, all buck regulator functions are disabled drawing 2.9V 2.9V < BAT CHARGE MODE FULL CURRENT CHRG STATE: PULLDOWN IBAT < ITERMINATE IN VOLTAGE MODE STANDBY MODE BAT < 4.1V NO CHARGE CURRENT CHRG STATE: Hi-Z USBIN POWER REMOVED OR DCIN POWER APPLIED ONLY USB POWER APPLIED BAT < 2.9V EN DRIVEN LOW 12 U Lithium-Ion Battery Charger A charge cycle begins when the voltage at either the DCIN pin or USBIN pin rises above the UVLO threshold level and the charger is enabled through the EN pin. When either input is supplying power, logic low enables the charger and logic high disables it (a 2MΩ pull-down defaults the charger to the charging state). The DCIN input draws 20µA when the charger is in shutdown. The USBIN input draws 18µA during shutdown if no power is applied to DCIN, but draws only 10µA when VDCIN > VUSBIN. Once the charger is enabled, it enters constant-current mode, where the programmed charge current is supplied to the battery. When the BAT pin approaches the final float voltage (4.2V), the charger enters constant-voltage TRICKLE CHARGE MODE 1/10th FULL CURRENT CHRG STATE: PULLDOWN BAT > 2.9V CHARGE MODE FULL CURRENTÞHPWR = HIGH 1/5 FULL CURRENTÞHPWR = LOW CHRG STATE: PULLDOWN IBAT < ITERMINATE IN VOLTAGE MODE STANDBY MODE NO CHARGE CURRENT CHRG STATE: Hi-Z BAT < 4.1V 2.9V < BAT BAT < 2.9V SHUTDOWN MODE IDCIN DROPS TO 20mA CHRG STATE: Hi-Z DCIN POWER REMOVED USBIN POWER REMOVED OR DCIN POWER APPLIED EN DRIVEN HIGH EN DRIVEN HIGH SHUTDOWN MODE IUSBIN DROPS TO 18mA CHRG STATE: Hi-Z 3550 F01 EN DRIVEN LOW Figure 1. LTC3550 State Diagram of a Charge Cycle 3550fa LTC3550 OPERATIO mode and the charge current begins to decrease. Once the charge current drops below the programmed termination threshold (set by the external resistor RITERM), the internal P-channel MOSFET is shut off and the charger enters standby mode. In standby mode, the charger sits idle and monitors the battery voltage using a comparator with a 6ms filter time (tRECHRG). A charge cycle automatically restarts when the battery voltage falls below 4.1V (which corresponds to approximately 80% to 90% battery capacity). This ensures that the battery is kept near a fully charged condition and eliminates the need for periodic charge cycle initiations. Figure 1 uses a state diagram to describe the behavior of the LTC3550 battery charger. 600mA Step-Down Regulator The LTC3550 regulator uses a constant frequency, current mode step-down architecture. Both the top (P-channel MOSFET) and bottom (N-channel MOSFET) switches are internal. During normal operation, the internal top power MOSFET is turned on each cycle when the oscillator sets the RS latch, and is turned off when the current comparator, ICOMP, resets the RS latch. The peak inductor current at which ICOMP resets the RS latch, is controlled by the output of error amplifier EA. When the load current increases, it causes a slight decrease in the output voltage (VOUT), relative to the internal reference, which in turn causes the EA amplifier’s output voltage to increase until the average inductor current matches the new load current. While the top MOSFET is off, the bottom MOSFET is turned on until either the inductor current starts to reverse, as indicated by the current reversal comparator IRCMP, or the beginning of the next clock cycle. Burst Mode® Operation The LTC3550 buck regulator is capable of Burst Mode operation in which the internal power MOSFETs operate intermittently based on load current demand. Burst Mode is a registered trademark of Linear Technology Corporation. 3550fa U In Burst Mode operation, the peak current of the inductor is set to approximately 200mA regardless of the output load. Each burst event can last from a few cycles at light loads to almost continuously cycling with short sleep intervals at moderate loads. In between these burst events, the power MOSFETs and any unneeded circuitry are turned off, reducing the quiescent current to 20µA. In this sleep state, the load current is being supplied solely from the output capacitor. As the output voltage droops, the EA amplifier’s output rises above the sleep threshold signaling the BURST comparator to trip and turn the top MOSFET on. This process repeats at a rate that is dependent on the load demand. Dropout Operation As the input supply voltage decreases to a value approaching the output voltage, the duty cycle increases toward the maximum on-time. Further reduction of the supply voltage forces the main switch to remain on for more than one cycle until it reaches 100% duty cycle. The output voltage will then be