SP3010_11

TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series SP3010 Series 0.45pF Rail Clamp Array Description RoHS Pb GREEN The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout 6 7 8 9 10 Features ±8kV contact, ±15kV air (5/50ns) 3A (tP=8/20μs) 0.45pF (TYP) per I/O 0.1μA (TYP) at 5V package saves board space 5 4 3 2 1 *Pins 6, 7 9, 10 are not internally connected but should be connected to the trace. , Functional Block Diagram Applications Pin 1 Pin 2 Pin 4 Pin 5 GND (Pins 3,8) Application Example HDMI Port HDMI Chipset D2+ D2D1+ D1D0+ D0CLK+ CLK- Ground SP3010-04 Outside World Ground Ground SP3010-04 Ground * Package is shown as transparent Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Case Ground Signal Ground ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 105 Revision: April 14, 2011 SP3010 Series SP3010 TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Absolute Maximum Ratings Symbol IPP TOP TSTOR Parameter Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Value 3.0 -55 to 125 -60 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Reverse Leakage Current Clamp Voltage1 Dynamic Resistance ESD Withstand Voltage1 Diode Capacitance1 Symbol VRWM ILEAK VC RDYN VESD CI/O-GND Test Conditions IR ≤ 1μA VR=5V, Any I/O to GND IPP=1A, tp=8/20μs, Fwd IPP=2A, tp=8/20μs, Fwd (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V ±8 ±15 0.45 0.1 10.8 12.3 1.5 Min Typ Max 6.0 0.5 Units V μA V V Ω kV kV pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage 0.6 Insertion Loss (S21) I/O to GND 0 0. 5 -5 I/O Capacitance (pF) 0.4 Attenuation (dB) 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 5 5.0 -10 0.3 -15 0.2 -20 0.1 -25 0.0 -30 10 100 1000 10000 I/O Bias Voltage (V) Frequency (MHz) Clamping Voltage vs. IPP 16.0 14.0 12.0 Pulse Waveform 110% 100% 90% Clamp Voltage (VC) 80% 70% Percent of IPP 10.0 8.0 6.0 4.0 60% 50% 40% 30% 20% 2.0 0.0 1.0 1.5 2.0 2.5 3.0 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Peak Pulse Current-IPP (A) Time (μs) SP3010 Series 106 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly TP Temperature tP Ramp-up Ramp-up Critical Zone Critical Zone TL to TP 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Ramp-do Ramp-down Preheat Preheat TS(min) tS 25 time to peak temperature Time Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel Package UDFN-10 (2.5x1.0mm) SP 3010 – 0x U T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels -04 = 4 Channel Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. QH 4 Number of Product Series Channels Q = SP3010 Assembly Site 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number SP3010-04UTG Package uDFN-10 Marking QH4 Min. Order Qty. 3000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 107 Revision: April 14, 2011 SP3010 Series SP3010 TL TS(max) tL TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3010 Series Embossed Carrier Tape & Reel Specification — UDFN-10 P0 Package uDFN-10 (2.5x1.0x0.5mm) Millimeters 1.30 +/- 0.10 2.83 +/- 0.10 Ø 1.50 + 0.10 Ø 1.00 + 0.25 1.75 +/- 0.10 3.50 +/- 0.05 0.65 +/- 0.10 4.00 +/- 0.10 4.00 +/- 0.10 2.00 +/- 0.05 0.254 +/- 0.02 8.00 + 0.30 /- 0.10 P1 P2 T D Symbol A0 B0 D0 0 E W D1 E F K0 F B0 D1 A0 5º Max 5º Max P0 P1 P2 T W Package Dimensions — uDFN-10 (2.5x1.0x0.5mm) uDFN-10 (2.5x1.0x0.5mm) K0 Top View D A Symbol Min A 0.48 0.00 0.15 0.35 2.40 0.90 0.30 A1 A3 b b1 D E e L Millimeters Nom 0.515 -0.125 Ref 0.20 0.40 2.50 1.00 0.50 BSC 0.365 0.43 0.012 0.25 0.45 2.60 1.10 0.006 0.014 0.094 0.035 Max 0.55 0.05 Min 0.019 0.000 Inches Nom 0.020 0.005 Ref 0.008 0.016 0.098 0.039 0.020 BSC 0.014 0.016 0.012 0.018 0.102 0.043 Max 0.021 0.022 E B Side View 0.05 C Seating Plane C A1 A3 A b1 b 0.05 C Soldering Pad Layout Dimensions Inch C G P P1 X (0.034) 0.008 0.020 0.039 0.008 0.016 0.027 (0.061) 0.061 Millimeter (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55 Recomended Soldering Pad Layout P1 P Y Z (C) G (Y1) 0.10 M C A B 0.05 M C Bottom View R0.125 X1 Y Y1 Z X X1 L 2xR0.075mm (7x) e Alternative Soldering Pad Layout P1 P Y Z (C) G (Y1) X X1 SP3010 Series 108 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.