SP03A-3.3BTG

TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series SP03A-3.3 Series 3.3V 150A Rail Clamp Array Description RoHS Pb GREEN This SP03A provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, and T3/E3 interfaces. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information and the SP03A is rated for GR-1089, intra-building transient immunity requirements for telecommunication installations. Pinout Features • RoHS compliant • MS-012 surface mount package (JEDEC SO-8) 1 8 2 • Clamping speed of nanoseconds • UL 94V-0 epoxy molding • Low clamping voltage 7 • Low insertion loss, loglinear capacitance • Combined longitudinal and metallic protection • Lightning Protection, IEC61000-4-5, 150A (8/20µs) Applications • T1/E1 Line cards • T3/E3 and DS3 Interfaces • STS-1 Interfaces Line out 3 6 4 5 SO-8 (Top View) Functional Block Diagram • 10/100/1000 BaseT Ethernet Line in Pin 1 and 8 Application Example TeleLink (0461 1.25) SP03A-3.3 1 2 8 7 6 5 Pin 2, 3, 6, and 7 Ground Line in Line out 3 4 to chipset (Ethernet PHY, T3/E3 PHY, etc.) Pin 4 and 5 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. This schematic shows a high-speed data interface protection solution. The SP03A-3.3 is compatible with the intra-building surge requirements of Telcordia’s GR-1089CORE, and the Basic Level Recommendations of ITU K.20 and K.21. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. SP03A-3.3 Series 176 Revision: May 23, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Absolute Maximum Ratings Parameter Peak Pulse Current (8/20µs) Peak Pulse Power (8/20µs) IEC 61000-4-2, Direct Discharge, (Level 4) IEC 61000-4-2, Air Discharge, (Level 4) IEC 61000-4-5 (8/20µs) Telcordia GR 1089 (Intra-Building) (2/10µs) ITU K.20 (5/310µs) Rating 150 3300 30 30 150 100 40 Units A W kV kV A A A Thermal Information Parameter SOIC Package Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) Rating 170 -55 to 125 -65 to 150 150 260 Units °C/W °C °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Snap Back Voltage Reverse Leakage Current Clamping Voltage, Line-Ground Clamping Voltage, Line-Ground Clamping Voltage, Line-Line Clamping Voltage, Line-Line Symbol VRWM VBR VSB IR VC VC VC VC Cj Test Conditions IT≤1µA IT= 2µA IT= 50mA VRWM= 3.3V, T= 25°C IPP= 50A, tp=8/20 µs IPP= 100A, tp=8/20 µs IPP= 50A, tp=8/20 µs IPP= 100A, tp=8/20 µs Between I/O Pins and Ground VR=0V, f= 1MHz Between I/O Pins VR=0V, f= 1MHz Min 3.3 3.3 Typ 9 4.5 Max 3.3 1 13 17 15 20 12 6 Units V V V µA V V V V pF pF Junction Capacitance Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time 1000 Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) 100 Peak Pulse Current (A) 100 80 60 10 40 20 1 1 10 100 1000 0 0 20 40 60 80 100 120 140 160 Pulse decay time (µs) Ambient Temperature (C) ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 177 Revision: May 23, 2011 SP03A-3.3 Series SP03A-3.3 TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 18 100 16 Clamp Voltage-VC(V) Percentage of IPP (%) 80 14 12 10 8 6 4 2 0 0 10 20 Line to Line 60 Line to Ground 40 20 0 0 5 10 15 20 25 30 35 40 30 40 50 60 70 80 90 100 Time, µs Peak Pulse Current-I PP (A) Figure 5: Capacitance vs. Reverse Voltage 10 9 8 7 6 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Line to Line Line to Ground Figure 6: Forward Voltage vs. Forward Current 7 6 Ground-to-Line Forward Voltage (V) Capacitance (pF) 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 Bias Voltage (V) Forward Current (A) Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly Temperature TP TL TS(max) TS(min) Ramp-up Ramp-up tP Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 260 +0/-5 tL Ramp-do Ramp-down Preheat Preheat tS time to peak temperature 25 Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP03A-3.3 Series °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C 178 Revision: May 23, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package Pins JEDEC MS-012 (SO-8) 8 MO-223 Issue A Millimetres Min A A1 Recommended Soldering Pad Outline (Reference Only) o 1.35 0.10 1.25 0.31 0.17 4.80 5.80 3.80 0.40 1.75 0.25 1.65 0.51 0.25 5.00 0.053 0.004 0.050 0.012 0.007 0.189 0.228 0.150 0.016 0.069 0.010 0.065 0.020 0.010 0.197 A2 B c D E E1 e L 6.20 4.00 0.244 0.157 1.27 BSC 0.050 BSC 1.27 0.050 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 G= Green T= Tape & Reel Package B = SOIC Inches Min 0.065 0.213 0.077 0.059 0.154 0.468 0.311 0.248 0.2 0.079 Max 0.073 0.22 0.081 0.063 0.161 0.476 0.319 0.256 0.209 0.087 Max 1.85 5.6 2.05 1.6 4.1 12.1 8.1 6.5 5.3 2.2 1.65 5.4 1.95 1.5 3.9 11.9 7 .9 6.3 5.1 2 1.50 Min 40.0 +/- 0.20 0.059 Min 1.574 +/- 0.008 Part Numbering System SP 03A– 3.3 B T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Working Voltage K0 t 0.30 +/- 0.05 0.012 +/- 0.002 Product Characteristics Lead Plating Matte Tin Copper Alloy 0.004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Part Marking System Lead Material Lead Coplanarity First Line: Part number Second Line: Date code F L SP03A-3.3 XXXXXXXX Subsitute Material Body Material Flammability Ordering Information Part Number SP03A3.3BTG Package SOIC Tape & Reel Marking SP03A-3.3 Min. Order Qty. 2500 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 179 Revision: May 23, 2011 SP03A-3.3 Series SP03A-3.3 F L Inches Min Max Max