TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
SP4061 Series 2.5V 20A Rail Clamp Array
Description
RoHS
Pb GREEN
The SP4061 integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. The low loading capacitance makes the SP4061 ideal for protecting high-speed signal pins.
Pinout
1 3 5
Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • EFT, IEC61000-4-4, 40A (tp=5/50ns) • Lightning, IEC61000-4-5, 20A (tp=8/20µs)
7
• Low capacitance of 3.5pF (TYP) per I/O • Low leakage current of 1µA (MAX) at 2.5V
GND
9
Functional Block Diagram
Applications • 10/100/1000 Ethernet Interfaces • VoIP Phones • Set Top Boxes • PBX Systems
9
7 5
• Customer Premise Equipment (CPE) Application Example
RJ-45 Connector J1
*Package is shown as transparent
Ethernet PHY Tx+
1
GND
3
SP4061 PHY
Tx-
Rx+ J8
Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
Rx-
SP4061 Series
180
Revision: September 22, 2011
©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Absolute Maximum Ratings
Symbol IPP PPK TOP TSTOR Parameter Peak Current (tp=8/20μs) Peak Pulse Power (tp=8/20µs) Operating Temperature Storage Temperature Value 20.0 300 -40 to 85 -50 to 150 Units A W ºC °C
Thermal Information
Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) Rating -65 to 150 150 260 Units °C °C °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter Reverse Standoff Voltage Snap Back Voltage Reverse Leakage Current Symbol VRWM VSB ILEAK ISB=50mA VR=2.5V, I/O to GND IPP=1A, tp=8/20µs, Fwd Clamp Voltage1 VC IPP=5A, tp=8/20µs, Fwd IPP=10A, tp=8/20µs, Fwd IPP=20A, tp=8/20µs, Fwd Dynamic Resistance ESD Withstand Voltage1 Diode Capacitance
1 1
Test Conditions
Min 2.0
Typ
Max 2.5
Units V V
0.5
1.0 5.0 6.3 8.0 11.5
µA V V V V Ω kV kV
RDYN VESD CI/O-GND CI/O-I/O
(VC2-VC1)/(IPP2-IPP1) IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Reverse Bias=0V ±30 ±30
0.35
3.5 2.0
5.0
pF pF
Diode Capacitance
Note: 1. Parameter is guaranteed by design and/or device characterization.
Pulse Waveform
110% 100% 90% 80%
Clamping Voltage vs. IPP
12.0
10.0
Percent of IPP
70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0
Clamp Voltage (VC)
8.0
6.0
4.0
2.0
0.0 0 5 10 15 20
Time ( s)
Peak Pulse Current-IPP (A)
©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.
181
Revision: September 22, 2011
SP4061 Series
SP4061
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Capacitance vs. Bias
5.0
Ordering Information
Part Number SP4061-04UTG Package µDFN-10 Marking TH4 Min. Order Qty. 3000
4.0
Capacitance (pF)
3.0
2.0
1.0
0.0 0.0 0.5 1.0 1.5 2.0 2.5
DC Bias (V)
Soldering Parameters
Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb – Free assembly
Temperature
TP TL TS(max) TS(min)
Ramp-up Ramp-up
tP
Critical Zone Critical Zone TL to TP
150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 260+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C
tL
Ramp-do Ramp-down Preheat Preheat
tS
time to peak temperature
25
Time
Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed
Part Numbering System
SP 4061 - 04 U T G
Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels G= Green T= Tape & Reel Package U= µDFN-10
Product Characteristics
Lead Plating Lead Material Lead Coplanarity Substitute Material Body Material Flammability
Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. SP4061 Series
Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL 94 V-0
Part Marking System
TH4
Number of Product Series Channels T = SP4061 Assembly Site
182
Revision: September 22, 2011
©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Package Dimensions — µDFN-10
Top View
D E A
Symbol A A3 b D D2 E 0.17 2.50 2.10 2.50 1.21 0.35 Min 0.45
µDFN-10 (2.6x2.6mm) Millimeters Nom 0.50 0.130 Ref 0.22 2.60 2.15 2.60 1.26 0.50 BSC 0.40 0.45 0.014 0.27 2.70 2.20 2.70 1.31 0.006 0.097 0.081 0.097 0.046 Max 0.55 Min 0.018 Inches Nom 0.020 0.005 Ref 0.008 0.101 0.083 0.101 0.049 0.020 BSC 0.016 0.018 0.010 0.105 0.085 0.105 0.051 Max 0.022
B
0.10 C Seating Plane
C
E2 e L
Side View
A3 A 0.05 C b
Recommended Solder Pads µDFN-10L 2.6x2.6mm
0.10 M C B A
B
Bottom View
Z
G
F
C
D2
2X C
Y P X
Dimension
E2
Symbol B C F G
Millimeters 2.30 2.20 1.41 1.65 0.50 0.37 0.55 2.75
Inches 0.091 0.087 0.056 0.065 0.020 0.015 0.022 0.108
e
P X Y Z
Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm)
P0 P1 P2 D0 E A0 F W K0 T 5º MAX
Reel Size:7 inches
5º MAX
Symbol A0 B0 D0 D1 E F K0 P0 P1 P2 T W
Millimeters 2.82 +/- 0.05 2.82 +/- 0.05 Ø1.50 + 0.10 Ø 0.50 + 0.05 1.75 +/- 0.10 3.50 +/- 0.05 0.76 +/- 0.05 4.00 +/- 0.10 4.00 +/- 0.10 2.00 +/- 0.05 0.25 +/- 0.02 8.00 + 0.30 /- 0.10
D1
B0
Pin 1 Location
User Feeding Direction
©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.
183
Revision: September 22, 2011
SP4061 Series
SP4061
很抱歉,暂时无法提供与“SP4061”相匹配的价格&库存,您可以联系我们找货
免费人工找货