SP1003

ESD/Surge Protection Devices SPA™ Silicon Protection Array Products RoHS Pb GREEN SP1003 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±25kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20μs surge current (IEC61000-4-5) with very low clamping voltages. Pinout 1 Features ±25kV contact, ±30kV air (5/50ns) 7A (8/20μs) 2 saves board space industry standard 0402 (1005) devices 1μA (MAX) at 5V Functional Block Diagram 1 Applications devices 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 23 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Pulse Current (tp Operating Temperature Storage Temperature Parameter Value 7 .0 -40 to 85 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Forward Voltage Drop Reverse Voltage Drop Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage @ MAX IPP1 ESD Withstand Voltage1 Diode Capacitance 1 Symbol VF VR VRWM ILEAK VC VESD CD Test Conditions IF = 10mA IR=1mA IR≤1μA VR=5V tp=8/20μs (IEC61000-4-5) IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias=0V Min Typ 0.8 Max 1.2 8.0 5.0 1 Units V V V μA V kV kV 6.0 7 .0 12.5 ±25 ±30 30 1 pF Note: Parameter is guaranteed by design and/or device characterization. SP1003 Lead-Free/Green Series 24 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. ESD/Surge Protection Devices SPA™ Silicon Protection Array Products Capacitance vs. Reverse Bias 40.0 35.0 30.0 Pulse Waveform 110% 100% 90% Capacitance (pF) 80% 70% 60% 50% 25.0 20.0 15.0 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 DC Bias (V) Clamping Voltage vs. IPP 14.0 12.0 Clamp Voltage (VC) 10.0 8.0 6.0 4.0 2.0 0.0 1 2 3 4 5 6 7 Peak Pulse Current-IPP (A) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 25 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Application Example Dx: SP1003-01DTG Discrete Diodes Low-speed port I/O port Controller B1 B2 B3 B4 Outside World (4) SP1003-01DTG Shield Ground Signal Ground Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 250+0/-5 °C 3°C/second max 3°C/second max 217°C 150°C 200°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 6°C/second max 8 minutes Max. 260°C SP1003 Lead-Free/Green Series 26 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. ESD/Surge Protection Devices SPA™ Silicon Protection Array Products Package Dimensions - SOD723 D SOD723 Symbol A b c D E HE L c A E Millimeters Min 0.46 0.23 0.08 0.99 0.58 1.37 0.15 Max 0.51 0.28 0.13 1.04 0.64 1.47 0.25 Min 0.018 0.009 0.003 0.039 0.023 0.054 0.006 Inches Max 0.020 0.011 0.005 0.041 0.025 0.058 0.010 b HE L Recommended Solder Pad Layout Millimeters (Inches) 1.10 [0.043] 0.45 [0.018] 0.50 [0.020] ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 27 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1003 01 D T G Silicon Protection Array Series Number of Channels Package D: SOD723 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. C 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Pin 1 Indicator Product Series Ordering Information Part Number Package SOD723 Marking C Min. Order Qty. 8000 Embossed Carrier Tape & Reel Specification – SOD723 Symbol E Millimetres Min 1.65 3.45 0.45 150 3.90 7 .90 1.90 0.63 1.66 0.54 -Max 1.85 3.55 0.55 -4.10 8.20 2.10 0.73 1.76 0.64 0.21 Min 0.064 0.135 0.017 0.06 0.153 0.311 0.074 0.024 0.07 0.021 -1.57+/-0.01 0.322 0.082 0.028 0.07 0.025 0.008 Inches Max 0.072 0.139 0.021 -0.161 PO P2 Ø D E t F D1 D PO 10PO W W 40.0+/- 0.20 F ØD1 AO A1 P BO B1 PO AO A1 BO B1 KO SP1003 Lead-Free/Green Series KO t 28 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.