SP1001

TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array Description RoHS Pb GREEN Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout SP1001-02 (SC70-3) 1 1 Features SP1001-04 (SC70-5) 5 1 SP1001-05 (SC70-6) 6 (TYP) per I/O contact discharge, ±30kV air discharge, (Level 4, IEC61000-4-2) IEC61000-4-4, 40A (5/50ns) Applications 0.5μA (MAX) at 5V board space IEC61000-4-5, 2A (8/20μs) 3 2 2 5 2 3 4 3 4 SP1001-02 (SOT 553) NC 5 1 SP1001-04 (SOT 553) 5 1 SP1001-05 (SOT 563) 6 2 2 2 5 NC 4 3 4 3 4 Functional Block Diagram SP1001-02 1 2 5 SP1001-02 4 3 2 Application Example Input LCD module Controller D1 D2 D3 D4 SP1001-04 5 4 SP1001-05 6 5 4 1 2 3 1 2 3 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 21 Revision: April 14, 2011 SP1001 Series SP1001 Outside World TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Value 2 -40 to 85 -60 to 150 Units A °C °C Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Forward Voltage Drop Reverse Voltage Drop Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Dynamic Resistance ESD Withstand Voltage1,2 Symbol VF VR VRWM ILEAK VC RDYN VESD Test Conditions IF=10mA IR=1mA IR≤1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 CD Reverse Bias=2.5V Reverse Bias=5V Notes: 1 2 Min 0.7 7 .0 Typ 0.9 7 .8 Max 1.2 8.5 5.5 0.5 Units V V V μA V V Ω kV kV 8.0 9.7 1.7 ±15 ±30 12 8 7 11.0 13.0 pF pF pF Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias 14 Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 12 10 Capacitance (pF) 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) SP1001 Series 22 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes max. 260°C Ramp-do Ramp-down Preheat Preheat TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel Package J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty SP1001-02 J T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3) Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Part Marking System Notes : AXX AXX Product Series A = SP1001 series 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Number of Channels (varies) (varies) 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Assembly Site Ordering Information Part Number SP1001-02JTG SP1001-02XTG SP1001-04JTG SP1001-04XTG SP1001-05JTG SP1001-05XTG Package SC70-3 SOT553 SC70-5 SOT553 SC70-6 SOT563 Marking AX2 AX2 AX4 AX4 AX5 AX5 Min. Order Qty. 3000 5000 3000 5000 3000 5000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 23 Revision: April 14, 2011 SP1001 Series SP1001 TL TS(max) tL TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions — SC70 SC70-3 B 3 Package Pins JEDEC Min A A1 A2 B 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.66 BSC 2.00 0.26 2.40 0.46 Millimeters SC70-3 3 MO-203 Issue A Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 Solder Pad Layout E HE 1 e e 2 D A2 A c D E e HE A1 0.026 BSC C L L e 6 5 e 4 SC70-5 Solder Pad Layout E HE Package Pins JEDEC Min Millimeters Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 SC70-5 5 MO-203 Issue A Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 not used 1 B 2 3 A A1 A2 B A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 D c D E e HE L A1 C 0.026 BSC L B 6 5 B 4 SC70-6 Solder Pad Layout E HE Package Pins JEDEC Min A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.65 BSC 2.00 0.26 2.40 0.46 A1 Millimeters Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 SC70-6 6 MO-203 Issue A Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 1 B 2 3 D A2 A A2 B c A1 D E e L C 0.026 BSC HE L SP1001 Series 24 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions — SOT5 A D 6 5 4 E 3 c B HE L Package SOT 553 5 Millimeters Min Max 0.60 0.27 0.18 1.70 1.30 0.50 BSC 0.10 1.50 0.30 1.70 Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 SOT 563 6 Millimeters Min Max 0.60 0.27 0.18 1.70 1.30 0.50 BSC 0.10 1.50 0.30 1.70 Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Inches Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 Inches Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOT 553 (not used) Pins Solder Pad Layout A B c D E e L HE 2 e 0.50 0.17 0.08 1.50 1.10 0.020 BSC D 6 5 2 e B 4 E 3 A L Package SOT 563 Solder Pad Layout Pins HE A B c 0.50 0.17 0.08 1.50 1.10 c D E e L HE 0.020 BSC Embossed Carrier Tape & Reel Specification — SC70-3 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Inches Min 0.065 0.135 0.077 0.055 0.039 0.154 Max 0.073 0.139 0.081 0.063 0.049 0.161 Max 1.85 3.55 2.05 1.60 1.25 4.10 1.65 3.45 1.95 1.40 1.00 3.90 40.0 +/- 0.20 7 .70 3.90 2.30 1.00 Ref 2.30 1.90 Ref 1.10 0.60 Ref 0.27 max 1.30 2.50 8.10 4.10 2.50 1.574 +/- 0.008 0.303 0.153 0.090 0.318 0.161 0.098 0.039 Ref 0.090 0.074 0.043 0.051 0.098 0.023 Ref 0.010 SP1001 Series 25 Revision: April 14, 2011 SP1001 TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 1.00 3.90 Max 1.85 3.55 2.05 1.60 1.25 4.10 Min 0.065 0.135 0.077 0.055 0.039 0.154 Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 40.0 +/- 0.20 7 .70 3.90 2.14 2.24 1.12 0.27 max 8.10 4.10 2.34 2.44 1.32 1.574 +/- 0.008 0.303 0.153 0.084 0.088 0.044 0.318 0.161 0.092 0.096 0.052 0.010 max Embossed Carrier Tape & Reel Specification — SOT553 and SOT563 Dimensions Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 0.45 3.90 Max 1.85 3.55 2.05 1.60 0.55 4.1 Min 0.065 0.135 0.077 0.055 0.017 0.154 Inches Max 0.073 0.139 0.081 0.063 0.021 0.161 40.0 +/- 0.20 7 .70 3.90 1.73 1.73 0.64 0.22 max 8.10 4.10 1.83 1.83 0.74 1.574 +/- 0.008 0.303 0.153 0.068 0.068 0.025 0.318 0.161 0.072 0.072 0.029 .009 max SP1001 Series 26 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.