SMD LED
Product Data Sheet
LTST-E563CEGBW
Spec No. :DS35-2018-0038
Effective Date: 09/19/2021
Revision: E
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
LTST-E563CEGBW
1. Description
SMD LEDs with built-in embedded IC from Lite-On is a new solution for customer’s constant current application, are available in
miniature sizes and special configurations for automated PC board assembly and space-sensitive applications. These SMD LEDs
are suitable for use in a wide variety of electronic equipment, including cordless and cellular phones, notebook computers, network
systems, home appliances, and indoor signboard applications.
1.1 Features
1.2 Applications
ROHS Compliant
Packaged in 12mm tape on 7" diameter reels
EIA STD package
Compatible with automatic placement equipment
Compatible with infrared reflow solder process
Preconditioning: accelerate to JEDEC level 4
Control circuit and RGB chip are integrated in the
package, form a complete control of pixel point
Each R/G/B color can achieve 256 brightness steps to
form 16,777,216 color combination
8-bit driver IC embedded. Constant current PWM control
Cascading port transmission signal by single line
Telecommunication, office automation, home appliances,
industrial equipment
Status indicator
Signal and symbol luminary
Front panel backlighting
Full-color module, full color soft lights a lamp strip
LED decorative lighting, indoor LED video irregular displays
2. Package Dimensions / Configuration
2.1 Package Dimensions
Notes:
1.
2.
All dimensions are in millimeters.
Tolerance is ±0.2 mm unless otherwise noted.
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SMD LED
LTST-E563CEGBW
Part No.
Lens Color
Source Color
AlInGaP Red
LTST-E563CEGBW
White Diffused
InGaN Green
InGaN Blue
2.2 PIN Configuration
No.
Symbol
Function description
1
VSS
Ground
2
DIN
Control date signal input
3
DOUT
4
VDD
Control data signal output
DC power input
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LTST-E563CEGBW
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SMD LED
LTST-E563CEGBW
3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
LTST-E563CEGBW
Parameter
Power Dissipation
Supply Voltage Range
Total DC Current
Unit
Symbol
Ratings
P
105
mW
VDD
+4.2 ~ +5.5
V
IF
19
mA
Operating Temperature Range
Storage Temperature Range
0°C to + 85°C
-40°C to + 100°C
3.2 Suggest IR Reflow Condition for Pb Free Process:
IR-Reflow Soldering Profile for lead free soldering (Acc. to J-STD-020B)
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LTST-E563CEGBW
3.3 Optical Characteristics (Ta=25°C)
LTST-E563CEGBW
Parameter
Luminous Intensity
Viewing Angle
Dominant Wavelength
Symbol
IV
2θ1/2
λd
color
MIN
TYP.
MAX
Red
180
-
360
Green
450
-
900
Blue
70
-
224
-
120
Red
618
-
630
Green
520
-
535
Blue
463
-
475
Unit
Test
Condition
mcd
VDD=5V
R/G/B[7:0]=
8b'11111111
Note 1
deg
Note 2 (Fig.3)
nm
VDD=5V
R/G/B[7:0]=
8b'11111111
Note 3
Notes:
1.
Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.
θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3.
The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device. Peak Emission Wavelength Tolerance is +/- 1nm.
3.4 Electrical Characteristics (Ta=0~85°C, V DD=4.2~5.5V, VSS=0V, unless otherwise specified)
LTST-E563CEGBW
Parameter
IC Output Current
(to R/G/B separately)
Symbol
Unit
Condition
MIN
TYP.
