SP1003_11

TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1003 Series SP1003 Series - 30pF 30kV Unidirectional Discrete TVS Description RoHS Pb GREEN Features Pinout 1 ±30kV contact, ±30kV air (5/50ns) 7A (8/20μs) 100nA (MAX) at 5V 2 saves board space industry standard 0402 (1005) devices Applications Functional Block Diagram 1 devices Application Example 2 Low - speed port I/O port Controller B1 B2 B3 B4 Outside World (4) SP1003-01DTG Signal Ground Shield Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 31 Revision: April 14, 2011 SP1003 Series SP1003 Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20μs surge current (IEC61000-4-5) with very low clamping voltages. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1003 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Pulse Current (tp=8/20μs) Operating Temperature Storage Temperature Value 7 .0 -40 to 85 -60 to 150 Units A °C °C Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Forward Voltage Drop Reverse Voltage Drop Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Dynamic Resistance ESD Withstand Voltage1 Diode Capacitance1 Symbol VF VR VRWM ILEAK VC RDYN VESD CD Test Conditions IF = 10mA IR=1mA IR≤1μA VR=5V Ipp=6A tp=8/20μs Ipp=7A tp=8/20μs (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias=0V ±30 ±30 30 11.4 12.0 0.6 7 .0 Min Typ 0.8 7 .8 Max 1.2 8.5 5.0 100 Units V V V nA V V Ω kV kV pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias 40.0 35.0 Pulse Waveform 110% 100% 90% 30.0 Capacitance (pF) 80% 25.0 20.0 15.0 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Percent of IPP 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 DC Bias (V) Time (μs) Clamping Voltage vs. IPP 14.0 Leakage vs. Temperature 35.0 12.0 30.0 Clamp Voltage (VC) 10.0 Leakage Current (nA) 1 2 3 4 5 6 7 25.0 8.0 20.0 6.0 15.0 4.0 10.0 2.0 5.0 0.0 0.0 0 10 20 30 40 50 Peak Pulse Current-IPP (A) Temperature (ºC) SP1003 Series 32 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1003 Series Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Ramp-do Ramp-down Preheat Preheat TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Package Dimensions — SOD723 SOD723 D 1.10 [0.043] E 0.45 [0.018] Symbol Millimeters Min Max 0.51 0.28 0.13 1.04 0.64 1.47 0.25 Min 0.018 0.009 0.003 0.039 0.023 0.054 0.006 Inches Max 0.020 0.011 0.005 0.041 0.025 0.058 0.010 A b b HE 0.50 [0.020] Recommended Solder Pad Layout Millimeters (Inches) 0.46 0.23 0.08 0.99 0.58 1.37 0.15 c D E HE c L A L ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 33 Revision: April 14, 2011 SP1003 Series SP1003 TL TS(max) tL TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1003 Series Part Numbering System Product Characteristics Lead Plating Lead Material Pre-Plated Frame or Matte Tin Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 SP 1003 – 01 D T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels G= Green T= Tape & Reel Lead Coplanarity Subsitute Material Body Material Package D: SOD723 Flammability Part Marking System Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. C Ordering Information Part Number Package SOD723 Marking C Min. Order Qty. 8000 Pin 1 Indicator Product Series SP1003-01DTG Embossed Carrier Tape & Reel Specification — SOD723 Symbol E Millimetres Min 1.65 3.45 0.45 150 3.90 Max 1.85 3.55 0.55 -4.10 Min 0.064 0.135 0.017 0.06 0.153 Inches Max 0.072 0.139 0.021 -0.161 PO P2 Ø D E t F D1 D W PO 10PO W 40.0+/- 0.20 7 .90 1.90 0.63 0.33 REF 1.66 1.10 REF 0.54 -0.64 0.21 1.76 8.20 2.10 0.73 1.57+/-0.01 0.311 0.074 0.024 0.322 0.082 0.028 F BO B1 ØD1 AO A1 PO AO A1 BO B1 KO P 0.01 REF 0.07 0.04 REF 0.021 -0.025 0.008 0.07 KO t SP1003 Series 34 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.