determined by the input voltage minus the voltage drop across the P-channel MOSFET and the inductor. An important detail to remember is that at low input supply voltages, the RDS(ON) of the P-channel switch increases (see Typical Performance Characteristics). Therefore, the user should calculate the power dissipation when the LTC3550 is used at 100% duty cycle with low input voltage (See Thermal Considerations in the Applications Information section). Short-Circuit Protection When the regulator output is shorted to ground, the frequency of the oscillator is reduced to about 210kHz, one seventh the nominal frequency. This frequency foldback ensures that the inductor current has more time to decay, thereby preventing runaway. The oscillator’s frequency will progressively increase to 1.5MHz when VFB rises above 0V. 13 LTC3550 OPERATIO Battery Charger Power Source Selection The LTC3550 can charge a battery from either the wall adapter input or the USB port input. The charger automatically senses the presence of voltage at each input. If both power sources are present, the charger defaults to the wall adapter source provided sufficient power is present at the DCIN input. “Sufficient power” is defined as: • Supply voltage is greater than the UVLO threshold. • Supply voltage is greater than the battery voltage by 50mV (180mV rising, 50mV falling). Table 1 describes the behavior of the PWR status output. Table 1. Power Source Selection VUSBIN > 3.95V and VUSBIN > BAT + 50mV VDCIN > 4.15V and VDCIN > BAT + 50mV Charger Powered from Wall Adapter Source; USBIN Current < 25µA ⎯P⎯W⎯R: LOW Charger Powered from USB Source; ⎯P⎯W⎯R: LOW VUSBIN < 3.95V or VUSBIN < BAT + 50mV Charger Powered from Wall Adapter Source ⎯P⎯W⎯R: LOW No Charging ⎯P⎯W⎯R: Hi-Z VDCIN < 4.15V or VDCIN < BAT + 50mV Status Indicators The charge status output (⎯C⎯H⎯R⎯G) has two states: pulldown and high impedance. The pull-down state indicates that the LTC3550 is in a charge cycle. Once the charge cycle has terminated or the LTC3550 is disabled, the pin state becomes high impedance. The pull-down state is strong enough to drive an LED and is capable of sinking up to 10mA. ⎯⎯ ⎯ The power supply status output (PWR) has two states: pulldown and high impedance. The pull-down state indicates that power is present at either DCIN or USBIN. If no power is applied at either pin, the ⎯P⎯W⎯R pin is high impedance, indicating that the LTC3550 lacks sufficient power to charge the battery. The pull-down state is strong enough to drive an LED and is capable of sinking up to 10mA. 14 U Low-Battery Charge Conditioning (Trickle Charge) This feature ensures that deeply discharged batteries are gradually charged before applying full charge current . If the BAT pin voltage is below 2.9V, the LTC3550 supplies 1/10th of the full charge current to the battery until the BAT pin rises above 2.9V. For example, if the charger is programmed to charge at 800mA from the wall adapter input and 500mA from the USB input, the charge current during trickle charge mode would be 80mA and 50mA, respectively. Thermal Limiting An internal thermal feedback loop reduces the programmed charge current if the die temperature attempts to rise above a preset value of approximately 105°C. This feature protects the LTC3550 from excessive temperature and allows the user to push the limits of the power handling capability of a given circuit board without risk of damaging the device. The charge current can be set according to typical (not worst-case) ambient temperature with the assurance that the charger will automatically reduce the current in worst case conditions. DFN package power considerations are discussed further in the Applications Information section. Charge Current Soft-Start and Soft-Stop The battery charger includes a soft-start circuit to minimize the inrush current at the start of a charge cycle. When a charge cycle is initiated, the charge current ramps from zero to full-scale current over a period of 250µs. Likewise, internal circuitry ramps the charge current from full-scale to zero in approximately 30µs when the charger shuts down or self terminates. This minimizes the transient current load on the power supply during start-up and shutdown. 