LTSN-E263HEGBK

SMD LED Product Data Sheet LTSN-E263HEGBK Spec No. :DS22-2017-0026 Effective Date: 05/16/2018 Revision: C LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto SMD LED LTSN-E263HEGBK 1. Description SMD LED lamps from Lite-On are available in miniature sizes and special configurations for automated PC board assembly and space-sensitive applications. These SMD LED lamps are suitable for use in a wide variety of electronic equipment, including cordless and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications. 1.1 Features








1.2 Applications Meet ROHS Package in 8mm tape on 7" diameter reels EIA STD package Compatible with automatic placement equipment Compatible with infrared reflow solder process Preconditioning: accelerate to JEDEC level 3 Control circuit and RGB chip are integrated in the package, form a complete control of pixel point. Each of the three primary colors can achieve 256 brightness steps, to form 16,777,216 combination colors, and scan frequency is no less than 400 KHz/s. Cascading port transmission signal by single line.





Telecommunication, Office automation, home appliances, industrial equipment Status indicator Signal and Symbol Luminary Front panel backlighting Full-color module, full color soft lights a lamp strip. LED decorative lighting, indoor LED video irregular displays 2. Package Dimensions Part No. Lens Color LTSN-E263HEGBK Water Clear Source Color AlInGaP Red PIN No. Symbol 1 VDD Power supply LED Control data signal input InGaN Green 2 DIN InGaN Blue 3 DOUT 4 VSS Function description Control data signal output Ground Notes: 1. 2. All dimensions are in millimeters.(inches) Tolerance is ±0.1 mm (.004") unless otherwise noted. 1/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 3. Rating and Characteristics 3.1 Absolute Maximum Ratings at Ta=25°C Parameter LTSN-E263HEGBK Unit LED Forward Current (Per Chip) 18 mA Total DC Current (VDD) 58 mA IC Power supply voltage (VDD) +5.5 V IC Input voltage (VI) -0.5~VDD+0.5 V Internal scan frequency 800 KHz Operating Temperature Range -20 ºC to + 80 ºC Storage Temperature Range -30 ºC to + 100 ºC Infrared Soldering Condition 260 °C For 10 Seconds 3.2 Suggest IR Reflow Condition For Pb Free Process: 2/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 3.3 Electrical / Optical Characteristics at Ta=25°C LTSN-E263HEGBK Parameter Luminous Intensity Viewing Angle Dominant Wavelength Symbol IV 2θ1/2 λd color MIN TYP. MAX Red 180.0 - 710.0 Green 280.0 - 1120.0 Blue 71.0 - 280.0 - 120 Red 612.0 - 630.0 Green 518.0 - 536.0 Blue 462.0 - 474.0 Unit Test Condition mcd VDD=5V Note 1 deg Note 2 (Fig.5) nm VDD=5V Note 3 3.4 Electrical Characteristics (Ta=-20~+70°C, V DD=4.5~5.0V, VSS=0V, unless otherwise specified) LTSN-E263HEGBK Parameter Input current Symbol Unit Condition MIN TYP. MAX II VI=VDD/VSS - - ±1 μA VIH DIN 0.7VDD - - V VIL DIN - - 0.3VDD V VH DIN - 0.35 - V Input voltage level Hysteresis voltage 3.5 Switching Characteristics (Ta=-20~+70°C, V DD=4.5~5.0V, VSS=0V, unless otherwise specified) LTSN-E263HEGBK Parameter Symbol Propagation delay time TPLZ Fall time TTHZ Input capacity CI Unit Condition DIN→DOUT CL=15pF, RL=10K Ω CL=300pF, OUTR/OUTG/OUTB - MIN TYP. MAX - - 300 ns - - 20 μs - - 15 pF 3/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 3.6 Data transfer time
Timing Wave Form
High Speed mode Item Description Typical Allowance T0H 0 code, High-level time 300ns ± 80ns T0L 0 code, Low-level time 900ns ± 80ns T1H 1 code, High-level time 900ns ± 80ns T1L 1 code, Low-level time 300ns ± 80ns RES Reset time >50us - Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 4. Bin Rank 4.1 Bin code list
IV Rank Luminous Intensity Color : Red , Unit : mcd @18mA Bin Code Min. Max. S 180.0 280.0 T 280.0 450.0 U 450.0 710.0 Tolerance on each Luminous Intensity bin is +/- 15% Luminous Intensity Color : Green , Unit : mcd @18mA Bin Code Min. Max. T 280.0 450.0 U 450.0 710.0 V 710.0 1120.0 Tolerance on each Luminous Intensity bin is +/- 15% Luminous Intensity Color : Blue , Unit : mcd @18mA Bin Code Min. Max. Q 71.0 112.0 R 112.0 180.0 S 180.0 280.0 Tolerance on each Luminous Intensity bin is +/- 15% 5/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK
Hue Rank Dominant Wavelength Color : Red , Unit : nm @18mA Bin Code Min. Max. R1 612.0 618.0 R2 618.0 624.0 R3 624.0 630.0 Tolerance for each Dominate Wavelength bin is +/- 1nm Dominant Wavelength Color : Green , Unit : nm @18mA Bin Code Min. Max. G1 518.0 524.0 G2 524.0 530.0 G3 530.0 536.0 Tolerance for each Dominate Wavelength bin is +/- 1nm Dominant Wavelength Color : Blue , Unit : nm @18mA Bin Code Min. Max. B1 462.0 466.0 B2 466.0 470.0 B3 470.0 474.0 Tolerance for each Dominate Wavelength bin is +/- 1nm 6/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 5. Typical Electrical / Optical Characteristics Curves. (25°C Ambient Temperature Unless Otherwise Noted) 7/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 6. User Guide 6.1 Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. 6.2 Recommend Printed Circuit Board Attachment Pad 6.3 Package Dimensions of Tape And Reel Note: 1. All dimensions are in millimeters (inches). 8/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 6.4 Package Dimensions of Reel Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-4000 pieces per reel. 3. Minimum packing quantity is 500 pieces for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481 specifications. 9/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 7. Cautions 7.1 Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7.2 Storage The package is sealed: The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week. (MSL 3). For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C for at least 20 hours before solder assembly. 7.3 Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 7.4 Soldering Recommended soldering conditions: Reflow soldering Pre-heat Pre-heat time Peak temperature Soldering time 150~200°C 120 sec. Max. 260°C Max. 10 sec. Max.(Max. two times) Soldering iron Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) Notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. 10/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 7.5 ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:



Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. 11/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 8. Reliability Test Classification Test Item Test Condition Operation Life Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS) High Temperature High Humidity Endurance Storage Reference Standard MIL-STD-750D:1026 MIL-STD-883D:1005 JIS C 7021:B-1 IR-Reflow In-Board, 2 Times MIL-STD-202F:103B JIS C 7021:B-11 Ta= 65±5℃,RH= 90～95% *Test Time= 240HRS±2HRS Test High Temperature Storage Low Temperature Ta= 105±5℃ *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 JIS C 7021:B-10 Ta= -55±5℃ JIS C 7021:B-12 Storage Temperature *Test Time=1000HRS (-24HRS,+72H RS) MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS C 7021:A-4 105 ºC ～ 25 ºC ～ -55 ºC ～ 25 ºC Cycling 30mins 5mins 10 Cycles 30mins Thermal IR-Reflow In-Board, 2 Times 85 ± 5℃ ～ -40℃ ± 5℃ 5mins MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 Shock 10mins Solder T.sol= 260 ± 5 ºC Dwell Time= 10 ± 1secs MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1 Ramp-up rate(217 ºC to Peak) +3 ºC / second max Temp. maintain at 175(±25) ºC 180 seconds max Temp. maintain above 217 ºC 60-150 seconds Peak temperature range 260 ºC +0/-5 ºC Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6 ºC /second max MIL-STD-750D:2031.2 J-STD-020D T.sol= 235 ± 5 ºC Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2 Resistance 10mins 10 Cycles Environmental Test IR-Reflow Solder ability 12/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4 SMD LED LTSN-E263HEGBK 9. Others The appearance and specifications of the product may be modified for improvement without prior notice. 10. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive(ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for InGaN LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? 13/13 Part No. : LTSN-E263HEGBK BNS-OD-FC002/A4