SP03-6BTG

Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces RoHS Pb GREEN SP03-6 (SO-8) Series Description This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Features Agency Agency File Number E128662 nanoseconds package (JEDEC SO-8) Pinout 1 8 linear capacitance and metallic protection Applications 3 6 4 5 component 2 7 Ethernet SO-8 (Top View) Functional Block Diagram Line in Pin 1 and 8 Line out Pin 2, 3, 6, and 7 Ground Line in Line out Pin 4 and 5 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 93 SP03-6 (SO-8) Series SP03-6 (S0-8) Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Absolute Maximum Ratings Parameter Peak Pulse Current (8/20μs) Peak Pulse Power (8/20μs) IEC 61000-4-2, Direct Discharge, (Level 4) IEC 61000-4-2, Air Discharge, (Level 4) IEC 61000-4-5 (8/20μs) Telcordia GR 1089 (Intra-Building) (2/10μs) ITU K.20 (5/310μs) Rating 150 2800 30 30 100 100 40 Units A W kV kV A A A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter SOIC Package Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only) Rating 170 -55 to 125 -65 to 150 150 300 Units °C/W °C °C °C °C Electrical Characteristics (TOP = 25°C) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage, Line-Ground Clamping Voltage, Line-Ground Junction Capacitance Symbol VRWM VBR IR VC VC Cj Test Conditions IT= 1mA VRWM= 6V, T= 25°C IPP= 50A, tp=8/20 μs IPP= 100A, tp=8/20 μs Between I/O Pins and Ground VR=0V, f= 1MHz Between I/O Pins VR=0V, f= 1MHz Min 6.8 Typ 16 8 Max 6 25 15 20 25 12 Units V V μA V V pF pF SP03-6 (SO-8) Series 94 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time 1000 Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) 1 10 100 1000 100 Peak Pulse Current (A) 100 80 60 10 40 20 1 0 0 20 40 60 80 100 120 140 160 Pulse decay time (μs) Ambient Temperature (C) Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 25 100 Line-to-Line 80 VC Clamping Voltage (V) 20 Percentage of IPP (%) 15 Line-to-Ground 10 60 40 20 5 0 0 5 10 15 20 25 30 35 40 0 0 20 40 60 80 100 Time, μs IP Peak Impulse Current (A) Figure 5: Capacitance vs. Reverse Voltage 20 18 16 Line-to-Ground Figure 6: Forward Voltage vs. Forward Current 7 6 Ground-to-Line Forward Voltage (V) Capacitance (pF) 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 Line-to-Line 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 Reverse Voltage (V) Forward Current (A) ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 95 SP03-6 (SO-8) Series SP03-6 (S0-8) Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Application Example The following schematic shows a high-speed data interface protection solution. The SP03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements of Telcordia’s GR-1089-CORE, and the Basic Level TIP 1 2 3 4 8 7 6 5 Recommendations of ITU K.20 and .21. This device protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING TeleLink (0461 1.25) SP03-6 Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP03-6 (SO-8) Series 96 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Package Dimensions - Mechanical Drawings and Recommended Solder Pad Outline Package Pins JEDEC Millimetres MS-012 (SO-8) 8 MO-223 Issue A Inches Min 0.053 0.004 0.043 0.012 0.007 0.189 0.228 0.150 0.016 Max 0.069 0.010 0.065 0.020 0.010 0.197 Min A A1 Recommended Soldering Pad Outline (Reference Only) F L o Max 1.75 0.25 1.65 0.51 0.25 5.00 1.35 0.10 1.25 0.31 0.017 4.80 5.80 3.80 1.27 BSC 0.40 A2 B c D E E1 e L 6.20 4.00 0.244 0.157 0.050 BSC 1.27 0.050 Part Numbering System Product Characteristics Lead Plating Matte Tin Copper Alloy 0.004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 SP03-6BTG Silicon Protection Array Series G = GREEN T = Tape & Reel PACKAGE B = SOIC, 2500 quantity Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. F L SP03-6 XXXXXXXX First Line: Part number Second Line: Date code Ordering Information Part Number SP03-6BTG Package SOIC Tape & Reel Marking SP03-6 Min. Order Qty. 2500 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 97 SP03-6 (SO-8) Series SP03-6 (S0-8) Silicon Protection Arrays TM Low Capacitance TVS protection for high-speed data interfaces Embossed Carrier Tape & Reel Specification - SOIC Package Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 3.9 11.9 7 .9 6.3 5.1 2 1.65 5.4 1.95 1.5 1.50 Min 4.1 12.1 8.1 6.5 5.3 2.2 40.0 +/- 0.20 Max 1.85 5.6 2.05 1.6 Min 0.065 0.213 0.077 0.059 0.154 0.468 0.311 0.248 0.2 0.079 Inches Max 0.073 0.22 0.081 0.063 0.161 0.476 0.319 0.256 0.209 0.087 0.059 Min 1.574 +/- 0.008 0.30 +/- 0.05 0.012 +/- 0.002 SP03-6 (SO-8) Series 98 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.