SP3010

SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection HF RoHS Pb GREEN SP3010 Lead-Free/Green Series Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout 6 7 8 9 10 Features ±8kV contact, ±15kV air (5/50ns) P package saves board space 5 4 3 2 1 =8/20μs) *Pins 6, 7 9, 10 are not internally connected but should be connected to the trace. , Functional Block Diagram Applications Pin 1 Pin 2 Pin 4 Pin 5 GND (Pins 3,8) Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP3010 Lead-Free/Green Series ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 67 Revised: February 25, 2010 Lead-Free/Green SP3010 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Absolute Maximum Ratings Symbol IPP T T Storage Temperature Peak Current (tp=8/20μs) Parameter Value 3.0 -40 to 85 -60 to 150 °C °C Units CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol V I Clamp Voltage1 VC V IPP IPP p p Test Conditions I Min Typ Max 6.0 Units V 0.1 10.8 12.3 1.5 ±8 ±15 0.45 0.5 V V Ω kV kV (VC2 - VC1) / (IPP2 - IPP1) 1 VESD C IEC61000-4-2 (Contact) Diode Capacitance 1 1 Parameter is guaranteed by design and/or device characterization. SP3010 Lead-Free/Green Series 68 Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Capacitance vs. Bias Voltage 0.6 Insertion Loss (S21) I/O to GND 0 0.5 -5 I/O Capacitance (pF) 0.4 Attenuation (dB) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -10 0.3 -15 0.2 -20 0.1 -25 0.0 -30 10 100 1000 10000 I/O Bias Voltage (V) Frequency (MHz) Clamping Voltage vs. IPP 16.0 14.0 12.0 Pulse Waveform 110% 100% 90% Clamp Voltage (VC) 80% 70% 60% 10.0 8.0 6.0 4.0 2.0 0.0 1.0 1.5 2.0 2.5 3.0 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Peak Pulse Current-IPP (A) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 69 Revised: February 25, 2010 SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel Package UDFN-10 (2.5x1.0mm) SP 3010 – 0x U T G Silicon Protection Array Series Number of Channels -04 = 4 Channel Lead Material Lead Coplanarity Subsitute Material Body Material Flammability 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. QH 4 Number of Product Series Channels Q = SP3010 Assembly Site 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking QH4 Min. Order Qty. 3000 SP3010 Lead-Free/Green Series 70 Revised: February 25, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-10 P0 Package uDFN-10 (2.5x1.0x0.5mm) Millimeters 1.30 +/- 0.10 2.83 +/- 0.10 Ø 1.50 + 0.10 Ø 1.00 + 0.25 1.75 +/- 0.10 3.50 +/- 0.05 0.65 +/- 0.10 4.00 +/- 0.10 4.00 +/- 0.10 2.00 +/- 0.05 0.254 +/- 0.02 8.00 + 0.30 /- 0.10 P1 P2 T D Symbol A0 B0 D0 0 E W D1 E F K0 F B0 D1 A0 5º Max 5º Max P0 P1 P2 T W Package Dimensions - uDFN-10 (2.5x1.0x0.5mm) Top View D E A Symbol A A1 A3 Min 0.48 0.00 0.15 0.35 2.40 0.90 0.30 uDFN-10 (2.5x1.0x0.5mm) Millimeters Nom 0.515 -0.20 0.40 2.50 1.00 0.50 BSC 0.365 0.43 0.012 Max 0.55 0.05 0.25 0.45 2.60 1.10 Min 0.019 0.000 0.006 0.014 0.094 0.035 0.008 0.016 0.098 0.039 0.020 BSC 0.014 0.016 Inches Nom 0.020 Max 0.021 0.022 0.012 0.018 0.043 K0 B b b1 D E e Side View 0.05 C Seating Plane C A1 A3 A b1 b 0.05 C L 0.10 M C A B 0.05 M C Bottom View R0.125 L 2xR0.075mm (7x) e Soldering Pad Layout Dimensions Soldering Pad Layout P1 P Y Z (C) G (Y1) Inch C G P P1 X X1 Y (0.034) 0.008 0.020 0.039 0.008 0.016 0.027 (0.061) 0.061 Millimeter (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55 X X1 Y1 Z ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 71 Revised: February 25, 2010 SP3010 Lead-Free/Green Series Lead-Free/Green SP3010 0.102