3550fa LTC3550 APPLICATIO S I FOR ATIO Figure 2 shows the basic LTC3550 application circuit. External component selection is driven by the charging requirements and the buck regulator load requirements. L1 SW LTC3550 WALL ADAPTER USB PORT DCIN USBIN C2 RIUSB C1 RIDC IUSB IDC VFB RUN VCC BAT ITERM GND CIN RITERM R1 CF R2 VOUT 1.2V 600mA COUT + Figure 2. LTC3550 Basic Circuit Programming and Monitoring Charge Current The charge current delivered to the battery from the wall adapter supply is programmed using a single resistor from the IDC pin to ground. RIDC 1000 V = , ICHRG(DC) = ICHRG(DC) RIDC 1000 V Similarly, the charge current from the USB supply is programmed using a single resistor from the IUSB pin to ground. Setting HPWR pin to its high state will select 100% of the programmed charge current, while setting HPWR to its low state will select 20% of the programmed charge current. RIUSB = 1000 V ICHRG(USB) (HPWR = HIGH) ICHRG(USB) = ICHRG(USB) = 1000 V (HPWR = HIGH) RIUSB 200 V (HPWR = LOW) RIUSB U Charge current out of the BAT pin can be determined at any time by monitoring the IDC or IUSB pin voltage and using the following equations: IBAT = IBAT = IBAT = VIDC • 1000, (ch arg ing from wall adapter ) RIDC VIUSB • 1000, (ch arg ing from USB sup ply, RIUSB HPWR = HIGH) VIUSB • 200, (ch arg ing from USB sup ply, RIUSB HPWR = LOW) 4.2V SINGLE CELL Li-Ion BATTERY 3550 F02 W U U Programming Charge Termination The charge cycle terminates when the charge current falls below the programmed termination threshold during constant-voltage mode. This threshold is set by connecting an external resistor, RITERM, from the ITERM pin to ground. The charge termination current threshold (ITERMINATE) is set by the following equation: RITERM = 100 V ITERMINATE , ITERMINATE = 100 V RITERM The termination condition is detected by using an internal filtered comparator to monitor the ITERM pin. When the ITERM pin voltage drops below 100mV* for longer than tTERMINATE (typically 1.5ms), charging is terminated. The charge current is latched off and the LTC3550 enters standby mode. When charging, transient loads on the BAT pin can cause the ITERM pin to fall below 100mV for short periods of time before the DC charge current has dropped below the programmed termination current. The 1.5ms filter time (tTERMINATE) on the termination comparator ensures that transient loads of this nature do not result in premature charge cycle termination. Once the average charge current drops below the programmed termination threshold, the LTC3550 terminates the charge cycle and stops providing any current out of the BAT pin. In this state, any load on the BAT pin must be supplied by the battery. *Any external sources that hold the ITERM pin above 100mV will prevent the LTC3550 from terminating a charged cycle. 3550fa 15 LTC3550 APPLICATIO S I FOR ATIO Buck Regulator Inductor Selection For most applications, the value of the inductor will fall in the range of 1µH to 4.7µH. Its value is chosen based on the desired inductor ripple current. Large value inductors lower ripple current and small value inductors result in higher ripple currents. Higher VCC or VOUT also increases the ripple current as shown in Equation 1. A reasonable starting point for setting ripple current is ΔIL = 240mA (40% of 600mA). ∆ IL = VOUT fO • L ⎞ ⎛V • ⎜ 1− OUT ⎟ VCC ⎠ ⎝ (1) The DC current rating of the inductor should be at least equal to the maximum load current plus half the ripple current to prevent core saturation. Thus, a 720mA rated inductor should be enough for most applications (600mA + 120mA). For best efficiency, choose a low DC-resistance inductor. The inductor value also has an effect on Burst Mode operation. The transition to low current operation begins when the inductor current peaks fall to approximately 200mA. Lower inductor values (higher ΔIL) will cause this to occur at lower load currents, which can cause a dip in efficiency in the upper range of low current operation. In Burst Mode operation, lower inductance values will cause the burst frequency to increase. Inductor Core Selection Different core materials and shapes will change the size/current and price/current relationship of an inductor. Toroid or shielded pot cores in ferrite or permalloy materials are small and don’t radiate much energy, but generally cost more than powdered iron core inductors with similar electrical characteristics. The choice of which style inductor to use often depends more on the price vs size requirements and any radiated field/EMI requirements than on what the LTC3550 requires to operate. Table 2 shows some typical surface mount inductors that work well in LTC3550 applications. 