SP3003_11

TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series SP3003 Series 0.65pF Rail Clamp Array Description RoHS Pb GREEN The SP3003 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout SP3003-02X/J SP3003-04X/J Features 0.65pF (TYP) per I/O contact discharge, ±15kV air discharge, (IEC61000-4-2) IEC61000-4-4, 40A (5/50ns) Applications 0.5μA (MAX) at 5V board space (SC70, SOT553, SOT563, MSOP10) IEC61000-4-5, 2.5A (8/20μs) NC GND VCC I/O 1 I/O 1 GND I/O 4 VCC I/O 3 I/O 2 I/O 2 SP3003-04A I/O 1 I/O 2 VCC I/O 3 I/O 4 NC NC GND NC NC Functional Block Diagram SP3003-02 VCC SP3003-04 I/O2 VCC I/O4 Application Example +5V I/O1 I/O2 D2+ D26 5 4 SP300x-04 1 2 3 D2+ Gnd D2- GND I/O1 GND I/O3 D1+ D1HDMI or DVI Interface IC D0+ D0- D1+ Gnd D1HDMI or DVI Connector D0+ Gnd D06 5 4 SP300x-04 1 2 3 Clk+ ClkGnd Clk+ Gnd Clk- A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 95 Revision: April 14, 2011 SP3003 Series SP3003 TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Value 2.5 -40 to 85 -50 to 150 Units A °C °C Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Symbol VRWM ILEAK VC Test Conditions IR ≤ 1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd IEC61000-4-2 (Contact) ESD Withstand Voltage1 VESD IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 Diode Capacitance1 CI/O-GND CI/O-I/O Reverse Bias=1.65V Reverse Bias=0V ±8 ±15 0.7 0.55 0.8 0.65 0.35 0.95 0.8 10.0 11.8 Min Typ Max 6 0.5 12.0 15.0 Units V μA V V kV kV pF pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND 1 0 -1 Capacitance vs. Bias Voltage 1.00 0.95 0.90 I/O Capacitance (pF) Insertion Loss [dB] -2 -3 -4 -5 -6 -7 -8 -9 -10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.85 0.80 VCC = Float 0.75 0.70 0.65 VCC = 5V 0.60 0.55 0.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VCC = 3.3V Frequency [Hz] I/O DC Bias (V) SP3003 Series 96 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series Capacitance vs. Frequency 1.4E-12 Product Characteristics Lead Plating Lead Material Lead Coplanarity Matte Tin (SC70-x, MSOP-10) Pre-Plated Frame (SOT5x3) Copper Alloy 0.0004 inches (0.102mm) 1.2E-12 Capacitance [F] 1E-12 8E-13 Subsitute Material Silicon Body Material Flammability Molded Epoxy UL94-V-0 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250 +0/-5 TL TS(max) Preheat Preheat tL Ramp-do Ramp-down TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 97 Revision: April 14, 2011 SP3003 Series SP3003 TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SC70-5 e 6 5 e 4 Package Solder Pad Layout E HE SC70-5 5 MO-203 Issue A Millimeters Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 2.40 0.46 not used Pins JEDEC 1 B 2 3 A D A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 2.00 0.26 A1 A2 B A1 c D E L C e HE L 0.65 BSC 0.026 BSC Package Dimensions — SC70-6 e 6 5 e 4 Package Solder Pad Layout E HE SC70-6 6 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018 Pins JEDEC 1 B 2 3 A D A2 A 0.80 0.00 0.70 0.15 0.08 1.85 1.15 2.00 0.26 A1 A2 B c D E L A1 C e HE L 0.65 BSC 0.026 BSC Package Dimensions — SOT553 D 6 5 4 E 3 HE A L Package Pins Solder Pad Layout A c SOT 553 5 Millimeters Min 0.50 0.17 0.08 1.50 1.10 0.10 1.50 Max 0.60 0.27 0.18 1.70 1.30 0.30 1.70 Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Inches Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 (not used) 2 e B c D E e L HE B 0.50 BSC 0.020 BSC SP3003 Series 98 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SOT563 D 6 5 2 e B 4 E 3 HE A L Package Pins Solder Pad Layout A Millimeters Min 0.50 0.17 0.08 1.50 1.10 0.10 1.50 B c D E e L HE SOT 563 6 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 Max 0.60 0.27 0.18 1.70 1.30 0.30 1.70 c 0.50 BSC 0.020 BSC Package Dimensions — MSOP10 Package Pins Millimeters Min A A1 B c D Solder Pad Layout MSOP10 10 Inches Min 0.000 0.007 0.003 0.114 0.184 0.114 0.016 Max 0.043 0.006 0.011 0.009 0.122 0.200 0.122 0.031 Max 1.10 0.15 0.27 0.23 3.10 5.10 3.10 0.80 0.00 0.17 0.08 2.90 4.67 2.90 0.40 E E1 e HE 0.50 BSC 0.020 BSC Part Numbering System Ordering Information Part Number G= Green T= Tape & Reel Package A = MSOP-10, 3000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity SP 3003 -04 X T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels Package SC70-5 SOT553 MSOP-10 SC70-6 SOT563 Marking F X2 F X2 F X4 F X4 F X4 Min. Order Qty. 3000 5000 4000 3000 5000 SP3003-02JTG SP3003-02XTG SP3003-04ATG SP3003-04JTG SP3003-04XTG -02 = 2 channel (SC70-5, SOT553 packages) -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) Part Marking System XXX XXX Product Series (varies) F, H or P = SP3003 series Number of Channels (varies) 2 or 4 Assembly Site (varies) ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 99 Revision: April 14, 2011 SP3003 Series SP3003 TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Min E F D D1 P0 10P0 W P A0 B0 K0 t 3.90 11.90 7 .90 5.20 3.20 1.20 1.65 5.40 1.50 1.50 Min 4.10 12.10 8.10 5.40 3.40 1.40 40.0+/- 0.20 Max 1.85 5.60 1.60 Min 0.065 0.213 0.059 0.154 0.469 0.311 0.205 0.126 0.047 Inches Max 0.073 0.220 0.063 0.161 0.476 0.319 0.213 0.134 0.055 0.059 Min 1.574+/-0.008 0.30 +/- 0.05 0.012+/- 0.002 Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6 Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 1.00 3.90 7 .70 3.90 2.14 2.24 1.12 0.27 max Max 1.85 3.55 2.05 1.60 1.25 4.10 8.10 4.10 2.34 2.44 1.32 Min 0.064 0.135 0.077 0.055 0.039 0.154 0.303 0.153 0.084 0.088 0.044 Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 0.318 0.161 0.092 0.960 0.052 40.0+/- 0.20 1.574+/-0.008 0.010 max Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563 Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t SP3003 Series Inches Min 0.064 0.135 0.076 0.055 0.017 0.154 0.303 0.153 0.068 0.068 0.025 Max 0.073 0.139 0.081 0.063 0.021 0.161 0.318 0.161 0.072 0.072 0.029 Max 1.85 3.55 2.05 1.60 0.55 4.10 8.10 4.10 1.83 1.83 0.74 0.22 max 1.65 3.45 1.95 1.40 0.45 3.90 7 .70 3.90 1.73 1.73 0.64 40.0+/- 0.20 1.574+/-0.008 0.009 max 100 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.