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40013150000

40013150000

  • 厂商:

    LITTELFUSE

  • 封装:

  • 描述:

    40013150000 - Subminiature Fuses - Littelfuse

  • 数据手册
  • 价格&库存
40013150000 数据手册
Subminiature Fuses TE5® > Time-Lag > 400 Series 400 Series, TE5®, Time-Lag Fuse Description ® Features Agency Approvals Agency Agency File Number Ampere Range Applications E67006 JET1896-31007-2002 D1-40597 Pending CQC09012031624 Pending 500mA – 6.3A 1A – 5A 500mA~4A, 6.3A 5A 800mA~3.15A, 6.3A 500mA, 4A, 5A % of Ampere Rating 150% 210% 275% 400% 1000% Opening Time Electrical Characteristics Ampere Rating (A) 500mA 800mA 1.00A 1.25A 1.60A 2.00A 2.50A 3.15A 4.00A 5.00A 6.30A Amp Code 0500 0800 1100 1125 1160 1200 1250 1315 1400 1500 1630 Voltage Rating Voltage Drop 1.0 x IN max. (mV) 165 116 89 76 76 75 61 55 65 56 48 Power Dissipation 1.0 x IN max. (mW) 297 387 432 411 601 758 683 921 936 948 926 Melting Integral 10 x IN max. (A2s) 2.17 6.72 9.63 14.44 21.75 32.16 61.94 101.61 133.40 216.50 318.71 Agency Approvals Breaking Capacity φ = 1.0 P © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/400.html for current information. 1 Revised: July 3, 2009 400 Series 400 Series Electrical Characteristics Introduction to Circuit Protection Introduction Subminiature Fuses Transientology TE5® > Time-Lag > 400 Series Temperature Rerating Curve 140 120 PERCENT OF RATING 100 80 60 40 20 Average Time Current Curves 0.5A 0.8A 1A 1.25A 1.6A 2A 2.5A 3.15A 4A 5A 6.3A 100 23°C 10 TIME IN SECONDS 0 -40 -20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 1 0.1 0.01 0.001 0 1 10 CURRENT IN AMPERES 100 1000 Soldering Parameters - Wave Soldering Temperature ( ) - Measured on bottom side of board 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 10 20 30 40 50 60 70 80 90 0 Recommended Process Parameters: Wave Parameter Preheat: 100° C 150° C Solder Pot Temperature: Solder Dwell Time: 260° Lead-Free Recommendation Time (Seconds) Preheat Time Dwell Time Cooling Time Recommended Hand-Solder Parameters: Note: These devices are not recommended for IR or Convection Reflow process. 400 Series 2 © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/400.html for current information. Subminiature Fuses TE5® > Time-Lag > 400 Series Product Characteristics Materials Lead Pull Strength Solderability Soldering Heat Resistance Stock Conditions – 95% Vibration Resistance Operating Temperature Climatic Category Dimensions 8.5 max. 8 max. 4 Part Numbering System 400 xxxx 0000 Series 4.0±1.0 4.0±0.5 7.5±0.3 1 +0.1 Amp Code Refer to Amp Code column of Electrical Characteristics Table Ø 0.6 L 0.5 min 1.5 Holes in PCB 1 +0.1 5.08 0000 Tape/Ammopack (1,400 pcs) 0440 Short Leads - Bulk (1,400 pcs) 0075 7.5mm Pitch - Bulk (1,400 pcs) Holes in PCB Long Leads (L=18.8±0.3mm) Short Leads (L=4.3±0.3mm) Packaging Packaging Option 400 Series N /A N /A N /A 1,400 1,400 1,400 0000 0440 0075 N/A N/A N/A Packaging Specification Quantity Quantity & Packaging Code Taping Width © 2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/400.html for current information. 3 400 Series 400 Series 7.5mm Pitch Packaging Code Introduction Introduction to Circuit Protection Transientology 4 © 2009 Littelfuse, Inc. Specifications are subject to change without notice.
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