16 U Table 2. Representative Surface Mount Inductors PART NUMBER Sumida CDRH3D16 VALUE (µH) 1.5 2.2 3.3 4.7 2.2 3.3 4.7 3.3 4.7 1.0 2.2 4.7 DCR (Ω MAX) 0.043 0.075 0.110 0.162 0.116 0.174 0.216 0.17 0.20 0.060 0.097 0.150 MAX DC CURRENT (A) 1.55 1.20 1.10 0.90 0.950 0.770 0.750 1.00 0.95 1.00 0.79 0.65 SIZE W × L × H (mm) 3.8 × 3.8 × 1.8 Sumida CMD4D06 Panasonic ELT5KT Murata LQH32CN 3.5 × 4.3 × 0.8 4.5 × 5.4 × 1.2 2.5 × 3.2 × 2.0 W U U CIN and COUT Selection In continuous mode, the source current of the top MOSFET is a square wave of duty cycle VOUT/VCC. To prevent large voltage transients, a low ESR input capacitor sized for the maximum RMS current must be used. The maximum RMS capacitor current is given by: CIN required IRMS ≅ IOMAX VOUT ( VCC − VOUT ) VCC (2) This formula has a maximum at VCC = 2VOUT, where IRMS = IOUT/2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Note that the capacitor manufacturer’s ripple current ratings are often based on 2000 hours of life. This makes it advisable to further derate the capacitor, or choose a capacitor rated at a higher temperature than required. Always consult the manufacturer if there is any question. The selection of COUT is driven by the required effective series resistance (ESR). Typically, once the ESR requirement for COUT has been met, the RMS current rating generally far exceeds the IRIPPLE(P-P) requirement. The output ripple ΔVOUT is determined by: ⎛ 1⎞ ∆ VOUT ≅ ∆ IL ⎜ ESR + 8 fCOUT ⎟ ⎠ ⎝ (3) 3550fa LTC3550 APPLICATIO S I FOR ATIO where f = operating frequency, COUT = output capacitance and ΔIL = ripple current in the inductor. For a fixed output voltage, the output ripple voltage is highest at maximum input voltage since ΔIL increases with input voltage. Aluminum electrolytic and solid tantalum capacitors are both available in surface mount configurations. In the case of tantalum, it is critical that the capacitors are surge tested for use in switching power supplies. An excellent choice is the AVX TPS series of surface mount tantalum. These are specially constructed and tested for low ESR so they give the lowest ESR for a given volume. Other capacitor types include Sanyo POSCAP, Kemet T510 and T495 series, and Sprague 593D and 595D series. Consult the manufacturer for other specific recommendations. Using Ceramic Input and Output Capacitors Higher capacitance values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. Because the LTC3550’s control loop does not depend on the output capacitor’s ESR for stable operation, ceramic capacitors can be used freely to achieve very low output ripple and small circuit size. When choosing the input and output ceramic capacitors, choose the X5R or X7R dielectric formulations. These dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size. Output Voltage Programming The output voltage is set by a resistive divider according to the following formula: ⎛ R2 ⎞ VOUT = 0.6 V ⎜ 1+ ⎟ ⎝ R1⎠ POWER LOSS (W) The external resistive divider is connected to the output, allowing remote voltage sensing as shown in Figure 3. Efficiency Considerations The efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is U 0.6V ≤ VOUT ≤ 5.5V R2 VFB LTC3550 GND 3550 F03 W U U R1 Figure 3. Setting the LTC3550 Output Voltage limiting the efficiency and which change would produce the most improvement. Efficiency can be expressed as: Efficiency = 100% – (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percentage of input power. Although all dissipative elements in the circuit produce losses, two main sources usually account for most of the losses in LTC3550 circuits: VCC quiescent current and I2R losses. The VCC quiescent current loss dominates the efficiency loss at very low load currents whereas the I2R loss dominates the efficiency loss at medium to high load currents. In a typical efficiency plot, the efficiency curve at very low load currents can be misleading since the actual power lost is of no consequence as illustrated in Figure 4. 1. The VCC quiescent current is due to two components: the DC bias current as given in the Electrical Characteristics and the internal main switch and synchronous 1 0.1 (4) 0.01 0.001 0.0001 0.00001 0.1 1 10 100 LOAD CURRENT (mA) 1000 3550 F04 Figure 4. Power Lost vs Load Current 3550fa 17 LTC3550 APPLICATIO S I FOR ATIO switch gate charge currents. The gate charge current results from switching the gate capacitance of the internal power MOSFET switches. Each time the gate is switched from high to low to high again, a packet of charge, dQ, moves from VCC to ground. The resulting dQ/dt is the current out of VCC that is typically larger than the DC bias current. In continuous mode, IGATECHG = f(QT + QB) where QT and QB are the gate charges of the internal top and bottom switches. Both the DC bias and gate charge losses are proportional to VCC and thus their effects will be more pronounced at higher supply voltages. 