SP3004_10

SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array HF RoHS Pb GREEN SP3004 Lead-Free/Green Series Description The SP3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features 0.85pF (TYP) per I/O contact discharge, GND VCC I/O 1 I/O 4 0.5μA (MAX) at 5V saves board space IEC61000-4-5, 4A (8/20μs) (IEC61000-4-2) I/O 2 I/O 3 IEC61000-4-4, 40A (5/50ns) Applications Functional Block Diagram I/O2 VCC I/O4 I/O1 GND I/O3 Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP3004 Lead-Free/Green Series ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 73 Revised: August 19, 2010 Lead-Free/Green SP3004 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 4 -40 to 85 -50 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Symbol VRWM ILEAK VC Test Conditions IR ≤ 1μA VR=5V IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Reverse Bias=1.65V Reverse Bias=0V 0.95 0.7 1.1 0.85 0.5 1.25 1 10.0 11.8 Min Typ Max 6 0.5 12.0 15.0 Units V μA V V kV kV pF pF pF ESD Withstand Voltage1 VESD Diode Capacitance1 Diode Capacitance1 1 C CI/O-I/O Parameter is guaranteed by design and/or device characterization. SP3004 Lead-Free/Green Series 74 Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND 0 Capacitance vs. Bias Voltage 1.50 1.40 1.30 I/O Capacitance (pF) Insertion Loss [dB] -5 1.20 1.10 1.00 0.90 0.80 VCC = 3.3V VCC = Float -10 -15 VCC = 5V 0.70 0.60 -20 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 0.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency [Hz] I/O DC Bias (V) Capacitance vs. Frequency 2E-12 1.8E-12 1.6E-12 1.4E-12 Capacitance [F] 1.2E-12 1E-12 8E-13 6E-13 4E-13 2E-13 0 Frequency [Hz] ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 75 Revised: August 19, 2010 SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 1.E+06 1.E+07 1.E+08 1.E+09 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D26 5 4 SP300x-04 1 2 3 D2+ Gnd D2- D1+ D1HDMI or DVI Interface IC D0+ D06 5 4 SP300x-04 1 2 3 D1+ Gnd D1HDMI or DVI Connector D0+ Gnd D0- Clk+ ClkGnd Clk+ Gnd Clk- HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed SP3004 Lead-Free/Green Series 76 Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SOT563 D 6 5 2 e B 4 3 A L Package Pins Solder Pad Layout A Millimeters Min 0.50 0.17 0.08 1.50 1.10 0.10 1.50 B c D E e L HE SOT 563 6 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067 Max 0.60 0.27 0.18 1.70 1.30 0.30 1.70 E HE c 0.50 BSC 0.020 BSC Part Numbering System Product Characteristics Lead Plating Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 SP 3004 -04 X T G Silicon Protection Array Series Number of Channels -04 = 4 channel G= Green T= Tape & Reel Package X = SOT563, 5000 quantity Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Part Marking System GX 4 GX4 Product Series G = SP3004 series (varies) 1. All dimensions are in millimeters 2. Dimensions include solder plating. Number of Channels 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Assembly Site Ordering Information Part Number SP3004-04XTG Package SOT563 Marking GX4 Min. Order Qty. 5000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 77 Revised: August 19, 2010 SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 3. Dimensions are exclusive of mold flash & metal burr. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - SOT563 Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 0.45 3.90 7 .70 3.90 1.73 1.73 0.64 0.22 max Max 1.85 3.55 2.05 1.60 0.55 4.10 8.10 4.10 1.83 1.83 0.74 Min 0.065 0.135 0.077 0.055 0.017 0.154 0.303 0.153 0.068 0.068 0.025 Inches Max 0.073 0.139 0.081 0.063 0.021 0.161 0.318 0.161 0.072 0.072 0.029 40.0+/- 0.20 1.574+/-0.008 0.009 max SP3004 Lead-Free/Green Series 78 Revised: August 19, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.