RH1028MW

DICE/DWF SPECIFICATION RH1028M/RH1128M Ultralow Noise Precision High Speed Op Amps PAD FUNCTION 1 DIE CROSS REFERENCE LTC Finished Part Number RH1028MW RH1028MW RH1128MW RH1128MW Order Part Number RH1028 DICE RH1028 DWF* RH1128 DICE RH1128 DWF* 2 3 8 7 1. 2. 3. 4. 5. 6. 7. 8. VOS TRIM –IN +IN V– OVER-COMP OUT V+ VOS TRIM X = 0 for LT1028B, 1 for LT1128B Please refer to LTC standard product data sheet for other applicable product information. *DWF = DICE in wafer form. 6 4 5 114mils × 81mils, Backside (substrate) metal: Alloyed gold layer Backside potential: Connect to V – L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. DICE/DWF ELECTRICAL TEST LIMITS SYMBOL VOS IOS IB VIN CMRR PSRR A VOL PARAMETER Input Offset Voltage (Note 1) Input Offset Current Input Bias Current Input Voltage Range Common Mode Rejection Ratio Power Supply Rejection Ratio Large Scale Voltage Gain VCM = ±11V VCM = ±10.3V VCM = 0V VCM = 0V CONDITIONS VS = ±15V, TA = 25°C, VCM = 0V, unless otherwise noted. MIN MAX 300 150 ±400 ±11 110 110 5 3.5 2 ±12 ±10.5 UNITS μV nA nA V dB dB V/μV V/μV V/μV V V VS = ±4V to ±16V VS = ±4.5V to ±16V RL ≥ 2k, VO = ±10V RL ≥ 1k, VO = ±10V RL ≥ 600Ω, VO = ±10V RL ≥ 2k RL ≥ 600Ω VOUT Maximum Output Voltage Swing Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 1 DICE/DWF SPECIFICATION RH1028M/RH1128M DICE/DWF ELECTRICAL TEST LIMITS SYMBOL SR IS PARAMETER Slew Rate Supply Current CONDITIONS A VCL = –1 (RH1028) A VCL = –1 (RH1128) VS = ±15V, TA = 25°C, VCM = 0V, unless otherwise noted. MIN 11 4.5 10.5 MAX UNITS V/μs V/μs mA Note 1: Input offset voltage measurements are performed by automatic test equipment approximately 0.5 seconds after application of power. Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D.No. 66-13-1028 2 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● LT 0908 • PRINTED IN USA www.linear.com © LINEAR TECHNOLOGY CORPORATION 2008