2. I2R losses are calculated from the resistances of the internal switches, RSW, and external inductor RL. In continuous mode, the average output current flowing through inductor L is “chopped” between the main switch and the synchronous switch. Thus, the series resistance looking into the SW pin is a function of both top and bottom MOSFET RDS(ON) and the duty cycle (DC) as follows: RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC) The RDS(ON) for both the top and bottom MOSFETs can be obtained from the Typical Performance Characteristics curves. Thus, to obtain I2R losses, simply add RSW to RL and multiply the result by the square of the average output current. Other losses including CIN and COUT ESR dissipative losses and inductor core losses generally account for less than 2% total additional loss. Thermal Considerations The battery charger’s thermal regulation feature and the buck regulator’s high efficiency make it unlikely that enough power will be dissipated to exceed the LTC3550 maximum junction temperature. Nevertheless, it is a good idea to do some thermal analysis for worst-case conditions. The junction temperature, TJ, is given by: TJ = TA + TRISE where TA is the ambient temperature. The temperature rise is given by: TRISE = PD • θJA where PD is the power dissipated and θJA is the thermal resistance from the junction of the die to the ambient temperature. 18 U In most applications the buck regulator does not dissipate much heat due to its high efficiency. The majority of the LTC3550 power dissipation occurs when charging a battery. Fortunately, the LTC3550 automatically reduces the charge current during high power conditions using a patented thermal regulation circuit. Thus, there is no need to design for worst-case power dissipation scenarios because the LTC3550 ensures that the battery charger power dissipation never raises the junction temperature above a preset value of 105°C. In the unlikely case that the junction temperature is forced above 105°C (due to abnormally high ambient temperatures or excessive buck regulator power dissipation), the battery charge current will be reduced to zero and thus dissipate no heat. As an added measure of protection, even if the junction temperature reaches approximately 150°C, the buck regulator’s power switches will be turned off and the SW node will become high impedance. The conditions that cause the LTC3550 to reduce charge current through thermal feedback can be approximated by considering the power dissipated in the IC. The approximate ambient temperature at which the thermal feedback begins to protect the IC is: TA = 105°C – TRISE TA = 105°C – (PD • θJA) TA = 105°C – (PD(CHARGER) + PD(BUCK)) • θJA (5) Most of the charger’s power dissipation is generated from the internal charger MOSFET. Thus, the power dissipation is calculated to be: PD(CHARGER) = (VIN – VBAT) • IBAT (6) VIN is the charger supply voltage (either DCIN or USBIN), VBAT is the battery voltage and IBAT is the charge current. Example: An LTC3550 operating from a 5V wall adapter (on the DCIN input) is programmed to supply 650mA full-scale current to a discharged Li-Ion battery with a voltage of 3V. The charger power dissipation is calculated to be: PD(CHARGER) = (5V – 3V) • 650mA = 1.3W 3550fa W U U LTC3550 APPLICATIO S I FOR ATIO For simplicity, assume the buck regulator is disabled and dissipates no power (PD(BUCK) = 0). For a properly soldered DHC16 package, the thermal resistance (θJA) is 40°C/W. Thus, the ambient temperature at which the LTC3550 charger will begin to reduce the charge current is: TA = 105°C – (1.3W • 40°C/W) TA = 105°C – 52°C TA = 53°C The LTC3550 can be used above 53°C ambient, but the charge current will be reduced from 650mA. Assuming no power dissipation from the buck converter, the approximate current at a given ambient temperature can be approximated by: IBAT = 105 °C – TA ( VIN – VBAT ) • θ JA (7) Using the previous example with an ambient temperature of 60°C, the charge current will be reduced to approximately: IBAT = 105 °C – 60 °C 45 °C = (5V – 3V) • 40 °C/W 80 °C/A IBAT = 563mA Because the regulator typically dissipates significantly less power than the charger (even in worst-case situations), the calculations here should work well as an approximation. However, the user may wish to repeat the previous analysis to take the buck regulator’s power dissipation into account. Equation (7) can be modified to take into account the temperature