SP1002-01JTG

TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series SP1002 Series 5pF 8kV Bidirectional TVS Array Description RoHS Pb GREEN Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout SP1002-01JTG (SC70-3) 1 NC 2 Features SP1002-02JTG (SC70-5) 1 NC 3 (TYP) I/O to I/O 5 0.5μA (MAX) at 5V board space IEC61000-4-5, 2A (8/20μs) contact discharge, ±15kV air discharge, (Level 4, IEC61000-4-2) IEC61000-4-4, 40A (5/50ns) Applications 4 Functional Block Diagram SP1002-01JTG SP1002-02JTG 1 1 3 Application Example 2 5 4 MultiMedia Device Audio Out L Audio Out R MultiMedia Device Audio In L Audio In R 2 x SP1002-01 SCART MultiMedia Application of SP1002-01 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 27 Revision: April 14, 2011 SP1002 Series SP1002 TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Value 2 -40 to 85 -60 to 150 Units A °C °C Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Voltage Drop Reverse Standoff Voltage Leakage Current Clamp Voltage1 Dynamic Resistance ESD Withstand Voltage1,2 Symbol VD VRWM ILEAK VC RDYN VESD Test Conditions IR=1mA IR≤1μA with 1 I/O at GND VR=5V with I/O at GND IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 CD Reverse Bias=2.5V Reverse Bias=5V Notes: 1 2 Min 8.0 Typ 8.8 Max 9.5 6.0 0.5 Units V V μA V V Ω kV kV 9.2 11.2 2.0 ±8 ±15 6 5 5 13.0 16.0 pF pF pF Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes max. 260°C TL TS(max) Preheat Preheat tL Ramp-do Ramp-down TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP1002 Series 28 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Package Dimensions — SC70-3 B 3 Solder Pad Layout 1.30 [0.0512] E HE 0.65 [0.0256] 0.70 [0.0276] Package Pins JEDEC SC70-3 3 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.66 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 Inches Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 1 e e 2 A A1 1.90 [0.0748] 0.80 0.00 0.70 0.15 0.08 1.85 1.15 D A2 A A2 B c D A1 0.90 [0.0354] E e HE L 0.026 BSC 0.079 0.010 0.094 0.018 C L Package Dimensions — SC70-5 e 6 5 e 4 Package Pins Solder Pad Layout E HE SC70-5 5 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 not used JEDEC 1 B 2 3 A A1 A2 B A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 D c D E e HE L L A1 0.026 BSC C Product Characteristics Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Matte Tin Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 29 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. SP1002 Series 6. Package surface matte finish VDI 11-13. Revision: April 14, 2011 SP1002 TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1002 Series Part Numbering System Part Marking System BXX BXX G= Green T= Tape & Reel Product Series B = SP1002 Series SP 1002 – XX J T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Number of Channels Assembly Site (varies) Series Number of Channels -01 = 1 Channel, SC70-3 Package -02 = 2 Channel, SC70-5 Package Package J = SC70-3 SC70-5 Ordering Information Part Number SP1002-01JTG SP1002-02JTG Package SC70-3 SC70-5 Marking BX1 BX2 Min. Order Qty. 3000 3000 Embossed Carrier Tape & Reel Specification — SC70-3 PO Millimetres Inches Min Max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 +/- 0.008 0.303 0.318 0.153 0.161 0.090 0.098 0.039 Ref 0.090 0.098 0.074 0.043 0.051 0.023 Ref 0.010 ØD P2 t E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t Min Max ØD1 AO A1 P K1 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 +/- 0.20 7 .70 8.10 3.90 4.10 2.30 2.50 1.00 Ref 2.30 2.50 1.90 Ref 1.10 1.30 0.60 Ref 0.27 max E F KO BO B1 W Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t SP1002 Series Inches Min Max 0.065 0.073 0.135 0.139 0.077 0.081 0.055 0.063 0.039 0.049 0.154 0.161 1.574 +/- 0.008 0.303 0.318 0.153 0.161 0.084 0.092 0.088 0.096 0.044 0.052 0.010 max Max 1.65 1.85 3.45 3.55 1.95 2.05 1.40 1.60 1.00 1.25 3.90 4.10 40.0 +/- 0.20 7 .70 8.10 3.90 4.10 2.14 2.34 2.24 2.44 1.12 1.32 0.27 max 30 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.