SP3011-06UTG

SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection HF RoHS Pb GREEN SP3011 Lead-Free/Green Series Description The SP3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. It’s extremely low loading capacitance makes it ideal for protecting any high-speed signal pins. Pinout Features contact, ±15kV air (5/50ns) package saves board space (TYP) per I/O *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the PCB trace. Functional Block Diagram Applications Pin 11 Pin 12 Pin 13 Pin 14 Pin 8 Pin 9 GND (Pin 10) Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP3011 Lead-Free/Green Series ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 85 Revised: May 10, 2010 Lead-Free/Green SP3011 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Absolute Maximum Ratings Symbol IPP TOP T Peak Current (tp Operating Temperature Storage Temperature Parameter Value 3.0 -40 to 85 -60 to 150 °C °C Units CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol V I Clamp Voltage1 VC V IPP IPP p p Test Conditions I Min Typ Max 6.0 Units V 0.1 11.0 12.5 1.5 ±8 ±15 0.4 0.5 V V Ω kV kV (VC2-VC1) / (IPP2-IPP1) 1 VESD C IEC61000-4-2 (Contact) Diode Capacitance 1 1 Parameter is guaranteed by design and/or device characterization. SP3011 Lead-Free/Green Series 86 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Capacitance vs. Bias Voltage 0.5 Insertion Loss (S21) I/O to GND 0 0.4 -5 Capacitance (pF) Attenuation (dB) -10 0.3 -15 0.2 -20 0.1 -25 0.0 0.0 -30 1.0 2.0 3.0 4.0 5.0 10 100 1000 10000 Bias Voltage (V) Frequency (MHz) Clamping Voltage vs. IPP 16.0 14.0 12.0 Pulse Waveform 110% 100% 90% 80% 70% 60% Clamp Voltage (VC) 10.0 8.0 6.0 4.0 50% 40% 30% 20% 2.0 0.0 1.0 1.5 2.0 2.5 3.0 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Peak Pulse Current - IPP (A) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 87 Revised: May 10, 2010 SP3011 Lead-Free/Green Series Lead-Free/Green SP3011 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Application Example USB Port VBUS USB Controller SSTX+ Outside World SSTXSSRX+ SSRXGND D+ DIC SP3011-06UTG Signal GND Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 260°C SP3011 Lead-Free/Green Series 88 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Part Numbering System Product Characteristics Lead Plating SP 3011 – 06 U T G Silicon Protection Array Series Number of Channels -06 = 6 Channels G= Green T= Tape & Reel Package uDFN-14 (3.5x1.35mm) Lead Material Lead Coplanarity Subsitute Material Body Material Flammability UL94-V-0 0.0004 inches (0.102mm) Silicon Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. RH6 Number of Product Series Channels R = SP3011 Assembly Site 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. 3000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 89 Revised: May 10, 2010 SP3011 Lead-Free/Green Series Lead-Free/Green SP3011 SPA™ Silicon Protection Array Products Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection Embossed Carrier Tape & Reel Specification – uDFN-14 P1 P2 P0 D0 E Symbol A0 B0 D0 F Millimeters 1.58 +/- 0.10 3.73 +/- 0.10 0.60 + 0.05 Ø 0.60 + 0.05 1.75 +/- 0.10 5.50 +/- 0.05 0.68 +/- 0.10 2.00 +/- 0.05 4.00 +/- 0.10 4.00 +/- 0.10 0.28 +/- 0.02 12.00 + 0.30 /- 0.10 D1 E F K0 P0 P1 P2 T W W D1 T A0 K0 B0 Package Dimensions - uDFN-14 (3.5x1.35x0.5mm) Top View D E A A Symbol uDFN-14 (3.5x1.35x0.5mm) Millimeters Min 0.45 0.00 0.15 3.40 1.25 0.25 Nom 0.50 0.02 0.20 3.50 1.35 0.500 BSC 0.30 0.35 0.010 Max 0.55 0.05 0.25 3.60 1.45 Min 0.018 0.000 0.006 0.134 0.050 Inches Nom 0.020 0.001 0.008 0.138 0.054 0.020 BSC 0.012 0.014 Max 0.022 0.002 0.012 0.142 0.058 - PIN 1 Index Area 1234 Side View A1 B A2 b D D2 E E1 e L Seating Plane A C b A1 A2 Bottom View Pin 1 Identification Chamfer 0.10X45º exact. SP3011 Lead-Free/Green Series 90 Revised: May 10, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.