rise due to the buck regulator: IBAT = 105 °C – TA − (PD(BUCK ) • θ JA ) ( VIN – VBAT ) • θ JA (8) For optimum performance, it is critical that the exposed metal pad on the backside of the LTC3550 package is properly soldered to the PC board ground. When correctly soldered to a 2500mm2 double sided 1oz copper board, the LTC3550 has a thermal resistance of approximately 40°C/W. Failure to make thermal contact between the exposed pad on the backside of the package and the copper board will result in thermal resistances far greater than 40°C/W. As U an example, a correctly soldered LTC3550 can deliver over 800mA to a battery from a 5V supply at room temperature. Without a good backside thermal connection, this number would drop to much less than 500mA. Battery Charger Stability Considerations The constant-voltage mode feedback loop is stable without any compensation provided a battery is connected to the charger output. When the charger is in constant-current mode, the charge current program pin (IDC or IUSB) is in the feedback loop, not the battery. The constant-current mode stability is affected by the impedance at the charge current program pin. With no additional capacitance on this pin, the charger is stable with program resistor values as high as 20k (ICHG = 50mA); however, additional capacitance on these nodes reduces the maximum allowed program resistor value. Checking Regulator Transient Response The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. When a load step occurs, VOUT immediately shifts by an amount equal to (ΔILOAD • ESR), where ESR is the effective series resistance of COUT. ΔILOAD also begins to charge or discharge COUT, which generates a feedback error signal. The regulator loop then acts to return VOUT to its steady state value. During this recovery time VOUT can be monitored for overshoot or ringing that would indicate a stability problem. For a detailed explanation of switching control loop theory, see Application Note 76. A second, more severe transient is caused by switching in loads with large (>1µF) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can deliver enough current to prevent this problem if the load switch resistance is low and it is driven quickly. The only solution is to limit the rise time of the switch drive so that the load rise time is limited to approximately (25 • CLOAD). Thus, a 10µF capacitor charging to 3.3V would require a 250µs rise time, limiting the charging current to about 130mA. 3550fa W U U 19 LTC3550 APPLICATIO S I FOR ATIO Protecting the USB Pin and Wall Adapter Input from Overvoltage Transients Caution must be exercised when using ceramic capacitors to bypass the USBIN pin or the wall adapter inputs. High voltage transients can be generated when the USB or wall adapter is hot-plugged. When power is supplied via the USB bus or wall adapter, the cable inductance along with the self resonant and high Q characteristics of ceramic capacitors can cause substantial ringing which could exceed the maximum voltage ratings and damage the LTC3550. Refer to Linear Technology Application Note 88, entitled “Ceramic Input Capacitors Can Cause Overvoltage Transients” for a detailed discussion of this problem. The long cable lengths of most wall adapters and USB cables makes them especially susceptible to this problem. To bypass the USB and the wall adapter inputs, add a 1Ω resistor in series with a ceramic capacitor to lower the effective Q of the network and greatly reduce the ringing. A tantalum, OS-CON, or electrolytic capacitor can be used in place of the ceramic and resistor, as their higher ESR reduces the Q, thus reducing the voltage ringing. The oscilloscope photograph in Figure 5 shows how serious the overvoltage transient can be for the USB and wall adapter inputs. For both traces, a 5V supply is hot-plugged using a three foot long cable. For the top trace, only a 4.7µF ceramic X5R capacitor (without the recommended 1Ω series resistor) is used to locally bypass the input. This trace shows excessive ringing when the 5V cable is inserted, with the overvoltage spike reaching 10V. For the bottom trace, a 1Ω resistor is added in series with the 4.7μF ONLY 2V/DIV 4.7μF + 1Ω 2V/DIV 3550 F04 20μs/DIV Figure 5. Waveforms Resulting from Hot-Plugging a 5V Input Supply When Using Ceramic Bypass Capacitors 20 U 4.7µF ceramic capacitor to locally bypass the 5V input. This trace shows the clean response resulting from the addition of the 1Ω resistor. Even with the additional 1Ω resistor, bad design techniques and poor board layout can often make the