MAX
IF
VDD=5V
-
5
-
mA
VIH
DIN, SET
3.3
-
VDD
V
VIL
DIN, SET
0
-
0.3VDD
V
IDD
ALL ‘0’ DATA
-
2.5
-
mA
Input Voltage Level
IC Working Current
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3.5 Data Transmission Protocol
Timing Wave Form (TH+TL=1.2μs±160ns)
Item
Description
T0H
0 code, high voltage time
300 ns
± 80ns
T0L
0 code, low voltage time
900 ns
± 80ns
T1H
1 code, high voltage time
900 ns
± 80ns
T1L
1 code, low voltage time
300 ns
± 80ns
RES
reset time
>50 μs
-
Single Data in 24-bit for RGB
Data Communication
Time Interval between 24bits signal
Typical
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Allowance
Part No.:
LTST-E563CEGBW
BNS-OD-FC002/A4
SMD LED
LTST-E563CEGBW
4. CIE Specification
Color Bin Table
Test
@ VDD=5V, R/G/B[7:0]=8b'11111111
Color Bin Limits
Color Bin Limits
Bin Code
Bin Code
CIE-
Point1
Point2
Point3
Point4
x
0.2450
0.2650
0.2650
0.2450
A
CIE-
Point1
Point2
Point3
Point4
x
0.2650
0.2850
0.2850
0.2650
y
0.2450
0.2550
0.2750
0.2650
x
0.2650
0.2850
0.2850
0.2650
y
0.2650
0.2750
0.2950
0.2850
C
y
0.2350
0.2450
0.2650
0.2550
x
0.2450
0.2650
0.2650
0.2450
B
D
y
0.2550
0.2650
0.2850
0.2750
Tolerance on each CIE (x, y) bin is +/- 0.01
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5. Typical Electrical / Optical Characteristics Curves.
(25°C Ambient Temperature Unless Otherwise Noted)
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6. User Guide
6.1 Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the
LED in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute.
6.2 Recommend Printed Circuit Board Attachment Pad
6.3 Package Dimensions of Tape And Reel
Note:
1. All dimensions are in millimeters (inches).
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6.4 Package Dimensions of Reel
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel 1000 pieces per reel.
3. Minimum packing quantity is 500 pieces for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481 specifications.
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7. Cautions
7.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications
in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize
life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety
devices).
7.2 Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while
the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within 72hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container
with appropriate desiccant, or in a desiccator with nitrogen ambient.
LEDs stored out of their original packaging for more than 96hrs should be baked at about 60 °C for at least 48 hours
before solder assembly.
7.3 Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
7.4 Soldering
Recommended soldering conditions:
Reflow soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max. (Max. two times)
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Notes:
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit
boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on
JEDEC standards to ensure that all packages can be successfully and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a
generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and
recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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SMD LED
LTST-E563CEGBW
7.5 Driving Method
The LED needs to be incorporated with an appropriate controller to deliver PWM signals to each pixel. Below figure is
shown as a reference design.
Cascading connection for normal driver IC embedded LEDs is shown. The data signal is transmitted one-by-one. The
output of the previous one is connected to the input of the next one. As for the power positive and negative, all LED
positives should be connected to VDD and all LED negatives should be connected to ground.
To ensure the function of LED driver IC work normally, every LED positive pin (should be IC Vcc and LED anode
individually or commonly) need connect one capacitor. It can guarantee good power feed quality and cascade stability.
The recommended capacitance value is 0.1uF. The capacitors should be placed as close to the LED pin as possible to
maximize the effect. Besides, the quality of capacitors will affect the effect, too.
The RC filter is necessary to avoid the surge or noise to affect product work normally. The capacitance value 120pF and
the resistance value 33ohm is just for reference. The most suitable value is calculated from fc=1/2πRC. The fc is different
by cases and needs to be actually measured.
7.6 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a
result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or
“no light up” at low currents.
To verify for ESD damage, check for “light up” and Vf of the suspect LEDs at low currents.
The Vf of “good” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
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SMD LED
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8. Reliability Test
No.
Test item
1
Resistance to soldering heat
2
Solderability
Test condition
Reference standard
Tsld = 260°C, 10sec.
3 times
JEITA ED-4701 300 301
Tsld=245± 5°C
(Lead Free Solder, Coverage ≧ 95% of the
JEITA ED-4701 300 303
dipped surface)
3
Thermal Shock
85 ± 5°C ~ -30°C ± 5°C
30min
30min
100cycles
JEITA ED-4701 300 307
4
Temperature Cycle
-55°C ~ 25°C ~ 10°C ~ 25°C
30min
5min
30min
5min
100cycles
JEITA ED-4701 100 105
5
High Temperature Storage
100°C
1000hrs
JEITA ED- 4701 200 201
6
Low Temperature Storage
-55°C
1000hrs
JEITA ED-4 701 200 202
7
Temperature Humidity Storage
60°C/90%RH 300hrs
8
Room temp life test
25°C, IF: Typical current, 1000 hrs
JEIT A ED-4701 100 103
--
9. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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SMD LED
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10. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with
conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for InGaN LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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