SP1004_11

TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1004 Series SP1004 Series 5pF 8kV Bidirectional TVS Array Description RoHS Pb GREEN Back-to-back zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features contact, ±15kV air >1,000 ±8kV ESD strikes I/O 4 I/O 1 I/O 2 I/O 3 I/O 5 (TYP) per I/O 1μA (MAX) at 5V 2A (tp=8/20μs) Applications SOT953 Notes: 1 Any of the 5 I/O pins can be tied to GND to provide 4 channels of bidirectional protection Functional Block Diagram 5 4 Application Example RCA jacks Audio codec Left - In Right - In Left - Out Right - Out 1 2 3 Back panel (STB, TV) SP1004-04VTG (SOT953) Signal Ground Shield Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 35 Revision: April 14, 2011 SP1004 Series SP1004 TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1004 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Pulse Current (tp=8/20μs) Operating Temperature Storage Temperature Value 2.0 -40 to 85 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Voltage Drop1 Reverse Standoff Voltage 1 Symbol VR VRWM ILEAK VC RDYN VESD CD Test Conditions IR=1mA IR≤1μA VR=5V IPP=1A, tp=8/20μs IPP=2A, tp=8/20μs (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact Discharge)3 IEC61000-4-2 (Air Discharge) Reverse Bias=0V Reverse Bias=1.5V Min 8.0 Typ 8.8 Max 9.5 6.0 0.1 Units V V μA V V Ω kV kV Reverse Leakage Current1 Clamp Voltage2 Dynamic Resistance ESD Withstand Voltage1,2 Diode Capacitance1,2 10 12 2.0 ±8 ±15 6 5 7 6 pF pF Note: 1 Parameter specified with pin 2 grounded externally. 2 3 Parameter is guaranteed by design and/or device characterization. Capable of withstanding >1,000 pulses at 1s intervals. Capacitance vs. Reverse Bias 7.0 Insertion Loss (S21) 5 6.0 0 5.0 -5 Capacitance (pF) Attenuation (dB) 4.0 -10 3.0 -15 2.0 -20 1.0 -25 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -30 10 100 1000 10000 DC Bias (V) Frequency (MHz) SP1004 Series 36 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1004 Series Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Ramp-do Ramp-down Preheat Preheat TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Package Dimensions — SOT953 D e Symbol Millimeters Min A 0.44 0.10 0.05 0.95 0.95 0.75 Max 0.5 0.20 0.15 1.05 1.05 0.85 Min 0.170 0.004 0.002 0.037 0.037 0.029 SOT953 Inches Max 0.020 0.008 0.006 0.041 0.041 0.033 E1 E B c D B A C E E1 e L 0.35 BSC 0.05 0.15 0.014 BSC 0.002 0.006 L ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 37 Revision: April 14, 2011 SP1004 Series SP1004 TL TS(max) tL TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1004 Series Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1004 – 04 V T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels Package V: SOT953 Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. N2 Ordering Information Part Number SP1004-04VTG Package SOT953 Marking N2 Min. Order Qty. 8000 Embossed Carrier Tape & Reel Specification – SOT953 PO Symbol Millimetres Min 1.65 3.45 0.45 1.50 min 3.90 4.10 Max 1.85 3.55 0.55 Min 0.065 0.136 0.018 Inches Max 0.073 0.140 0.022 oD / P2 t E F E D1 D 0.059 min 0.154 0.161 W P0 10P0 P P2 40.0 +/- 0.20 1.95 1.95 7 .90 1.11 1.11 0.58 0.22 max 2.05 2.05 8.20 1.21 1.21 0.68 1.575 +/- 0.008 0.077 0.077 0.311 0.044 0.044 0.023 0.081 0.081 0.323 0.048 0.048 0.027 BO oD1 / AO F P W A0 B0 K0 t 0.009 max SP1004 Series KO 38 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.