overvoltage problem even worse. System designers often add extra inductance in series with input lines in an attempt to minimize the noise fed back to those inputs by the application. In reality, adding these extra inductances only makes the overvoltage transients worse. Since cable inductance is one of the fundamental causes of the excessive ringing, adding a series ferrite bead or inductor increases the effective cable inductance, making the problem even worse. For this reason, do not add additional inductance (ferrite beads or inductors) in series with the USB or wall adapter inputs. For the most robust solution, 6V transorbs or zener diodes may also be added to further protect the USB and wall adapter inputs. Two possible protection devices are the SM2T from STMicroelectronics and the EDZ series devices from ROHM. Always use an oscilloscope to check the voltage waveforms at the USBIN and DCIN pins during USB and wall adapter hot-plug events to ensure that overvoltage transients have been adequately removed. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3550. These items are also illustrated graphically in Figures 6 and 7. Check the following in your layout: BOLD LINES INDICATE HIGH CURRENT PATHS 6 7 LTC3550 VFB VCC SW GND 17 10 VCC W U U + – R1 R2 CIN 8 GND 9 – COUT L1 VOUT + 3550 F06 CF Figure 6. DC-DC Converter Layout Diagram 3550fa LTC3550 APPLICATIO S I FOR ATIO U VIA TO VCC VFB SW RUN L1 VCC GND COUT VOUT 3550 F07 CF VIA TO VOUT R2 VIA TO GND R1 1. The power traces, consisting of the GND trace, the SW trace and the VCC trace should be kept short, direct and wide. 2. Does the VFB pin connect directly to the feedback resistors? The resistive divider R1/R2 must be connected between the (+) plate of COUT and ground. 3. Does the (+) plate of CIN connect to VCC as closely as possible? This capacitor provides the AC current to the internal power MOSFETs. 4. Keep the switching node, SW, away from the sensitive VFB node. 5. Keep the (–) plates of CIN and COUT as close as possible. 6. Solder the exposed pad on the backside of the package to PC board ground for optimum thermal performance. The thermal resistance of the package can be further enhanced by increasing the area of the copper used for PC board ground. W U U CIN Figure 7. DC-DC Converter Suggested Layout Design Example As a design example, assume the LTC3550 is used in a single lithium-ion battery-powered cellular phone application. The battery is charged by either plugging a wall adapter cable into the phone or putting the phone in a USB cradle. The optimum charge current for this particular lithium-ion battery is determined to be 800mA. The buck regulator output voltage needs to be 1.8V. Starting with the charger, choosing RIDC to be 1.24k programs the charger for 806mA. Choosing RIUSB to be 2.1k programs the charger for 475mA when charging from the USB cradle, ensuring that the charger never exceeds the 500mA maximum current supplied by the USB port. A good rule of thumb for ITERMINATE is onetenth the full charge current, so RITERM is picked to be 1.24k (ITERMINATE = 80mA). Moving on to the step-down converter, VCC will be powered from the battery which can range from a maximum of 4.2V down to about 2.7V. The load current requirement 3550fa 21 LTC3550 APPLICATIO S I FOR ATIO is a maximum of 600mA but most of the time it will be in standby mode, requiring only 2mA. Efficiency at both low and high load currents is important. With this information we can calculate L using Equation (1), ∆ IL = VOUT fO • L ⎞ ⎛V • ⎜ 1− OUT ⎟ VCC ⎠ ⎝ Substituting VOUT = 1.8V, VCC = 4.2V, ΔIL = 240mA and fO = 1.5MHz in Equation (3) gives: 1 . 8V ⎛ 1 . 8V ⎞ L= = 2 . 86 µ H • ⎜1− ⎠ 1 . 5MHz • (240mA) ⎝ 4 . 2V ⎟ 2.2µH* SW LTC3550 WALL ADAPTER USB PORT DCIN EN USBIN 1µF 1µF 2.1k 1% 1.24k 1% IUSB IDC VFB RUN VCC BAT ITERM GND 800mA (WALL) 475mA (USB) 4.7µF† 1.24k 1% 301k 22pF 604k EFFICIENCY (%) * MURATA LQH32CN2R2M33 ** TAIYO YUDEN JMK316BJ106ML † TAIYO YUDEN LMK212BJ475MG Figure 8a. Design Example Circuit TYPICAL APPLICATIO S Full Featured Dual Input Charger Plus Step-Down Converter 800mA (WALL) 475mA (USB) DCIN LTC3550 USB POWER USBIN 1mF 1mF EN IUSB IDC ITERM 2.1k 1% 1.24k 1% 1k 1% GND PWR CHRG RUN VCC SW VFB 2.2mH 22mF 604k 301k 3550 TA03 WALL ADAPTER 22 U A 2.2µH inductor works well for this application. For best efficiency choose a 720mA or greater inductor with less than 0.2Ω series resistance. CIN will require an RMS current rating of at least 0.3A = ILOAD(MAX)/2 at temperature and COUT will require an ESR of less than 0.25Ω. In most cases, a ceramic capacitor will satisfy this requirement. For the feedback resistors, choose R1 = 301k. R2 can then be calculated from equation (4) to be: ⎛V ⎞ R2 = R1⎜ OUT – 1⎟ = 604k ⎝ 0.6 ⎠ Figure 8 shows the complete circuit along with its efficiency curve. 