LTST-S321KGKT

LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Meet ROHS, Green Product. * Side Looking Chip LED with Tin Plating * Ultra Bright AlInGaP Chip LED. * Package in 8mm Tape on 7" Diameter Reels. * EIA STD Package. * I.C. Compatible. * Compatible with Automatic Placement Equipment. * Compatible with Infrared Reflow Solder Process. Package Dimensions Part No. Lens Source Color LTST-S321KGKT Water Clear AlInGaP Green Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.10 mm (.004") unless otherwise noted. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 1 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Absolute Maximum Ratings At ℃ Ta=25℃ Parameter LTST-S321KGKT Unit Power Dissipation 75 mW Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 80 mA DC Forward Current 30 mA Reverse Voltage 5 V 2000 V Electrostatic Discharge Threshold(HBM)Note A Operating Temperature Range -30°C to + 85°C Storage Temperature Range -40°C to + 85°C Infrared Soldering Condition 260°C For 10 Seconds Note A: Human Body Model Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 2 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Suggestion Profile: Suggestion IR Reflow Profile For Pb Free Process Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 3 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Electrical Optical Characteristics Parameter Symbol Luminous Intensity At ℃ Ta=25℃ Part No. LTST- Min. Typ. Max. Unit Test Condition 18.0 35.0 71.0 mcd IF = 20mA Note 1 IV S321KGKT 2θ1/2 S321KGKT 130 deg Note 2 (Fig.6) Peak Emission Wavelength λP S321KGKT 574 nm Measurement @Peak (Fig.1) Dominant Wavelength λd S321KGKT nm Note 3 Spectral Line Half-Width Δλ S321KGKT Forward Voltage VF S321KGKT Reverse Current IR S321KGKT Viewing Angle 567.5 571 576.5 15 1.9 2.0 nm 2.4 V IF = 20mA 10 μA VR = 5V Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 4 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Bin Code List Forward Voltage Unit: V @20mA Bin Code Min. Max. 4 1.90 2.00 5 2.00 2.10 6 2.10 2.20 7 2.20 2.30 8 2.30 2.40 Tolerance on each Forward Voltage bin is +/-0.1 volt Luminous Intensity Unit : mcd @20mA Bin Code Min. Max. M 18.0 28.0 N 28.0 45.0 P 45.0 71.0 Tolerance on each Intensity bin is +/-15% Dominant Wavelength Unit : nm @20mA Bin Code Min. Max. C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance for each Dominate Wavelength bin is +/- 1nm Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 5 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Typical (25 °C Part Electrical Ambient No. : LTST-S321KGKT BNS-OD-C131/A4 / Optical Temperature Characteristics Unless Otherwise Curves Noted) Page : 6 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. Suggest Soldering Pad Dimensions Suggest Soldering direction: Package Dimensions Of Tape And Reel Notes: 1. All dimensions are in millimeters (inches). Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 7 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-3000 pieces per reel. 3. Minimum packing quantity is 500 pcs for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481 specifications. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 8 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The package is sealed: The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C for at least 20 hours before solder assembly. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 4. Soldering Recommended soldering conditions: Reflow soldering Pre-heat Pre-heat time Peak temperature Soldering time 150~200°C Temperature 120 sec. Max. Soldering time 260°C Max. 10 sec. Max.(Max. two times) Soldering iron 300°C Max. 3 sec. Max. (one time only) Soldering notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 9 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 5. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 6. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:



Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 10 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 7. Reliability Test Classification Test Item Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 MIL-STD-883D:1005 JIS C 7021:B-1 High Temperature High Humidity Storage IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90～95% *Test Time= 240HRS±2HRS MIL-STD-202F:103B JIS C 7021:B-11 High Temperature Storage Ta= 105±5℃ *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 JIS C 7021:B-10 Low Temperature Storage Ta= -55±5℃ *Test Time=1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 105℃ ～ 25℃ ～ -55℃ ～ 25℃ 30mins 5mins 30mins 5mins 10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS C 7021:A-4 IR-Reflow In-Board, 2 Times 85 ± 5℃ ～ -40℃ ± 5℃ 10mins 10mins 10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 T.sol= 260 ± 5℃ Dwell Time= 10 ± 1secs MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1 Operation Life Endurance Test Test Condition Temperature Cycling Thermal Shock Solder Resistance Environmental Test IR-Reflow Pb Free Process Solderability MIL-STD-750D:2031.2 J-STD-020D Ramp-up rate(217℃ to Peak) +3℃/ second max Temp. maintain above 217℃ 60-150 seconds Peak temperature range 260℃+0/-5℃ Time within 5°C of actual Peak Temperature (tp) 10~30 seconds Ramp-down rate +6℃/second max MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2 T.sol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface 8. Others The appearance and specifications of the product may be modified for improvement without prior notice. Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 11 of 12 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 9. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTST-S321KGKT BNS-OD-C131/A4 Page : 12 of 12