SP1003_10

SPA™ Silicon Protection Array Products ESD/Surge Protection Devices HF RoHS Pb GREEN SP1003 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20μs surge current (IEC61000-4-5) with very low clamping voltages. Pinout 1 Features ±30kV contact, ±30kV air (5/50ns) 7A (8/20μs) 2 saves board space industry standard 0402 (1005) devices 100nA (MAX) at 5V Functional Block Diagram 1 Applications devices 2 Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 31 Revised: November 9, 2010 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Absolute Maximum Ratings Symbol I T TSTOR Parameter =8/20μs) p Operating Temperature Storage Temperature Value 7 .0 -40 to 85 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Symbol V Reverse Voltage Drop Reverse Standoff Voltage VR VRWM I Clamp Voltage1 Dynamic Resistance ESD Withstand Voltage1 Diode Capacitance 1 Test Conditions I = 10mA IR=1mA IR≤1μA VR=5V Min Typ 0.8 Max 1.2 8.5 5.0 100 Units V V V nA V V Ω kV kV 7 .0 7 .8 VC R VESD CD Ipp=6A tp=8/20μs Ipp=7A tp=8/20μs (VC2 - VC1) / (I -I ) ±30 ±30 11.4 12.0 0.6 IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias=0V 1 30 SP1003 Lead-Free/Green Series 32 Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Capacitance vs. Reverse Bias 40.0 35.0 30.0 Pulse Waveform 110% 100% 90% Capacitance (pF) 80% 70% 60% 50% 25.0 20.0 15.0 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 DC Bias (V) Clamping Voltage vs. IPP 14.0 Leakage vs. Temperature 35.0 12.0 30.0 Clamp Voltage (VC) 10.0 Leakage Current (nA) 25.0 8.0 20.0 6.0 15.0 4.0 10.0 2.0 5.0 0.0 1 2 3 4 5 6 7 0.0 0 10 20 30 40 50 Peak Pulse Current-IPP (A) Temperature (ºC) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 33 Revised: November 9, 2010 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Application Example Low - speed port I/O port Controller B1 B2 B3 B4 Outside World (4) SP1003-01DTG Signal Ground Shield Ground Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 250+0/-5 °C 3°C/second max 3°C/second max 217°C 150°C 200°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 6°C/second max 8 minutes Max. 260°C SP1003 Lead-Free/Green Series 34 Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Package Dimensions - SOD723 D SOD723 Symbol Millimeters Min A b c E Inches Min 0.018 0.009 0.003 0.039 0.023 0.054 0.006 Max 0.020 0.011 0.005 0.041 0.025 0.058 0.010 Max 0.51 0.28 0.13 1.04 0.64 1.47 0.25 0.46 0.23 0.08 0.99 0.58 1.37 0.15 b HE D E HE L c A L Recommended Solder Pad Layout Millimeters (Inches) 1.10 [0.043] 0.45 [0.018] 0.50 [0.020] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 35 Revised: November 9, 2010 SP1003 Lead-Free/Green Series Lead-Free/Green SP1003 SPA™ Silicon Protection Array Products ESD/Surge Protection Devices Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1003 – 01 D T G Silicon Protection Array Series Lead Material Lead Coplanarity Subsitute Material Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy Number of Channels Package D: SOD723 Body Material Flammability Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. C 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Pin 1 Indicator Product Series Ordering Information Part Number Package SOD723 Marking C Min. Order Qty. 8000 Embossed Carrier Tape & Reel Specification – SOD723 Symbol E Millimetres Min 1.65 3.45 0.45 150 3.90 Max 1.85 3.55 0.55 -4.10 Min 0.064 0.135 0.017 0.06 0.153 Inches Max 0.072 0.139 0.021 -0.161 PO P2 Ø D E t F D1 D W PO 10PO W 40.0+/- 0.20 7 .90 1.90 0.63 8.20 2.10 0.73 1.57+/-0.01 0.311 0.074 0.024 0.322 0.082 0.028 F BO B1 ØD1 AO A1 PO AO A1 BO B1 KO P 1.66 1.76 0.07 0.07 0.54 -- 0.64 0.21 0.021 -- 0.025 0.008 KO t SP1003 Lead-Free/Green Series 36 Revised: November 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.