SP3001_10

SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array HF RoHS Pb GREEN SP3001 Lead-Free/Green Series Description The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout I/O 1 I/O 4 Features 0.65pF (TYP) per I/O contact discharge, ±15kV air discharge, (IEC61000-4-2) IEC61000-4-4, 40A (5/50ns) 0.5μA (MAX) at 5V saves board space IEC61000-4-5, 2.5A (8/20μs) GND VCC I/O 2 I/O 3 Functional Block Diagram I/O2 VCC I/O4 Applications I/O1 GND I/O3 Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 39 Revised: February 9, 2010 SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 2.5 -40 to 85 -50 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Symbol VRWM ILEAK VC Test Conditions IR ≤ 1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd IEC61000-4-2 (Contact) ESD Withstand Voltage1 VESD IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 Diode Capacitance 1 Min Typ Max 6 0.5 Units V μA V V kV kV 9.5 10.6 ±8 ±15 0.8 0.55 0.65 0.35 11.0 13.0 0.9 pF pF pF C Reverse Bias=1.65V CI/O-I/O Reverse Bias=0V SP3001 Lead-Free/Green Series 40 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND 1 0 -1 Capacitance vs. Bias Voltage 1.00 0.95 0.90 I/O Capacitance (pF) Insertion Loss [dB] -2 -3 -4 -5 -6 -7 -8 -9 -10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.85 0.80 VCC = Float 0.75 0.70 VCC = 3.3V 0.65 VCC = 5V 0.60 0.55 0.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) Capacitance vs. Frequency 1.4E-12 1.2E-12 1E-12 Capacitance [F] 8E-13 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 41 Revised: February 9, 2010 SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D26 5 4 SP300x-04 1 2 3 D2+ Gnd D2- D1+ D1HDMI or DVI Interface IC D0+ D06 5 4 SP300x-04 1 2 3 D1+ Gnd D1HDMI or DVI Connector D0+ Gnd D0- Clk+ ClkGnd Clk+ Gnd Clk- HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max Peak Temperature (TP) Time within 5°C of actual peak Temperature (tP) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP3001 Lead-Free/Green Series 42 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SC70-6 e 6 5 e 4 Package Pins E HE SC70-6 6 MO-203 Issue A Millimeters Inches Min 0.031 0.000 0.028 0.006 0.003 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.045 0.053 JEDEC 1 B 2 3 Min A 0.80 0.00 Max 1.10 0.10 1.00 D A2 A A1 A2 B A1 0.15 0.08 1.85 1.15 0.30 0.25 2.25 1.35 c D Solder Pad Layout L C E e HE L 0.65 BSC 2.00 0.26 2.40 0.46 0.026 BSC 0.094 0.010 0.018 Part Numbering System Product Characteristics Lead Plating Matte Tin Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 SP 3001-04 J T G Silicon Protection Array Series Number of Channels -04 = 4 channel G= Green T= Tape & Reel Package J = SC70-6, 3000 quantity Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. DX4 DX4 Product Series D = SP3001 series Number of Channels Assembly Site (varies) Ordering Information Part Number SP3001-04JTG Package Marking DX4 Min. Order Qty. 3000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 43 Revised: February 9, 2010 SP3001 Lead-Free/Green Series Lead-Free/Green SP3001 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - SC70-6 Symbol E F P2 D D1 P0 10P0 W P A0 B0 K0 t 3.90 2.14 2.24 1.12 Millimetres Min 1.65 3.45 1.95 1.40 1.00 3.90 Max 1.85 3.55 2.05 1.60 1.25 4.10 0.055 0.039 0.153 Min 0.064 0.135 0.139 0.081 0.062 0.049 0.161 Inches Max 40.0+/- 0.20 8.10 4.10 2.34 2.44 1.32 0.303 0.153 0.084 0.088 0.044 0.318 0.161 0.092 0.960 0.052 0.010 max SP3001 Lead-Free/Green Series 44 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.