SP1001-05JTG

8pF ESD Protection Array Silicon Protection Arrays TM RoHS Pb GREEN SP1001 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout SP1001-02 (SC70-3) 1 1 Features SP1001-04 (SC70-5) 5 1 SP1001-05 (SC70-6) 6 (TYP) per I/O contact discharge, 15kV air discharge, (Level 4, IEC61000-4-2) IEC61000-4-4, 40A (5/50 ns) 0.5μA (MAX) at 5V board space IEC61000-4-5, 2.5A (8/μs) 3 2 2 5 2 3 4 3 4 SP1001-02 (SOT 553) NC 5 1 SP1001-04 (SOT 553) 5 1 SP1001-05 (SOT 563) 6 2 2 2 5 NC 4 3 4 3 4 Functional Block Diagram SP1001-02 1 2 5 Applications SP1001-02 4 3 2 SP1001-04 5 4 SP1001-05 6 5 4 1 2 3 1 2 3 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 11 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Silicon Protection Arrays TM 8pF ESD Protection Array Absolute Maximum Ratings Symbol IP TOP TSTOR Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 2 -40 to 85 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 300 Units °C °C °C Electrical Characteristics (TOP = 25°C) Parameter Forward Voltage Drop Reverse Voltage Drop Reverse Standoff Reverse Leakage Current Clamp Voltage1 Symbol VF VR VRWM ILEAK VC Test Conditions IF=10mA IR=10mA IR≤1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 CD Reverse Bias=2.5V Reverse Bias=5V Notes: 1 2 Min 0.7 6.0 Typ 0.9 6.7 Max 1.2 8.0 5.5 0.5 Units V V V μA V V kV kV 8.0 9.7 ±8 ±15 12 8 7 11.0 13.0 ESD Withstand Voltage1,2 VESD pF pF pF Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias 14 12 10 Capacitance (pF) 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) SP1001 Lead-Free/Green Series 12 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array Silicon Protection Arrays TM Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors Application Example directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. Input LCD module Controller D1 D2 D3 D4 Outside World SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 13 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 Silicon Protection Arrays TM 8pF ESD Protection Array Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel Package J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty SP1001-02 J T G Silicon Protection Array Series Number of Channels 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Matte Tin Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Part Marking System Notes : 1. All dimensions are in millimeters AXX AXX Product Series A = SP1001 series (varies) 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Number of Channels (varies) 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Assembly Site Ordering Information Part Number SP1001-02JTG SP1001-02XTG SP1001-04JTG SP1001-04XTG SP1001-05JTG SP1001-05XTG Package SC70-3 SOT553 SC70-5 SOT553 SC70-6 SOT563 Marking AX2 AX2 AX4 AX4 AX5 AX5 Min. Order Qty. 3000 5000 3000 5000 3000 5000 Package Dimensions - SC70-3 B 3 E HE 1 e e 2 Solder Pad Layout Package Pins JEDEC Min A A1 A2 B c D E e HE L 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.66 BSC 2.00 0.26 2.40 0.46 Millimeters Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 SC70-3 3 MO-203 Issue A Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 D A2 A A1 0.026 BSC C L SP1001 Lead-Free/Green Series 14 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array Silicon Protection Arrays TM Package Dimensions - SC70-5 Package e 6 5 e 4 SC70-5 5 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 Pins Solder Pad Layout E HE not used JEDEC 1 B 2 3 A A1 A2 B A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 D c D E e HE L A1 C 0.026 BSC L Package Dimensions - SC70-6 B 6 5 B 4 Package Solder Pad Layout E HE SC70-6 6 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.010 0.089 0.053 0.094 0.018 Pins JEDEC 1 B 2 3 A A1 D A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 A2 B c A1 D E e L C 0.026 BSC HE L Package Dimensions - SOT553 A D 6 5 4 E 3 c B HE L Package Pins Millimeters Solder Pad Layout A B c D E e L HE 0.10 1.50 Min 0.50 0.17 0.08 1.50 1.10 0.50 BSC 0.30 1.70 Max 0.60 0.27 SOT 553 5 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 (not used) 2 e 0.018 1.70 1.30 0.014 BSC ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 15 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001 0.012 Silicon Protection Arrays TM 8pF ESD Protection Array Package Dimensions - SOT563 D 6 5 2 e B 4 E 3 HE A L Package Pins Solder Pad Layout A B Millimeters Min 0.50 0.17 0.08 1.50 1.10 0.50 BSC 0.10 1.50 0.30 1.70 Max 0.60 0.27 0.18 1.70 1.30 SOT 563 6 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 c c D E e L HE 0.020 BSC Embossed Carrier Tape & Reel Specification - SC70-3 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t 1.10 0.60 Ref 0.27 max 2.30 1.90 Ref 1.30 0.043 0.010 1.65 3.45 1.95 1.40 1.00 3.90 7 .70 3.90 2.30 1.00 Ref 2.50 Max 1.85 3.55 2.05 1.60 1.25 4.10 8.10 4.10 2.50 Min 0.065 0.135 0.077 0.055 0.039 0.154 0.303 0.153 0.090 0.090 0.074 0.051 0.023 Ref Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 0.318 0.161 0.098 0.098 40.0 +/- 0.20 1.574 +/- 0.008 0.039 Ref SP1001 Lead-Free/Green Series 16 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 8pF ESD Protection Array Silicon Protection Arrays TM Embossed Carrier Tape & Reel Specification - SC70-5 and SC70-6 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 1.00 3.90 7 .70 3.90 2.14 2.24 1.12 0.27 max Max 1.85 3.55 2.05 1.60 1.25 4.10 8.10 4.10 2.34 2.44 1.32 Min 0.065 0.135 0.077 0.055 0.039 0.154 0.303 0.153 0.084 0.088 0.044 Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 0.318 0.161 0.092 0.096 0.051 40.0 +/- 0.20 1.574 +/- 0.008 0.010 max Embossed Carrier Tape & Reel Specification - SOT553 and SOT563 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 0.45 3.90 7 .70 3.90 1.73 1.73 0.64 0.22 max Max 1.85 3.55 2.05 1.60 0.55 4.1 8.10 4.10 1.83 1.83 0.74 Min 0.065 0.135 0.077 0.055 0.017 0.154 0.303 0.153 0.068 0.068 0.025 Inches Max 0.073 0.139 0.081 0.063 0.021 0.161 0.318 0.161 0.072 0.072 0.029 40.0 +/- 0.20 1.574 +/- 0.008 0.010 max ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 17 SP1001 Lead-Free/Green Series Lead-Free/Green SP1001