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LTST-E563CEGBW

LTST-E563CEGBW

  • 厂商:

    LITEON(光宝)

  • 封装:

    -

  • 描述:

    LTST-E563CEGBW

  • 数据手册
  • 价格&库存
LTST-E563CEGBW 数据手册
SMD LED Product Data Sheet LTST-E563CEGBW Spec No. :DS35-2018-0038 Effective Date: 09/19/2021 Revision: E LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto SMD LED LTST-E563CEGBW 1. Description SMD LEDs with built-in embedded IC from Lite-On is a new solution for customer’s constant current application, are available in miniature sizes and special configurations for automated PC board assembly and space-sensitive applications. These SMD LEDs are suitable for use in a wide variety of electronic equipment, including cordless and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications. 1.1 Features           1.2 Applications ROHS Compliant Packaged in 12mm tape on 7" diameter reels EIA STD package Compatible with automatic placement equipment Compatible with infrared reflow solder process Preconditioning: accelerate to JEDEC level 4  Control circuit and RGB chip are integrated in the package, form a complete control of pixel point Each R/G/B color can achieve 256 brightness steps to form 16,777,216 color combination 8-bit driver IC embedded. Constant current PWM control Cascading port transmission signal by single line      Telecommunication, office automation, home appliances, industrial equipment Status indicator Signal and symbol luminary Front panel backlighting Full-color module, full color soft lights a lamp strip LED decorative lighting, indoor LED video irregular displays 2. Package Dimensions / Configuration 2.1 Package Dimensions Notes: 1. 2. All dimensions are in millimeters. Tolerance is ±0.2 mm unless otherwise noted. 1/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW Part No. Lens Color Source Color AlInGaP Red LTST-E563CEGBW White Diffused InGaN Green InGaN Blue 2.2 PIN Configuration No. Symbol Function description 1 VSS Ground 2 DIN Control date signal input 3 DOUT 4 VDD Control data signal output DC power input 2/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 3. Rating and Characteristics 3.1 Absolute Maximum Ratings at Ta=25°C LTST-E563CEGBW Parameter Power Dissipation Supply Voltage Range Total DC Current Unit Symbol Ratings P 105 mW VDD +4.2 ~ +5.5 V IF 19 mA Operating Temperature Range Storage Temperature Range 0°C to + 85°C -40°C to + 100°C 3.2 Suggest IR Reflow Condition for Pb Free Process: IR-Reflow Soldering Profile for lead free soldering (Acc. to J-STD-020B) 3/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 3.3 Optical Characteristics (Ta=25°C) LTST-E563CEGBW Parameter Luminous Intensity Viewing Angle Dominant Wavelength Symbol IV 2θ1/2 λd color MIN TYP. MAX Red 180 - 360 Green 450 - 900 Blue 70 - 224 - 120 Red 618 - 630 Green 520 - 535 Blue 463 - 475 Unit Test Condition mcd VDD=5V R/G/B[7:0]= 8b'11111111 Note 1 deg Note 2 (Fig.3) nm VDD=5V R/G/B[7:0]= 8b'11111111 Note 3 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Peak Emission Wavelength Tolerance is +/- 1nm. 3.4 Electrical Characteristics (Ta=0~85°C, V DD=4.2~5.5V, VSS=0V, unless otherwise specified) LTST-E563CEGBW Parameter IC Output Current (to R/G/B separately) Symbol Unit Condition MIN TYP. MAX IF VDD=5V - 5 - mA VIH DIN, SET 3.3 - VDD V VIL DIN, SET 0 - 0.3VDD V IDD ALL ‘0’ DATA - 2.5 - mA Input Voltage Level IC Working Current 4/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 3.5 Data Transmission Protocol  Timing Wave Form (TH+TL=1.2μs±160ns) Item Description T0H 0 code, high voltage time 300 ns ± 80ns T0L 0 code, low voltage time 900 ns ± 80ns T1H 1 code, high voltage time 900 ns ± 80ns T1L 1 code, low voltage time 300 ns ± 80ns RES reset time >50 μs -  Single Data in 24-bit for RGB  Data Communication  Time Interval between 24bits signal Typical 5/13 Allowance Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 4. CIE Specification Color Bin Table Test @ VDD=5V, R/G/B[7:0]=8b'11111111 Color Bin Limits Color Bin Limits Bin Code Bin Code CIE- Point1 Point2 Point3 Point4 x 0.2450 0.2650 0.2650 0.2450 A CIE- Point1 Point2 Point3 Point4 x 0.2650 0.2850 0.2850 0.2650 y 0.2450 0.2550 0.2750 0.2650 x 0.2650 0.2850 0.2850 0.2650 y 0.2650 0.2750 0.2950 0.2850 C y 0.2350 0.2450 0.2650 0.2550 x 0.2450 0.2650 0.2650 0.2450 B D y 0.2550 0.2650 0.2850 0.2750 Tolerance on each CIE (x, y) bin is +/- 0.01 6/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 5. Typical Electrical / Optical Characteristics Curves. (25°C Ambient Temperature Unless Otherwise Noted) 7/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 6. User Guide 6.1 Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute. 6.2 Recommend Printed Circuit Board Attachment Pad 6.3 Package Dimensions of Tape And Reel Note: 1. All dimensions are in millimeters (inches). 