SP3002-04JTG

SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array HF RoHS Pb GREEN SP3002 Lead-Free/Green Series Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout I/O 1 I/O 4 I/O 1 NC 1 2 Gnd 6 5 I/O 4 V CC I/O 3 Features 0.85 pF (TYP) per I/O ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) IEC61000-4-4, 40A (5/50ns) Applications 0.5μA (MAX) at 5V saves board space IEC61000-4-5, 4.5A (8/20μs) GND VCC I/O 2 SC70-6 and SOT23-6 I/O 3 I/O 2 3 4 uDFN-6 (1.6x1.6x0.5mm) Functional Block Diagram I/O2 VCC I/O4 I/O1 GND I/O3 Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 45 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 4.5 -40 to 85 -50 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Symbol VRWM ILEAK VC Test Conditions IR ≤ 1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd IEC61000-4-2 (Contact) ESD Withstand Voltage1 VESD IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 Diode Capacitance 1 Min Typ Max 6.0 0.5 Units V μA V V kV kV 9.5 10.6 ±12 ±15 0.95 0.7 1.1 0.85 0.5 11.0 13.0 1.25 1.0 pF pF pF C Reverse Bias=1.65V CI/O-I/O Reverse Bias=0V SP3002 Lead-Free/Green Series 46 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND 0 Capacitance vs. Bias Voltage 1.50 1.40 1.30 Insertion Loss [dB] -5 I/O Capacitance (pF) 1.20 1.10 1.00 0.90 0.80 VCC = 3.3V VCC = Float -10 -15 VCC = 5V 0.70 0.60 0.50 -20 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) Capacitance vs. Frequency 2E-12 1.8E-12 1.6E-12 1.4E-12 Capacitance [F] 1.2E-12 1E-12 8E-13 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 47 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D26 5 4 SP300x-04 1 2 3 D2+ Gnd D2- D1+ D1HDMI or DVI Interface IC D0+ D06 5 4 SP300x-04 1 2 3 D1+ Gnd D1HDMI or DVI Connector D0+ Gnd D0- Clk+ Clk- Clk+ Gnd Clk- Gnd HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP3002 Lead-Free/Green Series 48 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SC70-6 e 6 5 e 4 Package Pins E HE SC70-6 6 MO-203 Issue A Millimeters Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 JEDEC 1 B 2 3 Min A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 D A2 A A1 A2 B A1 c D Solder Pad Layout L C E e HE L 0.65 BSC 2.00 0.26 2.40 0.46 0.026 BSC 0.079 0.010 0.094 0.018 Package Dimensions - SOT23-6 Package Pins JEDEC Millimeters Min A A1 A2 b C D E E1 e e1 L N a 0º 0.100 6 10º 2.590 0.690 0.990 0.950 0º 0.900 0.000 0.900 0.350 0.080 2.800 2.600 1.500 1.9 Ref 0.600 Max 1.450 0.150 1.300 0.500 0.220 3.000 3.000 1.750 Min 0.035 0.000 0.035 0.0138 0.0031 0.11 0.102 0.06 SOT23-6 6 MO-203 Issue A Inches Notes Max 0.057 0.006 0.051 0.0196 0.009 0.118 0.118 0.069 3 3 4,5 6 10º 0.102 .027 TYP .039 TYP 0.038 - 0.95 Ref 0.0374 Ref 0.0748 Ref 0.004 6 0.023 Recommended Solder Pad Layout M O P R M 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L is the length of flat foot surface for soldering to substrate. ” P exact. R O ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 49 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - uDFN (1.6x1.6x0.5mm) Top View D A L Bottom View D2 uDFN (1.6x1.6x0.5mm) 0.05 C Millimeters Symbol Min A 0.45 0.00 0.127 Ref 0.20 1.50 1.05 1.50 0.40 0.50 Ref 0.25 0.40 0.010 0.30 1.70 1.30 1.70 0.65 0.008 0.060 0.042 0.060 0.016 A1 Max 0.55 0.05 Min 0.018 0.000 Inches Max 0.022 0.002 0.005 Ref 0.012 0.067 0.052 0.067 0.026 0.020 Ref 0.016 6 5 4 4 5 6 0.05 C E E2 A3 3 2 1 Pin 1 chamfer 0.10 x 45’ Pin 1 Index Area 1 2 3 B b D D2 E Side View 0.05 C A Seating plane C A1 A3 E2 e L b 0.10 M C A B 0.05 M C SP3002 Lead-Free/Green Series 50 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel Package H = SOT23-6 J = SC70-6 U = uDFN-6 SP 3002-04 XT G Silicon Protection Array Series Number of Channels -04 = 4 channel Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Part Marking System 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. E X4 EX4 Product Series E = SP3002 series Number of Channels Assembly Site (varies) Ordering Information Part Number SP3002-04HTG SP3002-04JTG SP3002-04UTG Package SOT23-6 SC70-6 Marking EX4 EX4 EX4 Min. Order Qty. 3000 3000 3000 Embossed Carrier Tape & Reel Specification - SC70-6 Symbol E F P2 D D1 P0 10P0 W P A0 B0 K0 t Millimetres Min 1.65 3.45 1.95 1.40 1.00 3.90 Max 1.85 3.55 2.05 1.60 1.25 4.10 Min 0.064 0.135 0.077 0.055 0.039 0.154 Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 40.0+/- 0.20 7 .70 3.90 2.14 2.24 1.12 0.27 Max 8.10 4.10 2.34 2.44 1.32 1.574+/-0.008 0.303 0.153 0.084 0.088 0.044 0.318 0.161 0.092 0.096 0.052 0.010 Max ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 51 Revised: February 9, 2010 SP3002 Lead-Free/Green Series Lead-Free/Green SP3002 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification -- SOT23-6 ACCESS HOLE 4.0mm 14.4mm 1.5mm DIA. HOLE 8mm 13mm 4.0mm 180mm 60mm SOT-23 (8mm POCKET PITCH) 2.0mm C L 1.75mm 8.4mm USER DIRECTION OF FEED GENERAL INFORMATION PIN 1 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. COVER TAPE Embossed Carrier Tape & Reel Specification -- uDFN-6 (1.6x1.6x0.5mm) D P2 t E Symbol E F D1 Millimetres Min 1.65 3.45 1.00 Max 1.85 3.55 1.25 Min 0.06 0.14 0.04 Inches Max 0.07 0.14 0.05 W D P0 10P0 3.90 4.10 0.15 0.16 40.0+/- 0.20 7 .90 1.95 1.78 1.78 0.84 0.25 TYP 8.30 2.05 1.88 1.88 0.94 1.57+/-0.01 0.31 0.08 0.07 0.07 0.03 0.01 TYP 0.33 0.08 0.07 0.07 0.04 F W B0 P2 A0 B0 K0 D1 A0 P0 t SP3002 Lead-Free/Green Series K0 52 Revised: February 9, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.