SP03-3.3BTG

SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces RoHS Pb GREEN SP03-3.3 (SO-8) Series Description This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Features Agency Agency File Number E128662 nanoseconds package (JEDEC SO-8) Pinout 1 8 linear capacitance and metallic protection IEC61000-4-5, 100A (8/20μs) component 2 7 3 6 4 5 Applications SO-8 (Top View) Functional Block Diagram Line in Ethernet Line out Pin 1 and 8 Pin 2, 3, 6, and 7 Ground Line in Line out Pin 4 and 5 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Absolute Maximum Ratings Parameter Peak Pulse Current (8/20μs) Peak Pulse Power (8/20μs) IEC 61000-4-2, Direct Discharge, (Level 4) IEC 61000-4-2, Air Discharge, (Level 4) Telcordia GR 1089 (Intra-Building) (2/10μs) ITU K.20 (5/310μs) Rating 150 3300 30 30 100 40 Units A W kV kV A A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter SOIC Package Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only) Rating 170 -55 to 125 -65 to 150 150 300 Units °C/W °C °C °C °C Electrical Characteristics (TOP = 25°C) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage, Line-Ground Clamping Voltage, Line-Ground Clamping Voltage, Line-Line Clamping Voltage, Line-Line Symbol VRWM VBR VBR IR VC VC VC VC Cj Test Conditions IT= 2μA IT= 50μA VRWM= 3.3V, T= 25°C IPP= 50A, tp=8/20 μs IPP= 100A, tp=8/20 μs IPP= 50A, tp=8/20 μs IPP= 100A, tp=8/20 μs Between I/O Pins and Ground VR=0V, f= 1MHz Between I/O Pins VR=0V, f= 1MHz Min 3.3 3.3 Typ 16 8 Max 3.3 1 11.5 15 13.5 18 25 12 Units V V V μA V V V V pF pF Junction Capacitance SP03-3.3 (SO-8) Series 98 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time 1000 Figure 2: Current Derating Curve 120 Percentage of Rated Current (%I P) 1 10 10 0 10 0 0 100 Peak Pulse Current (A) 100 80 60 10 40 20 1 0 0 20 40 60 80 100 120 140 160 Pulse decay time (μs) Ambient Temperature (C) Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 20 100 18 16 Percentage of IPP (%) 80 VC Clamping Voltage (V) 14 12 Line to Line 10 8 6 Line to Ground 4 2 60 40 20 0 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 90 100 Time, μs IP Peak Impulse Current (A) Figure 5: Capacitance vs. Reverse Voltage 20 18 Line to Ground 16 Figure 6: Forward Voltage vs. Forward Current 7 6 Ground-to-Line Forward Voltage (V) Capacitance (pF) 14 12 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 Line to Line 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 Reverse Voltage (V) Forward Current (A) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 99 SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) 0 SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Application Example The following schematic shows a high-speed data interface (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements TIP 1 2 3 4 8 7 6 5 protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING TeleLink (0461 1.25) SP03-3.3 Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 250+0/-5 °C 217°C 150°C 200°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 260°C SP03-3.3 (SO-8) Series 100 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline Package Pins JEDEC Millimetres MS-012 (SO-8) 8 MO-223 Issue A Inches Min 0.053 0.004 0.043 0.012 0.007 0.228 0.150 0.016 0.010 0.065 0.020 0.010 Max Min A A1 Recommended Soldering Pad Outline (Reference Only) F L o Max 1.75 0.25 1.65 0.51 0.25 5.00 1.35 0.10 1.25 0.31 0.017 4.80 5.80 3.80 1.27 BSC 0.40 A2 B c D E E1 e L 6.20 4.00 0.244 0.157 0.050 BSC 1.27 0.050 Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP XX XX X T G Silicon Protection Array Series Working Voltage Matte Tin Copper Alloy 0.004 inches (0.102mm) Silicon Lead Material Lead Coplanarity Subsitute Material Package Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System F L SP03-3.3 XXXXXXXX First Line: Part number Second Line: Date code 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Ordering Information Part Number Package Marking Min. Order Qty. 2500 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 101 SP03-3.3 (SO-8) Series SP03-3.3 (SO-8) SPA Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Embossed Carrier Tape & Reel Specification - SOIC Package Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 6.3 5.1 2 1.5 1.50 Min 4.1 40.0 +/- 0.20 12.1 8.1 6.5 5.3 2.2 0.154 0.468 0.311 0.248 0.2 0.087 0.012 +/- 0.002 0.256 0.161 0.476 1.574 +/- 0.008 1.65 5.4 Max 1.85 5.6 2.05 1.6 Min 0.065 0.213 0.077 Inches Max 0.073 0.22 0.081 0.063 0.30 +/- 0.05 SP03-3.3 (SO-8) Series 102 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.