8/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 6.4 Package Dimensions of Reel Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel 1000 pieces per reel. 3. Minimum packing quantity is 500 pieces for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481 specifications. 9/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 7. Cautions 7.1 Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7.2 Storage The package is sealed: The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within 72hrs. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccator with nitrogen ambient. LEDs stored out of their original packaging for more than 96hrs should be baked at about 60 °C for at least 48 hours before solder assembly. 7.3 Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 7.4 Soldering Recommended soldering conditions: Reflow soldering Pre-heat Pre-heat time Peak temperature Soldering time 150~200°C 120 sec. Max. 260°C Max. 10 sec. Max. (Max. two times) Soldering iron Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. 10/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 7.5 Driving Method The LED needs to be incorporated with an appropriate controller to deliver PWM signals to each pixel. Below figure is shown as a reference design. Cascading connection for normal driver IC embedded LEDs is shown. The data signal is transmitted one-by-one. The output of the previous one is connected to the input of the next one. As for the power positive and negative, all LED positives should be connected to VDD and all LED negatives should be connected to ground. To ensure the function of LED driver IC work normally, every LED positive pin (should be IC Vcc and LED anode individually or commonly) need connect one capacitor. It can guarantee good power feed quality and cascade stability. The recommended capacitance value is 0.1uF. The capacitors should be placed as close to the LED pin as possible to maximize the effect. Besides, the quality of capacitors will affect the effect, too. The RC filter is necessary to avoid the surge or noise to affect product work normally. The capacitance value 120pF and the resistance value 33ohm is just for reference. The most suitable value is calculated from fc=1/2πRC. The fc is different by cases and needs to be actually measured. 7.6 ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:     Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and Vf of the suspect LEDs at low currents. The Vf of “good” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. 11/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 8. Reliability Test No. Test item 1 Resistance to soldering heat 2 Solderability Test condition Reference standard Tsld = 260°C, 10sec. 3 times JEITA ED-4701 300 301 Tsld=245± 5°C (Lead Free Solder, Coverage ≧ 95% of the JEITA ED-4701 300 303 dipped surface) 3 Thermal Shock 85 ± 5°C ~ -30°C ± 5°C 30min 30min 100cycles JEITA ED-4701 300 307 4 Temperature Cycle -55°C ~ 25°C ~ 10°C ~ 25°C 30min 5min 30min 5min 100cycles JEITA ED-4701 100 105 5 High Temperature Storage 100°C 1000hrs JEITA ED- 4701 200 201 6 Low Temperature Storage -55°C 1000hrs JEITA ED-4 701 200 202 7 Temperature Humidity Storage 60°C/90%RH 300hrs 8 Room temp life test 25°C, IF: Typical current, 1000 hrs JEIT A ED-4701 100 103 -- 9. Others The appearance and specifications of the product may be modified for improvement without prior notice. 12/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4 SMD LED LTST-E563CEGBW 10. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for InGaN LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? 13/13 Part No.: LTST-E563CEGBW BNS-OD-FC002/A4
LTST-E563CEGBW 价格&库存

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LTST-E563CEGBW
  •  国内价格
  • 2+2.79087
  • 10+1.53558
  • 50+1.33555
  • 218+1.26248
  • 250+1.24332
  • 1000+1.21217

库存:5898

LTST-E563CEGBW
  •  国内价格 香港价格
  • 1000+2.119041000+0.25322
  • 2000+1.914742000+0.22880
  • 5000+1.787125000+0.21355
  • 10000+1.7232810000+0.20592
  • 25000+1.6977525000+0.20287
  • 50000+1.6275450000+0.19448

库存:55674

LTST-E563CEGBW
  •  国内价格 香港价格
  • 1+6.328221+0.75619
  • 10+4.1482710+0.49570
  • 100+2.74480100+0.32799

库存:55674