RH1573K

DICE/DWF SPECIFICATION RH1573K Low Dropout PNP Regulator Driver 5 6 4 PAD FUNCTION 1. 2. 3. 4. 5. 6. 7. 8. 9. DRIVE VIN VOUT COMP GND1** FB LATCH SHDN GND2** DIE CROSS REFERENCE LTC Finished Part Number RH1573K† RH1573K† Order Part Number RH1573KDICE† RH1573KDWF*,† 7 3 8 9 2 Please refer to LTC standard product data sheet for other applicable product information. *DWF = DICE in wafer form. 1 **GND1 and GND2 are connected together to form GND 61mils × 72mils, 12mils thick. † Backside metal: Alloyed gold layer (K designator) Backside potential: lowest (GND) voltage L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. DICE/DWF ELECTRICAL TEST LIMITS PARAMETER Reference Voltage Line Regulation (VFB) Load Regulation (VFB) FB Pin Bias Current DRIVE Pin Current DRIVE Pin Saturation Voltage CONDITIONS TA = 25°C. MIN 1.252 MAX 1.278 2 18 4 1.2 290 0.2 1 UNITS V mV mV μA mA mA V V IDRIVE = 20mA, TJ = 25°C IDRIVE = 20mA, 3V < VIN < 7V IDRIVE = 20mA to 250mA VFB = 1.265V VFB = 1.35V, VDRIVE = 7V VFB = 1.15V, VDRIVE = 1.5V IDRIVE = 20mA, VFB = 1.15V IDRIVE = 250mA, VFB = 1.15V Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 1 DICE/DWF SPECIFICATION RH1573K DICE/DWF ELECTRICAL TEST LIMITS PARAMETER SHDN Pin Threshold Voltage SHDN Pin Current LATCH Pin Latch-Off Threshold Voltage LATCH Pin Charging Current LATCH Pin Latching Current VIN to VOUT Differential Threshold for Latch Disable Input Quiescent Current Minimum Input Voltage for Bias Operation Note 1: For circuit operation and application information refer to LT1573 data sheet. VIN = 7V 2.4 Note 2: For post radiation performance contact factory. 0.55 VSHDN = 5V 1.1 4 CONDITIONS TA = 25°C. MIN 1 MAX 1.5 300 1.8 10 0.85 0.8 2.8 UNITS V μA V μA mA V mA V Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D.No. 66-13-rh1573 2 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● LT 0808 • PRINTED IN USA www.linear.com © LINEAR TECHNOLOGY CORPORATION 2008