SP1010_10

SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection RoHS Pb GREEN SP1010 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protection highspeed signal pins. Pinout I/O (1) GND I/O (2) I/O (4) GND I/O (3) Features contact, ±15kV air 1A (tp=8/20μs) (TYP) per I/O uDFN-6 (1.25x1.0x0.5mm) (1.25mm x 1.0mm x 0.5mm) IEC61000-4-4, 40A (5/50ns) 1μA (MAX) at 5V Functional Block Diagram Applications device 1 2 3 Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 103 Revised: March 25, 2010 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 6 5 4 SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Pulse Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 1.0 -40 to 85 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Voltage Drop Reverse Standoff Voltage Reverse Leakage Current ESD Withstand Voltage1 Symbol VR VRWM ILEAK VESD Test Conditions IR = 1mA IR≤1μA VR = 5V IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias = 0V Diode Capacitance1 CD Reverse Bias = 2.5V ±8 ±15 6 7 0.1 Min 7 .0 Typ 7 .8 Max 8.5 6 1 Units V V μA kV kV 1. Parameter is guaranteed by design and/or device characterization. SP1010 Lead-Free/Green Series 104 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Capacitance vs. Reverse Bias Insertion Loss (S21) I/O to GND 5 7.0 6.0 0 Capacitance (pF) Attenuation (dB) 5.0 -5 4.0 -10 3.0 -15 2.0 -20 1.0 -25 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -30 10 100 1000 10000 DC Bias (V) Frequency (MHz) Application Example Input Keyboard Controller D1 D2 D3 D4 SP1010-04UTG Shield Ground Signal Ground ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 105 Revised: March 25, 2010 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 Outside World SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C 150°C 200°C 60 – 180 secs Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Package Dimensions - uDFN-6 (1.25x1.0x0.5mm) Top View D A Bottom View uDFN-6 (1.25x1.0x0.5mm) Symbol A A1 A3 b 0.15 1.20 0.95 1.05 0.25 0.006 0.047 0.010 0.051 0.041 Millimeters Min 0.45 0.00 Max 0.55 0.05 Min 0.018 0.000 Inches Max 0.022 0.002 0.05 C 456 L E 654 0.05 C Pin 1 chamfer 0.10 x 45’ Pin 1 Index Area 123 B 321 Side View 0.05 C A Seating plane C D A1 A3 D2 E E2 e b 0.10 M C A B 0.05 M C L 0.25 0.010 0.014 SP1010 Lead-Free/Green Series 106 Revised: March 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1010 – 04 U T G Silicon Protection Array Series Lead Material Lead Coplanarity Subsitute Material Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy Number of Channels Package U: uDFN-6 Body Material Flammability Part Marking System H4 1. All dimensions are in millimeters 2. Dimensions include solder plating. 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. H4 Product Series H = SP1010 Number of Channels Ordering Information Part Number Package Marking H4 Min. Order Qty. Embossed Carrier Tape & Reel Specification – uDFN-6 (1.25x1.0x0.5mm) Symbol Millimeters Min 1.65 Max 1.85 Min 0.06 0.14 0.50 0.65 0.02 Inches Max 0.07 0.14 D P2 E t E F D1 D P0 10P0 4.10 40.0 +/- 0.20 7 .90 1.95 1.09 1.42 0.71 2.05 1.19 1.52 0.81 0.15 0.16 1.57 +/- 0.01 W P2 0.08 0.04 0.06 0.08 0.05 0.06 F A0 B0 B0 D1 A0 K0 t P0 0.25 TYP 0.01 TYP K0 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 107 Revised: March 25, 2010 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 W