95 VOUT 1.8V 10µF** 600mA CER 90 85 80 75 70 4.2V SINGLE-CELL Li-Ion BATTERY 3550 F08a W U U U VOUT = 1.8V VCC = 2.7V VCC = 4.2V VCC = 3.6V + 65 60 0.1 1 10 100 OUTPUT CURRENT (mA) 1000 3550 G24 Figure 8b. Buck Regulator Efficiency vs Output Current BAT 1k 1k 4.7mF + 4.2V SINGLE-CELL Li-Ion BATTERY 10mF CER VOUT 1.8V 600mA 3550fa LTC3550 PACKAGE DESCRIPTIO U DHC Package 16-Lead Plastic DFN (5mm × 3mm) (Reference LTC DWG # 05-08-1706) 0.65 ± 0.05 3.50 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 4.40 ± 0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 5.00 ± 0.10 (2 SIDES) R = 0.20 TYP R = 0.115 TYP 9 16 0.40 ± 0.10 3.00 ± 0.10 (2 SIDES) PIN 1 TOP MARK (SEE NOTE 6) 8 0.200 REF 0.75 ± 0.05 4.40 ± 0.10 (2 SIDES) BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 1 0.25 ± 0.05 0.50 BSC 1.65 ± 0.10 (2 SIDES) PIN 1 NOTCH (DHC16) DFN 1103 1.65 ± 0.05 2.20 ± 0.05 (2 SIDES) 0.00 – 0.05 3550fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23 LTC3550 TYPICAL APPLICATIO Dual Input Charger Plus Step-Down Converter with Wall Adapter PowerPath™ EN DCIN LTC3550 RUN USB POWER USBIN 1µF IUSB IDC ITERM 2.1k 1% 1.24k 1% 1k 1% GND 22pF 604k 301k PowerPath is a trademark of Linear Technology Corporation 3550 TA04 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 20µA, ThinSOT Package LTC3406/LTC3406B 1.5MHz, 600mA Synchronous Step-Down DC/DC Converter in ThinSOTTM LTC3455 LTC3456 LTC3550-1 LTC3552-1 Dual DC/DC Converter with USB Power Management and Li-Ion Battery Charger 2-Cell Multi-Output DC/DC Converter with USB Power Manager Efficiency >96%, Accurate USB Current Limiting (500mA/100mA), 4mm × 4mm QFN-24 Package Seamless Transition Between 2-Cell Battery, USB and AC Wall Adapter Input Power Sources, QFN Package Dual Input USB/AC Adapter Li-Ion Battery Synchronous Buck Converter, Efficiency = 93%, Output = 1.875V at 600mA, Charge Charger with 600mA Buck Converter Current = 950mA Programmable 5mm × 3mm 16-Lead DFN Package Standalone Linear Li-Ion Battery Charger with Dual Synchronous Buck Converter Synchronous Buck Converter, Efficiency > 90%, Outputs = 1.8V at 800mA, 1.575V at 400mA, Charge Current Programmable up to 950mA, USB Compatible, 5mm × 3mm 16-Lead DFN Package LTC4055 LTC4058 LTC4063 LTC4068 LTC4075 USB Power Controller and Battery Charger Charges Single-Cell Li-Ion Batteries Directly from USB Port, Thermal Regulation, 4mm × 4mm QFN-16 Package Standalone 950mA Lithium-Ion Charger in DFN Standalone Li-Ion Charger Plus LDO Standalone Linear Li-Ion Battery Charger with Programmable Termination Dual Input Standalone Li-Ion Battery Charger Dual Input Standalone Li-Ion Battery Charger Dual Input Standalone Li-Ion Battery Charger C/10 Charge Termination, Battery Kelvin Sensing, ±7% Charge Accuracy 4.2V, ±0.35% Float Voltage, Up to 1A Charge Current, 100mA LDO Charge Current up to 950mA, Thermal Regulation, 3mm × 3mm DFN-8 Package Charges Single-Cell Li-Ion Batteries from Wall Adapter and USB Inputs with Automatic Input Power Detection and Selection, 950mA Charger Current, Thermal Regulation, C/X Charge Termination, 3mm × 3mm DFN Package Charges Single-Cell Li-Ion Batteries from Wall Adapter and USB Inputs with Automatic Input Power Detection and Selection, 950mA Charger Current, Thermal Regulation, USB Low Power Mode Select, C/X Charge Termination, 3mm × 3mm DFN Package Charges Single-Cell Li-Ion Batteries from Wall Adapter and USB Inputs with Automatic Input Power Detection and Selection, 950mA Charger Current, Thermal Regulation, Programmable USB Low Power Mode, C/10 Charge Termination, 3mm × 3mm DFN Package LTC4076 LTC4077 ThinSOT is a trademark of Linear Technology Corporation. 3550fa 24 Linear Technology Corporation (408) 432-1900 ● FAX: (408) 434-0507 ● 1630 McCarthy Blvd., Milpitas, CA 95035-7417 www.linear.com © LINEAR TECHNOLOGY CORPORATION 2006 U 1µF WALL ADAPTER VCC 4.7µF BAT 2.2µH SW VFB 10µF CER VOUT 1.8V 600mA 1k 800mA (WALL) 475mA (USB) + 4.2V SINGLE-CELL Li-Ion BATTERY LT 0406 REV A • PRINTED IN USA
LTC3550
PDF文档中包含以下信息:

1. 物料型号:型号为LM5111。

2. 器件简介:LM5111是一款由国家半导体公司生产的同步降压DC/DC转换器,适用于需要高效率和低噪声的应用。

3. 引脚分配:LM5111有8个引脚,包括输入电压、输出电压、地、使能、反馈、开关节点等。

4. 参数特性:包括输入电压范围、输出电压范围、最大输出电流、静态电流等。

5. 功能详解:详细介绍了LM5111的工作原理、内部结构和功能。

6. 应用信息:适用于便携式电子设备、电池供电设备等。

7. 封装信息:提供多种封装选项,如SOIC、SOT23等。
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