DICE/DWF SPECIFICATION RH3080MK Adjustable 0.9A Single Resistor Low Dropout Regulator
PAD FUNCTION
1. 2. 3. 4. 5. IN OUT SENSE SET VCONTROL
DIE CROSS REFERENCE
LTC Finished Part Number RH3080MK RH3080MK Order Part Number RH3080MKDICE RH3080MKDWF*
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Please refer to LTC standard product data sheet for other applicable product information. *DWF = DICE in wafer form.
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L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
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44mils × 75mils, Backside metal: Alloyed gold layer Backside potential: OUT Tie SENSE to OUT
DESCRIPTION
The RH3080 is a 0.9A low dropout linear regulator with a unique architecture featuring a precision current source and voltage follower which allows the output to be programmed to any voltage between zero and 36V. Multiple regulators can be paralleled to increase total output current and spread heat over a system PC board with no need for heat sinking. The pass transistor collector can be brought out independently of the circuit supply voltage to allow dropout voltage to approach the saturation limit of the pass transistor. A small 2.2μF capacitor on the output with an ESR of less than 0.5Ω is adequate to insure stability. Applications with large output load transients require a larger output capacitor value to minimize output voltage change. Input circuitry insures output safe operating area current limiting and thermal shutdown protection. The rated output current of an RH3080-based part is fixed by internal wire length/resistance. Linear Technology dice element evaluations are based on parts rated for 0.9A output current.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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DICE/DWF SPECIFICATION RH3080MK DICE/DWF ELECTRICAL TEST LIMITS
PARAMETER SET Pin Current (Note 6) Output Offset Voltage (VOUT – VSET) Load Regulation, ISET Load Regulation, VOS Line Regulation, ISET Line Regulation, VOS Minimum Load Current (Note 3) VCONTROL Dropout Voltage (Note 4) VIN Dropout Voltage (Note 4) VCONTROL Pin Current (Note 5) CONDITIONS VIN = 1V, VCONTROL = 2V, ILOAD = 1mA VIN = 1V, VCONTROL = 2V, ILOAD = 1mA ILOAD = 1mA to 100mA ILOAD = 1mA to 100mA VIN = 1V to 26V, VCONTROL = 2V to 26V, ILOAD = 1mA VIN = 1V to 26V, VCONTROL = 2V to 26V, ILOAD = 1mA VIN = 10V, VCONTROL = 10V, VOUT = 0.1V VIN = 26V, VCONTROL = 26V, VOUT = 0.1V VIN = 1V, ILOAD = 0.1A VCONTROL = 2V, ILOAD = 0.1A VIN = 1V, VCONTROL = 2V, ILOAD = 0.1A
TA = 25°C. All voltages are relative to OUT.
MIN 9.9 –5 –15 –1.0 –0.45 –0.05 MAX 10.1 5 15 1.0 0.45 0.05 0.4 0.9 1.4 0.17 5.3 UNITS μA mV nA mV nA/V mV/V mA mA V V mA
Note 1: Dice are probe tested at 25°C to the limits shown except for high current tests. Dice are tested under low current conditions which assure full load current specifications when assembled in packaging systems approved by Linear Technology. Note 2: Unless otherwise specified, all voltages are with respect to VOUT. The RH3080MKDICE is tested at die sort under pulse load conditions such that TA ≅ TJ. Note 3: Minimum load current is equivalent to the quiescent current of the part. Since all quiescent and drive current is delivered to the output of the part, the minimum load current is the minimum current required to maintain regulation.
Note 4: Dropout results from either of minimum control voltage , VCONTROL , or minimum input voltage , VIN , both specified with respect to VOUT . These specifications represent the minimum input-to-output differential voltage required to maintain regulation. Note 5: The VCONTROL pin current is the drive current required for the output transistor. This current tracks output current with roughly a 1:60 ratio. The minimum value is equal to the quiescent current of the device. Note 6: SET pin is clamped to the output with diodes. These diodes only carry current under transient overloads.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production.
I.D.No. 66-13-3080 LT 0510 • PRINTED IN USA
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Linear Technology Corporation
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